JPS6127665A - メタルコア配線基板 - Google Patents

メタルコア配線基板

Info

Publication number
JPS6127665A
JPS6127665A JP14827084A JP14827084A JPS6127665A JP S6127665 A JPS6127665 A JP S6127665A JP 14827084 A JP14827084 A JP 14827084A JP 14827084 A JP14827084 A JP 14827084A JP S6127665 A JPS6127665 A JP S6127665A
Authority
JP
Japan
Prior art keywords
substrate
core wiring
conductive
metal core
wiring board
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP14827084A
Other languages
English (en)
Japanese (ja)
Other versions
JPH0224395B2 (en, 2012
Inventor
Satoshi Endo
智 遠藤
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Toyo Communication Equipment Co Ltd
Original Assignee
Toyo Communication Equipment Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Toyo Communication Equipment Co Ltd filed Critical Toyo Communication Equipment Co Ltd
Priority to JP14827084A priority Critical patent/JPS6127665A/ja
Publication of JPS6127665A publication Critical patent/JPS6127665A/ja
Publication of JPH0224395B2 publication Critical patent/JPH0224395B2/ja
Granted legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/12—Mountings, e.g. non-detachable insulating substrates
    • H01L23/14—Mountings, e.g. non-detachable insulating substrates characterised by the material or its electrical properties
    • H01L23/142—Metallic substrates having insulating layers
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L25/00—Assemblies consisting of a plurality of semiconductor or other solid state devices
    • H01L25/16—Assemblies consisting of a plurality of semiconductor or other solid state devices the devices being of types provided for in two or more different subclasses of H10B, H10D, H10F, H10H, H10K or H10N, e.g. forming hybrid circuits
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0284—Details of three-dimensional rigid printed circuit boards
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/03—Use of materials for the substrate
    • H05K1/05—Insulated conductive substrates, e.g. insulated metal substrate
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/22—Secondary treatment of printed circuits
    • H05K3/28—Applying non-metallic protective coatings

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Power Engineering (AREA)
  • Coupling Device And Connection With Printed Circuit (AREA)
  • Insulated Metal Substrates For Printed Circuits (AREA)
  • Printing Elements For Providing Electric Connections Between Printed Circuits (AREA)
  • Lead Frames For Integrated Circuits (AREA)
  • Multi-Conductor Connections (AREA)
JP14827084A 1984-07-17 1984-07-17 メタルコア配線基板 Granted JPS6127665A (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP14827084A JPS6127665A (ja) 1984-07-17 1984-07-17 メタルコア配線基板

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP14827084A JPS6127665A (ja) 1984-07-17 1984-07-17 メタルコア配線基板

Publications (2)

Publication Number Publication Date
JPS6127665A true JPS6127665A (ja) 1986-02-07
JPH0224395B2 JPH0224395B2 (en, 2012) 1990-05-29

Family

ID=15449008

Family Applications (1)

Application Number Title Priority Date Filing Date
JP14827084A Granted JPS6127665A (ja) 1984-07-17 1984-07-17 メタルコア配線基板

Country Status (1)

Country Link
JP (1) JPS6127665A (en, 2012)

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO1990007857A1 (en) * 1985-07-22 1990-07-12 Satoru Endoh Metal core wiring board
EP0784418A3 (de) * 1996-01-15 1999-09-08 Fela Holding AG Verfahren zur Herstellung von spritzgegossenen dreidimenssionalen Leiterformkörpern, sogenannten 3-D MID
JP2011014639A (ja) * 2009-06-30 2011-01-20 Yazaki Corp メタルコア基板用基材及び該メタルコア基板用基材を用いたメタルコア基板の製造方法
KR101231296B1 (ko) 2006-09-25 2013-02-07 엘지이노텍 주식회사 인텔리전트 파워 모듈

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO1990007857A1 (en) * 1985-07-22 1990-07-12 Satoru Endoh Metal core wiring board
EP0784418A3 (de) * 1996-01-15 1999-09-08 Fela Holding AG Verfahren zur Herstellung von spritzgegossenen dreidimenssionalen Leiterformkörpern, sogenannten 3-D MID
KR101231296B1 (ko) 2006-09-25 2013-02-07 엘지이노텍 주식회사 인텔리전트 파워 모듈
JP2011014639A (ja) * 2009-06-30 2011-01-20 Yazaki Corp メタルコア基板用基材及び該メタルコア基板用基材を用いたメタルコア基板の製造方法

Also Published As

Publication number Publication date
JPH0224395B2 (en, 2012) 1990-05-29

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