JPS5754355A - Plastic molded type semiconductor device - Google Patents

Plastic molded type semiconductor device

Info

Publication number
JPS5754355A
JPS5754355A JP13049580A JP13049580A JPS5754355A JP S5754355 A JPS5754355 A JP S5754355A JP 13049580 A JP13049580 A JP 13049580A JP 13049580 A JP13049580 A JP 13049580A JP S5754355 A JPS5754355 A JP S5754355A
Authority
JP
Japan
Prior art keywords
heat radiating
radiating plate
resin
lead frame
groove
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP13049580A
Other languages
English (en)
Japanese (ja)
Other versions
JPS6130426B2 (enExample
Inventor
Yuzaburo Ogawa
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
NEC Corp
Original Assignee
NEC Corp
Nippon Electric Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by NEC Corp, Nippon Electric Co Ltd filed Critical NEC Corp
Priority to JP13049580A priority Critical patent/JPS5754355A/ja
Publication of JPS5754355A publication Critical patent/JPS5754355A/ja
Publication of JPS6130426B2 publication Critical patent/JPS6130426B2/ja
Granted legal-status Critical Current

Links

Classifications

    • H10W40/778—
    • H10W72/07551—
    • H10W72/50—
    • H10W72/5449—
    • H10W72/552—
    • H10W74/00—
    • H10W90/756—

Landscapes

  • Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
  • Lead Frames For Integrated Circuits (AREA)
JP13049580A 1980-09-19 1980-09-19 Plastic molded type semiconductor device Granted JPS5754355A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP13049580A JPS5754355A (en) 1980-09-19 1980-09-19 Plastic molded type semiconductor device

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP13049580A JPS5754355A (en) 1980-09-19 1980-09-19 Plastic molded type semiconductor device

Publications (2)

Publication Number Publication Date
JPS5754355A true JPS5754355A (en) 1982-03-31
JPS6130426B2 JPS6130426B2 (enExample) 1986-07-14

Family

ID=15035624

Family Applications (1)

Application Number Title Priority Date Filing Date
JP13049580A Granted JPS5754355A (en) 1980-09-19 1980-09-19 Plastic molded type semiconductor device

Country Status (1)

Country Link
JP (1) JPS5754355A (enExample)

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5784751U (enExample) * 1980-11-12 1982-05-25
JPS60183754A (ja) * 1984-03-01 1985-09-19 Toshiba Corp 樹脂封止半導体装置
JPS63197362A (ja) * 1987-02-12 1988-08-16 Toshiba Corp ハイブリツド型半導体装置

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5784751U (enExample) * 1980-11-12 1982-05-25
JPS60183754A (ja) * 1984-03-01 1985-09-19 Toshiba Corp 樹脂封止半導体装置
JPS63197362A (ja) * 1987-02-12 1988-08-16 Toshiba Corp ハイブリツド型半導体装置

Also Published As

Publication number Publication date
JPS6130426B2 (enExample) 1986-07-14

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