JPS6130426B2 - - Google Patents
Info
- Publication number
- JPS6130426B2 JPS6130426B2 JP13049580A JP13049580A JPS6130426B2 JP S6130426 B2 JPS6130426 B2 JP S6130426B2 JP 13049580 A JP13049580 A JP 13049580A JP 13049580 A JP13049580 A JP 13049580A JP S6130426 B2 JPS6130426 B2 JP S6130426B2
- Authority
- JP
- Japan
- Prior art keywords
- resin
- heat sink
- lead
- semiconductor element
- sealed
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
Classifications
-
- H10W40/778—
-
- H10W72/07551—
-
- H10W72/50—
-
- H10W72/5449—
-
- H10W72/552—
-
- H10W74/00—
-
- H10W90/756—
Landscapes
- Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
- Lead Frames For Integrated Circuits (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP13049580A JPS5754355A (en) | 1980-09-19 | 1980-09-19 | Plastic molded type semiconductor device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP13049580A JPS5754355A (en) | 1980-09-19 | 1980-09-19 | Plastic molded type semiconductor device |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS5754355A JPS5754355A (en) | 1982-03-31 |
| JPS6130426B2 true JPS6130426B2 (enExample) | 1986-07-14 |
Family
ID=15035624
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP13049580A Granted JPS5754355A (en) | 1980-09-19 | 1980-09-19 | Plastic molded type semiconductor device |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS5754355A (enExample) |
Families Citing this family (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5784751U (enExample) * | 1980-11-12 | 1982-05-25 | ||
| JPS60183754A (ja) * | 1984-03-01 | 1985-09-19 | Toshiba Corp | 樹脂封止半導体装置 |
| JPS63197362A (ja) * | 1987-02-12 | 1988-08-16 | Toshiba Corp | ハイブリツド型半導体装置 |
-
1980
- 1980-09-19 JP JP13049580A patent/JPS5754355A/ja active Granted
Also Published As
| Publication number | Publication date |
|---|---|
| JPS5754355A (en) | 1982-03-31 |
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