JPS6134737U - 樹脂モ−ルド型半導体装置 - Google Patents

樹脂モ−ルド型半導体装置

Info

Publication number
JPS6134737U
JPS6134737U JP12033784U JP12033784U JPS6134737U JP S6134737 U JPS6134737 U JP S6134737U JP 12033784 U JP12033784 U JP 12033784U JP 12033784 U JP12033784 U JP 12033784U JP S6134737 U JPS6134737 U JP S6134737U
Authority
JP
Japan
Prior art keywords
semiconductor device
resin molded
molded semiconductor
substrate
semiconductor pellet
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP12033784U
Other languages
English (en)
Japanese (ja)
Other versions
JPH0222995Y2 (enrdf_load_stackoverflow
Inventor
浩一 今井
Original Assignee
関西日本電気株式会社
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 関西日本電気株式会社 filed Critical 関西日本電気株式会社
Priority to JP12033784U priority Critical patent/JPS6134737U/ja
Publication of JPS6134737U publication Critical patent/JPS6134737U/ja
Application granted granted Critical
Publication of JPH0222995Y2 publication Critical patent/JPH0222995Y2/ja
Granted legal-status Critical Current

Links

Landscapes

  • Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
JP12033784U 1984-08-03 1984-08-03 樹脂モ−ルド型半導体装置 Granted JPS6134737U (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP12033784U JPS6134737U (ja) 1984-08-03 1984-08-03 樹脂モ−ルド型半導体装置

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP12033784U JPS6134737U (ja) 1984-08-03 1984-08-03 樹脂モ−ルド型半導体装置

Publications (2)

Publication Number Publication Date
JPS6134737U true JPS6134737U (ja) 1986-03-03
JPH0222995Y2 JPH0222995Y2 (enrdf_load_stackoverflow) 1990-06-21

Family

ID=30679161

Family Applications (1)

Application Number Title Priority Date Filing Date
JP12033784U Granted JPS6134737U (ja) 1984-08-03 1984-08-03 樹脂モ−ルド型半導体装置

Country Status (1)

Country Link
JP (1) JPS6134737U (enrdf_load_stackoverflow)

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS4424916Y1 (enrdf_load_stackoverflow) * 1966-10-28 1969-10-20
JPS5429974A (en) * 1977-08-10 1979-03-06 Hitachi Ltd Semiconductor device of resin sealing type

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS4424916Y1 (enrdf_load_stackoverflow) * 1966-10-28 1969-10-20
JPS5429974A (en) * 1977-08-10 1979-03-06 Hitachi Ltd Semiconductor device of resin sealing type

Also Published As

Publication number Publication date
JPH0222995Y2 (enrdf_load_stackoverflow) 1990-06-21

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