JPS6144452Y2 - - Google Patents
Info
- Publication number
- JPS6144452Y2 JPS6144452Y2 JP1980055566U JP5556680U JPS6144452Y2 JP S6144452 Y2 JPS6144452 Y2 JP S6144452Y2 JP 1980055566 U JP1980055566 U JP 1980055566U JP 5556680 U JP5556680 U JP 5556680U JP S6144452 Y2 JPS6144452 Y2 JP S6144452Y2
- Authority
- JP
- Japan
- Prior art keywords
- bonding pad
- semiconductor device
- package
- metal
- grain size
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
Classifications
-
- H10W72/90—
-
- H10W70/60—
-
- H10W72/07551—
-
- H10W72/50—
-
- H10W72/5363—
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- H10W72/5449—
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- H10W72/59—
-
- H10W72/884—
-
- H10W72/932—
-
- H10W90/754—
Landscapes
- Wire Bonding (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1980055566U JPS6144452Y2 (enExample) | 1980-04-23 | 1980-04-23 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1980055566U JPS6144452Y2 (enExample) | 1980-04-23 | 1980-04-23 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS56157743U JPS56157743U (enExample) | 1981-11-25 |
| JPS6144452Y2 true JPS6144452Y2 (enExample) | 1986-12-15 |
Family
ID=29650218
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1980055566U Expired JPS6144452Y2 (enExample) | 1980-04-23 | 1980-04-23 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS6144452Y2 (enExample) |
-
1980
- 1980-04-23 JP JP1980055566U patent/JPS6144452Y2/ja not_active Expired
Also Published As
| Publication number | Publication date |
|---|---|
| JPS56157743U (enExample) | 1981-11-25 |
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