JPS6125238B2 - - Google Patents
Info
- Publication number
- JPS6125238B2 JPS6125238B2 JP55079402A JP7940280A JPS6125238B2 JP S6125238 B2 JPS6125238 B2 JP S6125238B2 JP 55079402 A JP55079402 A JP 55079402A JP 7940280 A JP7940280 A JP 7940280A JP S6125238 B2 JPS6125238 B2 JP S6125238B2
- Authority
- JP
- Japan
- Prior art keywords
- printed wiring
- wiring board
- solder
- jet
- soldering
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
- 229910000679 solder Inorganic materials 0.000 claims description 49
- 238000005476 soldering Methods 0.000 claims description 38
- 238000000034 method Methods 0.000 claims description 9
- 230000002950 deficient Effects 0.000 description 4
- 239000004020 conductor Substances 0.000 description 3
- 230000007547 defect Effects 0.000 description 3
- 238000010586 diagram Methods 0.000 description 3
- 238000012937 correction Methods 0.000 description 2
- 238000007689 inspection Methods 0.000 description 2
- 239000000853 adhesive Substances 0.000 description 1
- 230000001070 adhesive effect Effects 0.000 description 1
- 239000003990 capacitor Substances 0.000 description 1
- 239000002131 composite material Substances 0.000 description 1
- 238000013461 design Methods 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 230000001105 regulatory effect Effects 0.000 description 1
- 238000012546 transfer Methods 0.000 description 1
Landscapes
- Electric Connection Of Electric Components To Printed Circuits (AREA)
- Molten Solder (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP7940280A JPS575396A (en) | 1980-06-12 | 1980-06-12 | Soldering method |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP7940280A JPS575396A (en) | 1980-06-12 | 1980-06-12 | Soldering method |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS575396A JPS575396A (en) | 1982-01-12 |
| JPS6125238B2 true JPS6125238B2 (de) | 1986-06-14 |
Family
ID=13688856
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP7940280A Granted JPS575396A (en) | 1980-06-12 | 1980-06-12 | Soldering method |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS575396A (de) |
Families Citing this family (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS58162095A (ja) * | 1982-03-19 | 1983-09-26 | 松下電器産業株式会社 | 電子部品の半田付方法 |
| JPS59130675A (ja) * | 1983-01-18 | 1984-07-27 | Kenji Kondo | はんだ槽 |
| JPS59153570A (ja) * | 1983-02-22 | 1984-09-01 | Kenji Kondo | はんだ槽 |
| JPS6263490A (ja) * | 1985-09-13 | 1987-03-20 | 日本電気ホームエレクトロニクス株式会社 | プリント基板の半田デイツプ方法 |
| JPH0683894B2 (ja) * | 1988-08-31 | 1994-10-26 | 横田機械株式会社 | 自動半田付け装置 |
| DE102016118788A1 (de) * | 2016-10-05 | 2018-04-05 | Ersa Gmbh | Löteinrichtung und Lötanlage |
Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS547168A (en) * | 1977-06-18 | 1979-01-19 | Kondo Kenji | Soldering method and device |
-
1980
- 1980-06-12 JP JP7940280A patent/JPS575396A/ja active Granted
Patent Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS547168A (en) * | 1977-06-18 | 1979-01-19 | Kondo Kenji | Soldering method and device |
Also Published As
| Publication number | Publication date |
|---|---|
| JPS575396A (en) | 1982-01-12 |
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