JPS61281532A - 半導体洗浄液の濃度調整方法及びその装置 - Google Patents

半導体洗浄液の濃度調整方法及びその装置

Info

Publication number
JPS61281532A
JPS61281532A JP12244385A JP12244385A JPS61281532A JP S61281532 A JPS61281532 A JP S61281532A JP 12244385 A JP12244385 A JP 12244385A JP 12244385 A JP12244385 A JP 12244385A JP S61281532 A JPS61281532 A JP S61281532A
Authority
JP
Japan
Prior art keywords
concentration
ammonia
hydrogen peroxide
ultraviolet
cleaning liquid
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP12244385A
Other languages
English (en)
Japanese (ja)
Other versions
JPH0528490B2 (enExample
Inventor
Masaaki Harazono
正昭 原園
Shuichi Hanajima
花島　秀一
Seiichi Takei
武井　清一
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Hitachi Ltd
Original Assignee
Hitachi Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Hitachi Ltd filed Critical Hitachi Ltd
Priority to JP12244385A priority Critical patent/JPS61281532A/ja
Publication of JPS61281532A publication Critical patent/JPS61281532A/ja
Publication of JPH0528490B2 publication Critical patent/JPH0528490B2/ja
Granted legal-status Critical Current

Links

Landscapes

  • Cleaning By Liquid Or Steam (AREA)
  • Cleaning Or Drying Semiconductors (AREA)
JP12244385A 1985-06-07 1985-06-07 半導体洗浄液の濃度調整方法及びその装置 Granted JPS61281532A (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP12244385A JPS61281532A (ja) 1985-06-07 1985-06-07 半導体洗浄液の濃度調整方法及びその装置

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP12244385A JPS61281532A (ja) 1985-06-07 1985-06-07 半導体洗浄液の濃度調整方法及びその装置

Publications (2)

Publication Number Publication Date
JPS61281532A true JPS61281532A (ja) 1986-12-11
JPH0528490B2 JPH0528490B2 (enExample) 1993-04-26

Family

ID=14835972

Family Applications (1)

Application Number Title Priority Date Filing Date
JP12244385A Granted JPS61281532A (ja) 1985-06-07 1985-06-07 半導体洗浄液の濃度調整方法及びその装置

Country Status (1)

Country Link
JP (1) JPS61281532A (enExample)

Cited By (13)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH02722U (enExample) * 1988-06-10 1990-01-05
US5275184A (en) * 1990-10-19 1994-01-04 Dainippon Screen Mfg. Co., Ltd. Apparatus and system for treating surface of a wafer by dipping the same in a treatment solution and a gate device for chemical agent used in the apparatus and the system
JPH08136450A (ja) * 1994-11-14 1996-05-31 Nec Corp 薬液組成モニタ方法およびその装置
US5715173A (en) * 1994-06-27 1998-02-03 Dainippon Screen Mfg. Co., Ltd. Concentration controlling method and a substate treating apparatus utilizing same
US5881748A (en) * 1994-03-28 1999-03-16 Shin-Etsu Handotai Co. Ltd. Apparatus for rinsing wafers adhered with chemical liquid by use of purified water
US5896874A (en) * 1996-07-02 1999-04-27 Hirama Rika Kenkyujo Ltd. Apparatus for controlling resist stripping solution
DE19815039A1 (de) * 1998-03-02 1999-09-16 Mostafa Sabet Verfahren zum Wechseln eines in einem Behandlungsbecken enthaltenen Behandlungsmediums und Anlage zur Ausführung des Verfahrens
KR20000050397A (ko) * 1999-01-08 2000-08-05 윤종용 반도체 세정액 농도 제어장치 및 방법
US6158447A (en) * 1997-09-09 2000-12-12 Tokyo Electron Limited Cleaning method and cleaning equipment
US6214126B1 (en) 1993-11-15 2001-04-10 Matsushita Electric Industrial Co., Ltd. Method for cleaning a silicon substrate
US6415803B1 (en) * 1999-10-06 2002-07-09 Z Cap, L.L.C. Method and apparatus for semiconductor wafer cleaning with reuse of chemicals
JP2005230798A (ja) * 2004-01-22 2005-09-02 Sankyo Seiki Mfg Co Ltd 洗浄装置
US7214537B2 (en) 2001-10-08 2007-05-08 Advanced Technology Materials, Inc. Real-time component monitoring and replenishment system for multicomponent fluids

Cited By (14)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH02722U (enExample) * 1988-06-10 1990-01-05
US5275184A (en) * 1990-10-19 1994-01-04 Dainippon Screen Mfg. Co., Ltd. Apparatus and system for treating surface of a wafer by dipping the same in a treatment solution and a gate device for chemical agent used in the apparatus and the system
US6214126B1 (en) 1993-11-15 2001-04-10 Matsushita Electric Industrial Co., Ltd. Method for cleaning a silicon substrate
US5881748A (en) * 1994-03-28 1999-03-16 Shin-Etsu Handotai Co. Ltd. Apparatus for rinsing wafers adhered with chemical liquid by use of purified water
US5715173A (en) * 1994-06-27 1998-02-03 Dainippon Screen Mfg. Co., Ltd. Concentration controlling method and a substate treating apparatus utilizing same
JPH08136450A (ja) * 1994-11-14 1996-05-31 Nec Corp 薬液組成モニタ方法およびその装置
US5896874A (en) * 1996-07-02 1999-04-27 Hirama Rika Kenkyujo Ltd. Apparatus for controlling resist stripping solution
US6158447A (en) * 1997-09-09 2000-12-12 Tokyo Electron Limited Cleaning method and cleaning equipment
DE19815039A1 (de) * 1998-03-02 1999-09-16 Mostafa Sabet Verfahren zum Wechseln eines in einem Behandlungsbecken enthaltenen Behandlungsmediums und Anlage zur Ausführung des Verfahrens
KR20000050397A (ko) * 1999-01-08 2000-08-05 윤종용 반도체 세정액 농도 제어장치 및 방법
US6415803B1 (en) * 1999-10-06 2002-07-09 Z Cap, L.L.C. Method and apparatus for semiconductor wafer cleaning with reuse of chemicals
US7214537B2 (en) 2001-10-08 2007-05-08 Advanced Technology Materials, Inc. Real-time component monitoring and replenishment system for multicomponent fluids
EP1451413A4 (en) * 2001-10-08 2007-12-26 Advanced Tech Materials REAL-TIME COMPONENT MONITORING AND FILLING SYSTEM FOR MULTICOMPONENT SYSTEMS
JP2005230798A (ja) * 2004-01-22 2005-09-02 Sankyo Seiki Mfg Co Ltd 洗浄装置

Also Published As

Publication number Publication date
JPH0528490B2 (enExample) 1993-04-26

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