JPS61269350A - リ−ドフレ−ムの矯正方法 - Google Patents
リ−ドフレ−ムの矯正方法Info
- Publication number
- JPS61269350A JPS61269350A JP11057285A JP11057285A JPS61269350A JP S61269350 A JPS61269350 A JP S61269350A JP 11057285 A JP11057285 A JP 11057285A JP 11057285 A JP11057285 A JP 11057285A JP S61269350 A JPS61269350 A JP S61269350A
- Authority
- JP
- Japan
- Prior art keywords
- lead frame
- warpage
- center line
- torsion
- frame
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 238000000034 method Methods 0.000 title claims description 22
- 238000005452 bending Methods 0.000 claims description 8
- 238000003825 pressing Methods 0.000 claims description 3
- 230000003190 augmentative effect Effects 0.000 abstract 1
- 239000000463 material Substances 0.000 description 5
- 239000002184 metal Substances 0.000 description 5
- 238000012937 correction Methods 0.000 description 3
- 238000010586 diagram Methods 0.000 description 3
- 230000000694 effects Effects 0.000 description 3
- 230000007547 defect Effects 0.000 description 2
- 239000004065 semiconductor Substances 0.000 description 2
- 239000000470 constituent Substances 0.000 description 1
- 230000003247 decreasing effect Effects 0.000 description 1
- 238000007373 indentation Methods 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 238000004080 punching Methods 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
Landscapes
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Engineering & Computer Science (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Lead Frames For Integrated Circuits (AREA)
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP11057285A JPS61269350A (ja) | 1985-05-24 | 1985-05-24 | リ−ドフレ−ムの矯正方法 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP11057285A JPS61269350A (ja) | 1985-05-24 | 1985-05-24 | リ−ドフレ−ムの矯正方法 |
Publications (2)
Publication Number | Publication Date |
---|---|
JPS61269350A true JPS61269350A (ja) | 1986-11-28 |
JPH0462462B2 JPH0462462B2 (enrdf_load_stackoverflow) | 1992-10-06 |
Family
ID=14539232
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP11057285A Granted JPS61269350A (ja) | 1985-05-24 | 1985-05-24 | リ−ドフレ−ムの矯正方法 |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPS61269350A (enrdf_load_stackoverflow) |
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS63268517A (ja) * | 1987-04-24 | 1988-11-07 | Daido Steel Co Ltd | 金属帯片の残留応力低減方法 |
JP2013075328A (ja) * | 2011-09-30 | 2013-04-25 | Morioka Seiko Instruments Inc | プレス部品の製造方法、及びプレス部品 |
Citations (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS5622382A (en) * | 1979-05-09 | 1981-03-02 | Herko Pyrolyse Recycling | Waste decompositin method and apparatus |
JPS59117248A (ja) * | 1982-12-24 | 1984-07-06 | Hitachi Yonezawa Denshi Kk | リ−ドフレ−ム |
-
1985
- 1985-05-24 JP JP11057285A patent/JPS61269350A/ja active Granted
Patent Citations (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS5622382A (en) * | 1979-05-09 | 1981-03-02 | Herko Pyrolyse Recycling | Waste decompositin method and apparatus |
JPS59117248A (ja) * | 1982-12-24 | 1984-07-06 | Hitachi Yonezawa Denshi Kk | リ−ドフレ−ム |
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS63268517A (ja) * | 1987-04-24 | 1988-11-07 | Daido Steel Co Ltd | 金属帯片の残留応力低減方法 |
JP2013075328A (ja) * | 2011-09-30 | 2013-04-25 | Morioka Seiko Instruments Inc | プレス部品の製造方法、及びプレス部品 |
Also Published As
Publication number | Publication date |
---|---|
JPH0462462B2 (enrdf_load_stackoverflow) | 1992-10-06 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
EXPY | Cancellation because of completion of term |