JPS6441276A - Forming method for thin film - Google Patents
Forming method for thin filmInfo
- Publication number
- JPS6441276A JPS6441276A JP62197390A JP19739087A JPS6441276A JP S6441276 A JPS6441276 A JP S6441276A JP 62197390 A JP62197390 A JP 62197390A JP 19739087 A JP19739087 A JP 19739087A JP S6441276 A JPS6441276 A JP S6441276A
- Authority
- JP
- Japan
- Prior art keywords
- mask
- film
- substrate
- thin film
- high molecular
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02E—REDUCTION OF GREENHOUSE GAS [GHG] EMISSIONS, RELATED TO ENERGY GENERATION, TRANSMISSION OR DISTRIBUTION
- Y02E10/00—Energy generation through renewable energy sources
- Y02E10/50—Photovoltaic [PV] energy
Landscapes
- Photovoltaic Devices (AREA)
Abstract
PURPOSE:To prevent a thin film from permeating between a mask and a substrate, by coating the surface of the mask having an aperture of specific shape with high molecular resin, and forming the mask while pressure is applied, via the coating film, to the surface of a film forming substrate. CONSTITUTION:A high molecular resin film 9 is formed on the surface of a mask 8 having the aperture part of a pattern for film forming, and thereon, a film forming substrate 7 and a holding plate 10 are arranged. While the mask 8 is pressed against the film forming substrate 7 by applying pressure to the holding plate 10 via a coating film 9, a film is formed. The coating film 9 of high molecular resin is interposed between the mask and the film forming substrate 7, so that the adhesion between the mask 8 and the substrate 7 is increased. Therefore, when the temperature of the substrate 7 rises at the time of forming the film, the sagging of mask due to thermal deformation can be prevented. As the result of this, a thin film can be prevented from permeating between the mask and the substrate 7.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP62197390A JPS6441276A (en) | 1987-08-07 | 1987-08-07 | Forming method for thin film |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP62197390A JPS6441276A (en) | 1987-08-07 | 1987-08-07 | Forming method for thin film |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS6441276A true JPS6441276A (en) | 1989-02-13 |
Family
ID=16373711
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP62197390A Pending JPS6441276A (en) | 1987-08-07 | 1987-08-07 | Forming method for thin film |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS6441276A (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS61250036A (en) * | 1985-04-30 | 1986-11-07 | Hitachi Ltd | Bonding of copper and resin |
Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS60117684A (en) * | 1983-11-30 | 1985-06-25 | Hitachi Ltd | Manufacture of amorphous si solar battery |
-
1987
- 1987-08-07 JP JP62197390A patent/JPS6441276A/en active Pending
Patent Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS60117684A (en) * | 1983-11-30 | 1985-06-25 | Hitachi Ltd | Manufacture of amorphous si solar battery |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS61250036A (en) * | 1985-04-30 | 1986-11-07 | Hitachi Ltd | Bonding of copper and resin |
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