JPS6130745B2 - - Google Patents
Info
- Publication number
- JPS6130745B2 JPS6130745B2 JP9077378A JP9077378A JPS6130745B2 JP S6130745 B2 JPS6130745 B2 JP S6130745B2 JP 9077378 A JP9077378 A JP 9077378A JP 9077378 A JP9077378 A JP 9077378A JP S6130745 B2 JPS6130745 B2 JP S6130745B2
- Authority
- JP
- Japan
- Prior art keywords
- circuit board
- terminal
- hybrid integrated
- terminal pins
- integrated circuit
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
Landscapes
- Combinations Of Printed Boards (AREA)
- Lead Frames For Integrated Circuits (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP9077378A JPS5518034A (en) | 1978-07-25 | 1978-07-25 | Method of fabricating hybrid integrated circuit |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP9077378A JPS5518034A (en) | 1978-07-25 | 1978-07-25 | Method of fabricating hybrid integrated circuit |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS5518034A JPS5518034A (en) | 1980-02-07 |
| JPS6130745B2 true JPS6130745B2 (cs) | 1986-07-15 |
Family
ID=14007915
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP9077378A Granted JPS5518034A (en) | 1978-07-25 | 1978-07-25 | Method of fabricating hybrid integrated circuit |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS5518034A (cs) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS6411446U (cs) * | 1987-07-09 | 1989-01-20 |
Families Citing this family (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS57190339A (en) * | 1981-05-19 | 1982-11-22 | Pioneer Electronic Corp | Manufacture of printed circuit board unit |
| JPS58147138A (ja) * | 1982-02-26 | 1983-09-01 | Hitachi Condenser Co Ltd | プリント配線板の製造方法 |
| JPS6364349A (ja) * | 1986-09-04 | 1988-03-22 | Sharp Corp | 半導体装置の製造方法 |
| JPWO2014021212A1 (ja) * | 2012-07-31 | 2016-07-21 | 株式会社村田製作所 | アクチュエータ装置の製造方法及びアクチュエータ装置 |
-
1978
- 1978-07-25 JP JP9077378A patent/JPS5518034A/ja active Granted
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS6411446U (cs) * | 1987-07-09 | 1989-01-20 |
Also Published As
| Publication number | Publication date |
|---|---|
| JPS5518034A (en) | 1980-02-07 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| JPH0411349Y2 (cs) | ||
| EP0893945B1 (en) | Printed board and manufacturing method therefor | |
| JPS6130745B2 (cs) | ||
| JPH11289141A (ja) | 回路基板及びその製造方法 | |
| JPH08203629A (ja) | プリント配線装置 | |
| JP2000208935A (ja) | プリント配線板製造方法およびプリント配線板ならびにそれらに使用される両面パタ―ン導通用部品 | |
| JPH0685425A (ja) | 電子部品搭載用基板 | |
| JPS617692A (ja) | 導体ピンの固着方法および導体ピン固着のプリント配線板 | |
| JP3959883B2 (ja) | 回路基板の接続構造 | |
| JPS62282456A (ja) | ハイブリッドicの製造方法 | |
| JP2606981B2 (ja) | 三次元実装プリント配線板及びその製造方法 | |
| JP2526170Y2 (ja) | 電子基板回路 | |
| JPH0319241Y2 (cs) | ||
| JPH01120856A (ja) | リードフレーム | |
| JPS6251502B2 (cs) | ||
| JPS5843241Y2 (ja) | 配線基板 | |
| JPH06164117A (ja) | コネクタ付き配線基板の製造方法 | |
| JPS5844602Y2 (ja) | プリント配線基板 | |
| JPH0661413A (ja) | ハイブリッドic用基板とこれを用いたハイブリッドicの製造方法 | |
| JPH0818267A (ja) | 電子回路モジュール | |
| JPH07297542A (ja) | フレキシブルプリント基板のハンダ接続方法 | |
| JPH0538772U (ja) | 電子部品の端子取付構造 | |
| JPH0633367U (ja) | 基板と端子との取付構造 | |
| JPH07263848A (ja) | プリント配線板 | |
| JPH09270486A (ja) | 電子部品 |