JPS6127182Y2 - - Google Patents

Info

Publication number
JPS6127182Y2
JPS6127182Y2 JP6643981U JP6643981U JPS6127182Y2 JP S6127182 Y2 JPS6127182 Y2 JP S6127182Y2 JP 6643981 U JP6643981 U JP 6643981U JP 6643981 U JP6643981 U JP 6643981U JP S6127182 Y2 JPS6127182 Y2 JP S6127182Y2
Authority
JP
Japan
Prior art keywords
circuit board
printed circuit
frame
integrated circuit
adhesive
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
JP6643981U
Other languages
Japanese (ja)
Other versions
JPS57178447U (en
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP6643981U priority Critical patent/JPS6127182Y2/ja
Publication of JPS57178447U publication Critical patent/JPS57178447U/ja
Application granted granted Critical
Publication of JPS6127182Y2 publication Critical patent/JPS6127182Y2/ja
Expired legal-status Critical Current

Links

Description

【考案の詳細な説明】 本考案は、特に集積回路素子を載置した耐候性
の良い回路基板に関する。
DETAILED DESCRIPTION OF THE INVENTION The present invention particularly relates to a weather-resistant circuit board on which integrated circuit elements are mounted.

近年、第1図に示すように、発光ダイオード
1,1…1を光源とした表示部2と、集積回路素
子3を用い、発光ダイオード1,1…1を駆動し
たり、所定の演算等を行なう回路部4とを、一板
のプリント基板5の上に発光ダイオード1,1…
1も集積回路素子3も載置固着し配線してしまう
事で、小型で使い易い表示装置を提供するように
なつた。しかしながら、このような表示装置にお
いて基板は、他の回路基板と同様に銅箔を有した
積層樹脂基板(いわゆるプリント基板)を用いた
方が、取り扱いが容易でしかも安価である。とこ
ろがこのようなプリント基板の上に半導体を載置
すると、リードフレヤーやセラミツク基板を用い
るのと異なり、種々の問題が発生するが、その中
でも集積回路素子3の封止に於いては次のような
困難さがある。
In recent years, as shown in FIG. 1, a display section 2 using light-emitting diodes 1, 1...1 as a light source and an integrated circuit element 3 have been used to drive the light-emitting diodes 1, 1...1 and perform predetermined calculations. A circuit section 4 to be used is mounted on a single printed circuit board 5, and light emitting diodes 1, 1...
By mounting and wiring both the integrated circuit element 1 and the integrated circuit element 3, a compact and easy-to-use display device can be provided. However, in such a display device, it is easier to handle and cheaper to use a laminated resin board (so-called printed circuit board) having copper foil like other circuit boards. However, when a semiconductor is placed on such a printed circuit board, unlike using a lead flare or ceramic substrate, various problems arise, including the following in sealing the integrated circuit element 3. There are many difficulties.

