JPS6129140B2 - - Google Patents

Info

Publication number
JPS6129140B2
JPS6129140B2 JP58028232A JP2823283A JPS6129140B2 JP S6129140 B2 JPS6129140 B2 JP S6129140B2 JP 58028232 A JP58028232 A JP 58028232A JP 2823283 A JP2823283 A JP 2823283A JP S6129140 B2 JPS6129140 B2 JP S6129140B2
Authority
JP
Japan
Prior art keywords
group compound
compound semiconductor
substrate
gaas
film
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
JP58028232A
Other languages
English (en)
Japanese (ja)
Other versions
JPS58212139A (ja
Inventor
Junichi Nishizawa
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Individual
Original Assignee
Individual
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Individual filed Critical Individual
Priority to JP58028232A priority Critical patent/JPS58212139A/ja
Publication of JPS58212139A publication Critical patent/JPS58212139A/ja
Publication of JPS6129140B2 publication Critical patent/JPS6129140B2/ja
Granted legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/02104—Forming layers
    • H01L21/02107—Forming insulating materials on a substrate

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Formation Of Insulating Films (AREA)
  • Junction Field-Effect Transistors (AREA)
JP58028232A 1983-02-22 1983-02-22 ３−５族化合物半導体素子 Granted JPS58212139A (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP58028232A JPS58212139A (ja) 1983-02-22 1983-02-22 ３−５族化合物半導体素子

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP58028232A JPS58212139A (ja) 1983-02-22 1983-02-22 ３−５族化合物半導体素子

Related Parent Applications (1)

Application Number Title Priority Date Filing Date
JP13582174A Division JPS5161265A (en) 1974-11-25 1974-11-25 335 zokukagobutsuhandotaisoshi

Publications (2)

Publication Number Publication Date
JPS58212139A JPS58212139A (ja) 1983-12-09
JPS6129140B2 true JPS6129140B2 (enExample) 1986-07-04

Family

ID=12242845

Family Applications (1)

Application Number Title Priority Date Filing Date
JP58028232A Granted JPS58212139A (ja) 1983-02-22 1983-02-22 ３−５族化合物半導体素子

Country Status (1)

Country Link
JP (1) JPS58212139A (enExample)

Cited By (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6897565B2 (en) 2001-10-09 2005-05-24 Tessera, Inc. Stacked packages
US6977440B2 (en) 2001-10-09 2005-12-20 Tessera, Inc. Stacked packages
US7071547B2 (en) 2002-09-11 2006-07-04 Tessera, Inc. Assemblies having stacked semiconductor chips and methods of making same
US7335995B2 (en) 2001-10-09 2008-02-26 Tessera, Inc. Microelectronic assembly having array including passive elements and interconnects
US7545029B2 (en) 2006-08-18 2009-06-09 Tessera, Inc. Stack microelectronic assemblies

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2674759B2 (ja) * 1987-09-24 1997-11-12 日本電気株式会社 多層半導体ウェーハの製造方法

Cited By (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6897565B2 (en) 2001-10-09 2005-05-24 Tessera, Inc. Stacked packages
US6977440B2 (en) 2001-10-09 2005-12-20 Tessera, Inc. Stacked packages
US7335995B2 (en) 2001-10-09 2008-02-26 Tessera, Inc. Microelectronic assembly having array including passive elements and interconnects
US7071547B2 (en) 2002-09-11 2006-07-04 Tessera, Inc. Assemblies having stacked semiconductor chips and methods of making same
US7545029B2 (en) 2006-08-18 2009-06-09 Tessera, Inc. Stack microelectronic assemblies

Also Published As

Publication number Publication date
JPS58212139A (ja) 1983-12-09

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