JPS6143879B2 - - Google Patents
Info
- Publication number
- JPS6143879B2 JPS6143879B2 JP52095308A JP9530877A JPS6143879B2 JP S6143879 B2 JPS6143879 B2 JP S6143879B2 JP 52095308 A JP52095308 A JP 52095308A JP 9530877 A JP9530877 A JP 9530877A JP S6143879 B2 JPS6143879 B2 JP S6143879B2
- Authority
- JP
- Japan
- Prior art keywords
- hole
- forming
- holes
- conductive layer
- etching
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
- 238000000034 method Methods 0.000 claims description 19
- 238000005530 etching Methods 0.000 claims description 18
- 238000004519 manufacturing process Methods 0.000 claims description 7
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 11
- 238000005553 drilling Methods 0.000 description 10
- 238000007796 conventional method Methods 0.000 description 9
- 229910052802 copper Inorganic materials 0.000 description 9
- 239000010949 copper Substances 0.000 description 9
- 238000007747 plating Methods 0.000 description 7
- 239000000463 material Substances 0.000 description 6
- 239000011889 copper foil Substances 0.000 description 2
- 230000015572 biosynthetic process Effects 0.000 description 1
- 238000005520 cutting process Methods 0.000 description 1
- 230000007547 defect Effects 0.000 description 1
- WABPQHHGFIMREM-UHFFFAOYSA-N lead(0) Chemical compound [Pb] WABPQHHGFIMREM-UHFFFAOYSA-N 0.000 description 1
- 239000007788 liquid Substances 0.000 description 1
- 229920002120 photoresistant polymer Polymers 0.000 description 1
- 238000002360 preparation method Methods 0.000 description 1
- 238000007639 printing Methods 0.000 description 1
- 238000010019 resist printing Methods 0.000 description 1
- 230000000007 visual effect Effects 0.000 description 1
Landscapes
- Printing Elements For Providing Electric Connections Between Printed Circuits (AREA)
- Manufacturing Of Printed Circuit Boards (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP9530877A JPS5429051A (en) | 1977-08-08 | 1977-08-08 | Method of making throughhhole printed wire board |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP9530877A JPS5429051A (en) | 1977-08-08 | 1977-08-08 | Method of making throughhhole printed wire board |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS5429051A JPS5429051A (en) | 1979-03-03 |
| JPS6143879B2 true JPS6143879B2 (enrdf_load_stackoverflow) | 1986-09-30 |
Family
ID=14134122
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP9530877A Granted JPS5429051A (en) | 1977-08-08 | 1977-08-08 | Method of making throughhhole printed wire board |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS5429051A (enrdf_load_stackoverflow) |
Families Citing this family (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS57170595A (en) * | 1981-04-14 | 1982-10-20 | Fujitsu Ltd | Method of producing printed circuit board |
| JPS5892297A (ja) * | 1981-11-27 | 1983-06-01 | 富士通株式会社 | 金属芯入り印刷配線板の製造方法 |
| JPS6295893A (ja) * | 1985-10-23 | 1987-05-02 | 株式会社日立製作所 | プリント板の製造方法 |
| JP2590100B2 (ja) * | 1987-05-12 | 1997-03-12 | 株式会社東芝 | 衛星通信システム |
| JP2706687B2 (ja) * | 1987-05-21 | 1998-01-28 | 株式会社東芝 | 衛星通信システム |
| EP0430842A3 (en) * | 1989-11-27 | 1991-07-17 | International Business Machines Corporation | Apparatus and method for reworking printed wire circuit boards |
| JP4010684B2 (ja) * | 1998-12-03 | 2007-11-21 | 日本メクトロン株式会社 | 回路基板の製造法 |
-
1977
- 1977-08-08 JP JP9530877A patent/JPS5429051A/ja active Granted
Non-Patent Citations (1)
| Title |
|---|
| ELECTRONIC PACKAGING AND PRODUCTION=1976M7 * |
Also Published As
| Publication number | Publication date |
|---|---|
| JPS5429051A (en) | 1979-03-03 |
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