集積回路素子3を封止する目的は主として2つ
ある。第一には表面に種々の素子や配線が露出し
ているので、湿気等で表面が汚染され動作不能等
を起こさないようにするためであり、第二には光
エネルギーによつても半導体中のキヤリヤが移動
するため、外光によつて集積回路が誤動作するの
を防ぐためである。リードフレーム等を用いる場
合は硬質プラスチツクでモールドしてしまうが、
プリント基板ではモールド樹脂とプリント基板の
熱膨張係数が異なるため、モールド樹脂が剥離し
たり、半導体や配線部品に応力が加わつたりして
不良を生じる。そこで第1図に示すような枠体6
を用いるとこれらの不良は防げるが、耐候性が悪
い。即ち第2図に示すように、枠体6をプリント
基板5に接着剤7で貼付するわけであるが、枠体
6の接触面積が小さい上、銅箔8,8…8はエツ
チングやメツキによつてエツジに丸味が出来たり
表面に微細な凹凸が形成されている。このため一
般の接着剤をただ塗布したのでは気泡が残りやす
い。しかもプリント基板5は上述の如く素材薄板
(プリプレグ)の積層によつて形成されているの
で、表面等に空気が付着し、接着剤7の硬化中に
接着剤7の中にとけこみやすい。従つて表示装置
完成後等、気温が上昇したりすると、これらの気
泡が大きくなり、特に第2図に示すように接着剤
7が硬化中等で充分硬化しきつていないと空気層
9,9…9を形成してしまい、この空気層9,9
…9を通じて湿気が侵入したり、空気層9,9…
9による接着力低下に伴い、プリント基板5にね
じれ等の力が加わつた時等に枠体6が剥離してし
まう。
There are two main purposes for sealing the integrated circuit element 3. Firstly, since various elements and wiring are exposed on the surface, this is to prevent the surface from being contaminated by moisture etc. and causing inoperability.Secondly, light energy can also damage the inside of the semiconductor. This is to prevent the integrated circuit from malfunctioning due to external light since the carrier moves. When using a lead frame etc., it is molded with hard plastic, but
In printed circuit boards, the mold resin and the printed circuit board have different coefficients of thermal expansion, which can cause defects such as peeling of the mold resin or application of stress to semiconductors and wiring components. Therefore, a frame 6 as shown in FIG.
Although these defects can be prevented by using , weather resistance is poor. That is, as shown in FIG. 2, the frame 6 is attached to the printed circuit board 5 with adhesive 7, but the contact area of the frame 6 is small, and the copper foils 8, 8...8 are not easily etched or plated. This results in rounded edges and fine irregularities on the surface. For this reason, simply applying a general adhesive tends to leave air bubbles. Moreover, since the printed circuit board 5 is formed by laminating thin sheets of material (prepreg) as described above, air tends to adhere to the surface and dissolve into the adhesive 7 while the adhesive 7 is curing. Therefore, when the temperature rises after the display device is completed, these bubbles become larger, and especially as shown in FIG. 2, if the adhesive 7 is not sufficiently hardened, air spaces 9, 9, etc. 9 is formed, and this air layer 9,9
...Moisture may enter through the air layer 9, 9...
Due to the decrease in adhesive strength caused by 9, the frame 6 will peel off when a force such as twisting is applied to the printed circuit board 5.

本考案は上述の欠点を改めるためになされたも
ので、以下実施例に基づいて、本考案を詳細に説
明する。
The present invention has been made to overcome the above-mentioned drawbacks, and will be described in detail below based on examples.

第3図は本考案実施例の回路基板の要部断面図
で、15はガラスエポキシ樹脂、紙エポキシ樹
脂、紙フエノール樹脂等の樹脂基台に銅箔18,
18…18を積層したプリント基板である。16
は集積回路素子(第1図3参照)を覆つてプリン
ト基板15の上に載置された透明プラスチツク成
型品からなる枠体である。17は枠体16をプリ
ント基板15に固着するための紫外線硬化型接着
剤である。20は枠体16を覆う黒色インク等か
らなる不透明被覆である。
FIG. 3 is a sectional view of the main parts of the circuit board according to the embodiment of the present invention, in which 15 is a resin base made of glass epoxy resin, paper epoxy resin, paper phenol resin, etc., copper foil 18,
This is a printed circuit board in which 18...18 are laminated. 16
1 is a frame made of a transparent plastic molded product placed on a printed circuit board 15 so as to cover an integrated circuit element (see FIG. 1, 3). Reference numeral 17 denotes an ultraviolet curing adhesive for fixing the frame 16 to the printed circuit board 15. Reference numeral 20 denotes an opaque coating made of black ink or the like that covers the frame 16.

