JPS6127182Y2 - - Google Patents
Info
- Publication number
- JPS6127182Y2 JPS6127182Y2 JP6643981U JP6643981U JPS6127182Y2 JP S6127182 Y2 JPS6127182 Y2 JP S6127182Y2 JP 6643981 U JP6643981 U JP 6643981U JP 6643981 U JP6643981 U JP 6643981U JP S6127182 Y2 JPS6127182 Y2 JP S6127182Y2
- Authority
- JP
- Japan
- Prior art keywords
- circuit board
- printed circuit
- frame
- integrated circuit
- adhesive
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
- 239000000853 adhesive Substances 0.000 claims description 17
- 230000001070 adhesive effect Effects 0.000 claims description 17
- 238000000034 method Methods 0.000 description 4
- 239000011347 resin Substances 0.000 description 4
- 229920005989 resin Polymers 0.000 description 4
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 3
- 239000011248 coating agent Substances 0.000 description 3
- 238000000576 coating method Methods 0.000 description 3
- 239000011889 copper foil Substances 0.000 description 3
- 239000004065 semiconductor Substances 0.000 description 3
- 230000007547 defect Effects 0.000 description 2
- 239000003822 epoxy resin Substances 0.000 description 2
- 229920003023 plastic Polymers 0.000 description 2
- 229920000647 polyepoxide Polymers 0.000 description 2
- 238000007789 sealing Methods 0.000 description 2
- 230000005856 abnormality Effects 0.000 description 1
- 239000000919 ceramic Substances 0.000 description 1
- -1 etc. Substances 0.000 description 1
- 239000011521 glass Substances 0.000 description 1
- 238000010438 heat treatment Methods 0.000 description 1
- 238000010030 laminating Methods 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 239000000463 material Substances 0.000 description 1
- 239000005011 phenolic resin Substances 0.000 description 1
- 239000004033 plastic Substances 0.000 description 1
- 239000000758 substrate Substances 0.000 description 1
Landscapes
- Casings For Electric Apparatus (AREA)
- Structures For Mounting Electric Components On Printed Circuit Boards (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP6643981U JPS6127182Y2 (fr) | 1981-05-07 | 1981-05-07 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP6643981U JPS6127182Y2 (fr) | 1981-05-07 | 1981-05-07 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS57178447U JPS57178447U (fr) | 1982-11-11 |
| JPS6127182Y2 true JPS6127182Y2 (fr) | 1986-08-13 |
Family
ID=29862479
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP6643981U Expired JPS6127182Y2 (fr) | 1981-05-07 | 1981-05-07 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS6127182Y2 (fr) |
-
1981
- 1981-05-07 JP JP6643981U patent/JPS6127182Y2/ja not_active Expired
Also Published As
| Publication number | Publication date |
|---|---|
| JPS57178447U (fr) | 1982-11-11 |
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