JPS6141230Y2 - - Google Patents

Info

Publication number
JPS6141230Y2
JPS6141230Y2 JP1980055568U JP5556880U JPS6141230Y2 JP S6141230 Y2 JPS6141230 Y2 JP S6141230Y2 JP 1980055568 U JP1980055568 U JP 1980055568U JP 5556880 U JP5556880 U JP 5556880U JP S6141230 Y2 JPS6141230 Y2 JP S6141230Y2
Authority
JP
Japan
Prior art keywords
needle
bonding
package
bonding pad
semiconductor device
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
JP1980055568U
Other languages
English (en)
Japanese (ja)
Other versions
JPS56157745U (enExample
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP1980055568U priority Critical patent/JPS6141230Y2/ja
Publication of JPS56157745U publication Critical patent/JPS56157745U/ja
Application granted granted Critical
Publication of JPS6141230Y2 publication Critical patent/JPS6141230Y2/ja
Expired legal-status Critical Current

Links

Classifications

    • H10W72/90—
    • H10W70/60—
    • H10W70/682—
    • H10W70/685—
    • H10W72/0711—
    • H10W72/07141—
    • H10W72/075—
    • H10W72/07521—
    • H10W72/07551—
    • H10W72/50—
    • H10W72/536—
    • H10W72/5363—
    • H10W72/5449—
    • H10W72/59—
    • H10W72/884—
    • H10W72/932—
    • H10W90/754—

Landscapes

  • Wire Bonding (AREA)
JP1980055568U 1980-04-23 1980-04-23 Expired JPS6141230Y2 (enExample)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP1980055568U JPS6141230Y2 (enExample) 1980-04-23 1980-04-23

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP1980055568U JPS6141230Y2 (enExample) 1980-04-23 1980-04-23

Publications (2)

Publication Number Publication Date
JPS56157745U JPS56157745U (enExample) 1981-11-25
JPS6141230Y2 true JPS6141230Y2 (enExample) 1986-11-25

Family

ID=29650220

Family Applications (1)

Application Number Title Priority Date Filing Date
JP1980055568U Expired JPS6141230Y2 (enExample) 1980-04-23 1980-04-23

Country Status (1)

Country Link
JP (1) JPS6141230Y2 (enExample)

Also Published As

Publication number Publication date
JPS56157745U (enExample) 1981-11-25

Similar Documents

Publication Publication Date Title
US5872405A (en) Laser wire bonding for wire embedded dielectrics to integrated circuits
CN100407377C (zh) 半导体基板的切断方法
US4914269A (en) Method of sealing a ceramic lid on a ceramic semiconductor package with a high-power laser
JP2813507B2 (ja) ボンディング方法およびボンディング装置
US5091770A (en) Semiconductor device having a ceramic package
JPS6030102B2 (ja) 半導体装置の製法
JPS6141230Y2 (enExample)
JPH01211911A (ja) エネルギー・ビームを用いたアニール装置
JP2705132B2 (ja) 配線形成方法および装置
JPH05109808A (ja) ワイヤボンデイング方法およびその装置
JP3676995B2 (ja) バンプボンディング方法および装置
JPS56165333A (en) Mounting method for electronic parts
JPS6144452Y2 (enExample)
JPS5889831A (ja) ワイヤボンデイング方法および装置
JPS6153737A (ja) 電子装置の組立法及び組立装置
JPH0951162A (ja) 電子部品搭載装置
JPS62210633A (ja) ワイヤボンデイング装置
JPS60247487A (ja) ワイヤボンデイング装置
JPS61101043A (ja) ワイヤボンデイング装置
JPS58159340A (ja) ワイヤボンデイング方法
JPS6248033A (ja) ワイヤボンデイング方法
JPH02184050A (ja) パッケージおよびそれを用いた集積回路装置ならびに集積回路装置の製造方法
JPH01257341A (ja) ワイヤボンディング装置
JPS6120138B2 (enExample)
JPS60111767A (ja) レ−ザ半田付け方法