JPS61276979A - ニッケルめっき材料の製造法 - Google Patents

ニッケルめっき材料の製造法

Info

Publication number
JPS61276979A
JPS61276979A JP60115391A JP11539185A JPS61276979A JP S61276979 A JPS61276979 A JP S61276979A JP 60115391 A JP60115391 A JP 60115391A JP 11539185 A JP11539185 A JP 11539185A JP S61276979 A JPS61276979 A JP S61276979A
Authority
JP
Japan
Prior art keywords
plating
nickel
solution
reaction
nickel plating
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP60115391A
Other languages
English (en)
Japanese (ja)
Other versions
JPH0475316B2 (enExample
Inventor
Tokuzo Kanbe
神戸　徳蔵
Hiroshi Kawakami
浩 川上
Junichi Takeshita
竹下　淳一
Yaozo Kumagai
熊谷　八百三
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Nippon Chemical Industrial Co Ltd
National Institute of Advanced Industrial Science and Technology AIST
Original Assignee
Agency of Industrial Science and Technology
Nippon Chemical Industrial Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Agency of Industrial Science and Technology, Nippon Chemical Industrial Co Ltd filed Critical Agency of Industrial Science and Technology
Priority to JP60115391A priority Critical patent/JPS61276979A/ja
Publication of JPS61276979A publication Critical patent/JPS61276979A/ja
Publication of JPH0475316B2 publication Critical patent/JPH0475316B2/ja
Granted legal-status Critical Current

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
    • C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
    • C23C18/1601—Process or apparatus
    • C23C18/1633—Process of electroless plating
    • C23C18/1655—Process features
    • C23C18/1662—Use of incorporated material in the solution or dispersion, e.g. particles, whiskers, wires
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
    • C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
    • C23C18/31—Coating with metals
    • C23C18/32—Coating with nickel, cobalt or mixtures thereof with phosphorus or boron
    • C23C18/34—Coating with nickel, cobalt or mixtures thereof with phosphorus or boron using reducing agents
    • C23C18/36—Coating with nickel, cobalt or mixtures thereof with phosphorus or boron using reducing agents using hypophosphites

Landscapes

  • Chemical & Material Sciences (AREA)
  • General Chemical & Material Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Engineering & Computer Science (AREA)
  • Materials Engineering (AREA)
  • Mechanical Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Dispersion Chemistry (AREA)
  • Chemically Coating (AREA)
JP60115391A 1985-05-30 1985-05-30 ニッケルめっき材料の製造法 Granted JPS61276979A (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP60115391A JPS61276979A (ja) 1985-05-30 1985-05-30 ニッケルめっき材料の製造法

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP60115391A JPS61276979A (ja) 1985-05-30 1985-05-30 ニッケルめっき材料の製造法

Publications (2)

Publication Number Publication Date
JPS61276979A true JPS61276979A (ja) 1986-12-06
JPH0475316B2 JPH0475316B2 (enExample) 1992-11-30

Family

ID=14661385

Family Applications (1)

Application Number Title Priority Date Filing Date
JP60115391A Granted JPS61276979A (ja) 1985-05-30 1985-05-30 ニッケルめっき材料の製造法

Country Status (1)

Country Link
JP (1) JPS61276979A (enExample)

Cited By (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6421082A (en) * 1987-07-15 1989-01-24 Nippon Chemical Ind Production of powdery plated material
US5170009A (en) * 1990-03-22 1992-12-08 Canon Kabushiki Kaisha Electrically conductive covers and electrically conductive covers of electronic equipment
US5186802A (en) * 1990-03-22 1993-02-16 Canon Kabushiki Kaisha Electro-deposition coated member and process for producing it
US5234558A (en) * 1990-03-22 1993-08-10 Canon Kabushiki Kaisha Electrically conductive circuit member, method of manufacturing the same and electrically conductive paste
US5676812A (en) * 1990-03-24 1997-10-14 Canon Kabushiki Kaisha Electronic equipment with an adhesive member to intercept electromagnetic waves
JP2017508881A (ja) * 2014-01-15 2017-03-30 ナンジン デェァレイ サイエンス アンド テクノロジー カンパニー リミテッドＮａｎｊｉｎｇ Ｄｅｌｅｉ Ｓｃｉｅｎｃｅ ＆ Ｔｅｃｈｎｏｌｏｇｙ Ｃｏ．， Ｌｔｄ 化学ニッケルめっき液の処理方法

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS4841926A (enExample) * 1971-09-30 1973-06-19
JPS56119703A (en) * 1980-02-13 1981-09-19 Matsushita Electric Ind Co Ltd Production of nickel-coated finely grained particles
JPS6059070A (ja) * 1983-09-12 1985-04-05 Nippon Chem Ind Co Ltd:The 粉粒体メツキ品の製造法

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS4841926A (enExample) * 1971-09-30 1973-06-19
JPS56119703A (en) * 1980-02-13 1981-09-19 Matsushita Electric Ind Co Ltd Production of nickel-coated finely grained particles
JPS6059070A (ja) * 1983-09-12 1985-04-05 Nippon Chem Ind Co Ltd:The 粉粒体メツキ品の製造法

Cited By (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6421082A (en) * 1987-07-15 1989-01-24 Nippon Chemical Ind Production of powdery plated material
US5170009A (en) * 1990-03-22 1992-12-08 Canon Kabushiki Kaisha Electrically conductive covers and electrically conductive covers of electronic equipment
US5186802A (en) * 1990-03-22 1993-02-16 Canon Kabushiki Kaisha Electro-deposition coated member and process for producing it
US5234558A (en) * 1990-03-22 1993-08-10 Canon Kabushiki Kaisha Electrically conductive circuit member, method of manufacturing the same and electrically conductive paste
US5676812A (en) * 1990-03-24 1997-10-14 Canon Kabushiki Kaisha Electronic equipment with an adhesive member to intercept electromagnetic waves
JP2017508881A (ja) * 2014-01-15 2017-03-30 ナンジン デェァレイ サイエンス アンド テクノロジー カンパニー リミテッドＮａｎｊｉｎｇ Ｄｅｌｅｉ Ｓｃｉｅｎｃｅ ＆ Ｔｅｃｈｎｏｌｏｇｙ Ｃｏ．， Ｌｔｄ 化学ニッケルめっき液の処理方法

Also Published As

Publication number Publication date
JPH0475316B2 (enExample) 1992-11-30

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Legal Events

Date Code Title Description
EXPY Cancellation because of completion of term