JPS6130740B2 - - Google Patents

Info

Publication number
JPS6130740B2
JPS6130740B2 JP53110669A JP11066978A JPS6130740B2 JP S6130740 B2 JPS6130740 B2 JP S6130740B2 JP 53110669 A JP53110669 A JP 53110669A JP 11066978 A JP11066978 A JP 11066978A JP S6130740 B2 JPS6130740 B2 JP S6130740B2
Authority
JP
Japan
Prior art keywords
substrate
semiconductor substrate
state imaging
solid
wafer
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
JP53110669A
Other languages
English (en)
Japanese (ja)
Other versions
JPS5538024A (en
Inventor
Okio Yoshida
Hiroo Takemura
Nozomi Harada
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Toshiba Corp
Original Assignee
Tokyo Shibaura Electric Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Tokyo Shibaura Electric Co Ltd filed Critical Tokyo Shibaura Electric Co Ltd
Priority to JP11066978A priority Critical patent/JPS5538024A/ja
Publication of JPS5538024A publication Critical patent/JPS5538024A/ja
Publication of JPS6130740B2 publication Critical patent/JPS6130740B2/ja
Granted legal-status Critical Current

Links

Landscapes

  • Solid State Image Pick-Up Elements (AREA)
  • Mechanical Treatment Of Semiconductor (AREA)
  • Dicing (AREA)
JP11066978A 1978-09-11 1978-09-11 Manufacturing of semiconductor device Granted JPS5538024A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP11066978A JPS5538024A (en) 1978-09-11 1978-09-11 Manufacturing of semiconductor device

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP11066978A JPS5538024A (en) 1978-09-11 1978-09-11 Manufacturing of semiconductor device

Publications (2)

Publication Number Publication Date
JPS5538024A JPS5538024A (en) 1980-03-17
JPS6130740B2 true JPS6130740B2 (enrdf_load_stackoverflow) 1986-07-15

Family

ID=14541452

Family Applications (1)

Application Number Title Priority Date Filing Date
JP11066978A Granted JPS5538024A (en) 1978-09-11 1978-09-11 Manufacturing of semiconductor device

Country Status (1)

Country Link
JP (1) JPS5538024A (enrdf_load_stackoverflow)

Families Citing this family (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
GB8803171D0 (en) * 1988-02-11 1988-03-09 English Electric Valve Co Ltd Imaging apparatus
SG126885A1 (en) * 2005-04-27 2006-11-29 Disco Corp Semiconductor wafer and processing method for same
JP4890206B2 (ja) 2006-11-22 2012-03-07 日本精工株式会社 ステアリング装置用締結部及びその製造方法
JP5155030B2 (ja) * 2008-06-13 2013-02-27 株式会社ディスコ 光デバイスウエーハの分割方法
JP5231136B2 (ja) * 2008-08-22 2013-07-10 株式会社ディスコ 光デバイスウエーハの加工方法
JP5279775B2 (ja) * 2010-08-25 2013-09-04 株式会社東芝 半導体装置の製造方法

Family Cites Families (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5348456A (en) * 1976-10-14 1978-05-01 Fujitsu Ltd Dicing method of semiconductor substrate

Also Published As

Publication number Publication date
JPS5538024A (en) 1980-03-17

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