JPS61250036A - 銅と樹脂との接着方法 - Google Patents

銅と樹脂との接着方法

Info

Publication number
JPS61250036A
JPS61250036A JP60090862A JP9086285A JPS61250036A JP S61250036 A JPS61250036 A JP S61250036A JP 60090862 A JP60090862 A JP 60090862A JP 9086285 A JP9086285 A JP 9086285A JP S61250036 A JPS61250036 A JP S61250036A
Authority
JP
Japan
Prior art keywords
copper
oxide layer
resin
bonding
metallic copper
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP60090862A
Other languages
English (en)
Japanese (ja)
Other versions
JPH0449855B2 (enExample
Inventor
Haruo Akaboshi
晴夫 赤星
Kanji Murakami
敢次 村上
Kiyonori Furukawa
古川　清則
Ritsuji Toba
鳥羽　律司
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Hitachi Ltd
Original Assignee
Hitachi Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Hitachi Ltd filed Critical Hitachi Ltd
Priority to JP60090862A priority Critical patent/JPS61250036A/ja
Publication of JPS61250036A publication Critical patent/JPS61250036A/ja
Publication of JPH0449855B2 publication Critical patent/JPH0449855B2/ja
Granted legal-status Critical Current

Links

Landscapes

  • Manufacturing Of Printed Wiring (AREA)
  • Manufacture Of Macromolecular Shaped Articles (AREA)
  • Laminated Bodies (AREA)
JP60090862A 1985-04-30 1985-04-30 銅と樹脂との接着方法 Granted JPS61250036A (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP60090862A JPS61250036A (ja) 1985-04-30 1985-04-30 銅と樹脂との接着方法

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP60090862A JPS61250036A (ja) 1985-04-30 1985-04-30 銅と樹脂との接着方法

Publications (2)

Publication Number Publication Date
JPS61250036A true JPS61250036A (ja) 1986-11-07
JPH0449855B2 JPH0449855B2 (enExample) 1992-08-12

Family

ID=14010359

Family Applications (1)

Application Number Title Priority Date Filing Date
JP60090862A Granted JPS61250036A (ja) 1985-04-30 1985-04-30 銅と樹脂との接着方法

Country Status (1)

Country Link
JP (1) JPS61250036A (enExample)

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH02306694A (ja) * 1989-05-22 1990-12-20 Matsushita Electric Works Ltd 多層配線基板の製造方法
JP2003073630A (ja) * 2001-09-03 2003-03-12 Taisei Plas Co Ltd 金属の接着方法
JP2009140998A (ja) * 2007-12-04 2009-06-25 Hitachi Chem Co Ltd 銅表面の処理方法、銅および配線基板

Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US2643199A (en) * 1945-12-18 1953-06-23 Hersch Paul Process of forming a layer of metallic copper on copper oxide
JPS56153797A (en) * 1980-04-28 1981-11-27 Hitachi Chemical Co Ltd Method of manufacturing multilayer printed circuit board substrate
JPS648479A (en) * 1987-07-01 1989-01-12 Toshiba Corp Machine translation system
JPS6441276A (en) * 1987-08-07 1989-02-13 Fuji Electric Co Ltd Forming method for thin film
JPH0350431A (ja) * 1989-07-14 1991-03-05 Nikken Sekkei Ltd 負荷予測方法

Patent Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US2643199A (en) * 1945-12-18 1953-06-23 Hersch Paul Process of forming a layer of metallic copper on copper oxide
JPS56153797A (en) * 1980-04-28 1981-11-27 Hitachi Chemical Co Ltd Method of manufacturing multilayer printed circuit board substrate
JPS648479A (en) * 1987-07-01 1989-01-12 Toshiba Corp Machine translation system
JPS6441276A (en) * 1987-08-07 1989-02-13 Fuji Electric Co Ltd Forming method for thin film
JPH0350431A (ja) * 1989-07-14 1991-03-05 Nikken Sekkei Ltd 負荷予測方法

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH02306694A (ja) * 1989-05-22 1990-12-20 Matsushita Electric Works Ltd 多層配線基板の製造方法
JP2003073630A (ja) * 2001-09-03 2003-03-12 Taisei Plas Co Ltd 金属の接着方法
JP2009140998A (ja) * 2007-12-04 2009-06-25 Hitachi Chem Co Ltd 銅表面の処理方法、銅および配線基板

Also Published As

Publication number Publication date
JPH0449855B2 (enExample) 1992-08-12

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