JPS6139550A - 半導体ヒユ−ズ素子 - Google Patents

半導体ヒユ−ズ素子

Info

Publication number
JPS6139550A
JPS6139550A JP16045684A JP16045684A JPS6139550A JP S6139550 A JPS6139550 A JP S6139550A JP 16045684 A JP16045684 A JP 16045684A JP 16045684 A JP16045684 A JP 16045684A JP S6139550 A JPS6139550 A JP S6139550A
Authority
JP
Japan
Prior art keywords
insulating film
connection hole
polycrystalline silicon
interlayer insulating
fuse element
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP16045684A
Other languages
English (en)
Japanese (ja)
Other versions
JPH0527983B2 (enExample
Inventor
Hisao Ogawa
小川　久夫
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
NEC Corp
Original Assignee
NEC Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by NEC Corp filed Critical NEC Corp
Priority to JP16045684A priority Critical patent/JPS6139550A/ja
Publication of JPS6139550A publication Critical patent/JPS6139550A/ja
Publication of JPH0527983B2 publication Critical patent/JPH0527983B2/ja
Granted legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/70—Manufacture or treatment of devices consisting of a plurality of solid state components formed in or on a common substrate or of parts thereof; Manufacture of integrated circuit devices or of parts thereof
    • H01L21/71—Manufacture of specific parts of devices defined in group H01L21/70
    • H01L21/768—Applying interconnections to be used for carrying current between separate components within a device comprising conductors and dielectrics

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Design And Manufacture Of Integrated Circuits (AREA)
  • Semiconductor Memories (AREA)
JP16045684A 1984-07-31 1984-07-31 半導体ヒユ−ズ素子 Granted JPS6139550A (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP16045684A JPS6139550A (ja) 1984-07-31 1984-07-31 半導体ヒユ−ズ素子

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP16045684A JPS6139550A (ja) 1984-07-31 1984-07-31 半導体ヒユ−ズ素子

Publications (2)

Publication Number Publication Date
JPS6139550A true JPS6139550A (ja) 1986-02-25
JPH0527983B2 JPH0527983B2 (enExample) 1993-04-22

Family

ID=15715325

Family Applications (1)

Application Number Title Priority Date Filing Date
JP16045684A Granted JPS6139550A (ja) 1984-07-31 1984-07-31 半導体ヒユ−ズ素子

Country Status (1)

Country Link
JP (1) JPS6139550A (enExample)

Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6132551A (ja) * 1984-07-25 1986-02-15 Nec Corp 半導体ヒユ−ズ素子

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6132551A (ja) * 1984-07-25 1986-02-15 Nec Corp 半導体ヒユ−ズ素子

Also Published As

Publication number Publication date
JPH0527983B2 (enExample) 1993-04-22

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Legal Events

Date Code Title Description
EXPY Cancellation because of completion of term