このような回路基板は次のようにして製造す
る。まずプリント基板15の上に集積回路素子
(第1図3参照)を載置固着し、ワイヤボンド法
等により配線を施こす。好ましくはこの後又はあ
らかじめ、プリント基板15を加熱するか、又は
真空脱泡しておくとよい。次にあらかじめ端部に
紫外線硬化型接着剤17を印刷塗布した枠体16
をプリント基板15上に載置し加圧する。紫外線
硬化型接着剤17は粘度があまり高くない上、枠
体16が透明であるから接着状態が目視にて確認
できるので、密着不良がない事を確認したあと、
枠体16を加圧したまま枠体16の上方から紫外
線を照射し、紫外線硬化型接着剤17を硬化させ
る。その後枠体16の加圧を除去し、目視による
集積回路素子の配線不良、枠体16の接着不良を
検査し、異常がなければ不透明被膜20をふきつ
け又は印刷にて形成する。このように製造する事
により、接着剤が未硬化のうちに生ずる気泡等の
問題は、接着剤の硬化中に熱処理工程がなく、又
硬化の様子が確認できるのでほぼ完全になくする
ことができた。
Such a circuit board is manufactured as follows. First, an integrated circuit element (see FIG. 1, FIG. 3) is placed and fixed on the printed circuit board 15, and wiring is performed using a wire bonding method or the like. Preferably, after or in advance, the printed circuit board 15 is heated or degassed under vacuum. Next, a frame 16 with an ultraviolet curable adhesive 17 printed and coated on its edges in advance.
is placed on the printed circuit board 15 and pressurized. The ultraviolet curing adhesive 17 does not have a very high viscosity, and since the frame 16 is transparent, the adhesion state can be visually confirmed, so after confirming that there is no poor adhesion,
Ultraviolet rays are irradiated from above the frame 16 while the frame 16 is kept under pressure to cure the ultraviolet curable adhesive 17. Thereafter, the pressure on the frame 16 is removed, and the integrated circuit element is visually inspected for poor wiring and poor adhesion of the frame 16. If there are no abnormalities, an opaque film 20 is formed by wiping or printing. By manufacturing in this way, problems such as air bubbles that occur while the adhesive is not cured can be almost completely eliminated because there is no heat treatment process during the adhesive's curing process, and the curing process can be confirmed. Ta.

以上の如く、本考案は、プリント基板と、プリ
ント基板に載置固着された集積回路素子と、集積
回路素子を覆い少なくとも紫外線を透過させる枠
体と、枠体とプリント基板とを接着してなる紫外
線硬化型接着剤と、枠体を覆う不透明被覆とを具
備した回路基板であるから、従来のように接着剤
中に気泡が入ることはなく、従つて耐候性に優
れ、従来同様安価で取扱いやすいプリント基板を
用いることができる。
As described above, the present invention consists of a printed circuit board, an integrated circuit element placed and fixed on the printed circuit board, a frame body that covers the integrated circuit element and transmits at least ultraviolet rays, and a frame body and the printed circuit board that are bonded together. Since this circuit board is equipped with an ultraviolet curable adhesive and an opaque coating that covers the frame, there are no air bubbles in the adhesive as with conventional adhesives, so it has excellent weather resistance and is as inexpensive to handle as before. A simple printed circuit board can be used.

【図面の簡単な説明】[Brief explanation of the drawing]

第1図は回路基板の断面図、第2図は従来の回
路基板の要部断面図、第3図は本考案実施例の回
路基板の要部断面図である。 3……集積回路素子、5,15……プリント基
板、6,16……枠体、17……紫外線硬化型接
着剤、20……不透明被膜。
FIG. 1 is a sectional view of a circuit board, FIG. 2 is a sectional view of a main part of a conventional circuit board, and FIG. 3 is a sectional view of a main part of a circuit board according to an embodiment of the present invention. 3... Integrated circuit element, 5, 15... Printed circuit board, 6, 16... Frame, 17... Ultraviolet curing adhesive, 20... Opaque coating.

Claims (1)

【実用新案登録請求の範囲】[Scope of utility model registration request] プリント基板と、プリント基板に載置固着され
た集積回路素子と、集積回路素子を覆い少なくと
も紫外線を透過させる枠体と、枠体とプリント基
板とを接着してなる柴外線硬化型接着剤と、枠体
を覆う不透明被膜とを具備した事を特徴とする回
路基板。
a printed circuit board, an integrated circuit element placed and fixed on the printed circuit board, a frame body that covers the integrated circuit element and transmits at least ultraviolet rays, and a Shibagai line-curing adhesive formed by bonding the frame body and the printed circuit board; A circuit board characterized by comprising an opaque film covering a frame.
JP6643981U 1981-05-07 1981-05-07 Expired JPS6127182Y2 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP6643981U JPS6127182Y2 (en) 1981-05-07 1981-05-07

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP6643981U JPS6127182Y2 (en) 1981-05-07 1981-05-07

Publications (2)

Publication Number Publication Date
JPS57178447U JPS57178447U (en) 1982-11-11
JPS6127182Y2 true JPS6127182Y2 (en) 1986-08-13

Family

ID=29862479

Family Applications (1)

Application Number Title Priority Date Filing Date
JP6643981U Expired JPS6127182Y2 (en) 1981-05-07 1981-05-07

Country Status (1)

Country Link
JP (1) JPS6127182Y2 (en)

Also Published As

Publication number Publication date
JPS57178447U (en) 1982-11-11

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