JPS61241060A - 平面自動研磨装置 - Google Patents

平面自動研磨装置

Info

Publication number
JPS61241060A
JPS61241060A JP60081958A JP8195885A JPS61241060A JP S61241060 A JPS61241060 A JP S61241060A JP 60081958 A JP60081958 A JP 60081958A JP 8195885 A JP8195885 A JP 8195885A JP S61241060 A JPS61241060 A JP S61241060A
Authority
JP
Japan
Prior art keywords
carrier
workpiece
work
turntable
robot arm
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP60081958A
Other languages
English (en)
Japanese (ja)
Other versions
JPH0457469B2 (enrdf_load_stackoverflow
Inventor
Hatsuyuki Arai
新井　初雪
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
SUPIIDE FUAMU KK
Speedfam Corp
Original Assignee
SUPIIDE FUAMU KK
Speedfam Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by SUPIIDE FUAMU KK, Speedfam Corp filed Critical SUPIIDE FUAMU KK
Priority to JP60081958A priority Critical patent/JPS61241060A/ja
Publication of JPS61241060A publication Critical patent/JPS61241060A/ja
Publication of JPH0457469B2 publication Critical patent/JPH0457469B2/ja
Granted legal-status Critical Current

Links

Landscapes

  • Constituent Portions Of Griding Lathes, Driving, Sensing And Control (AREA)
  • Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
JP60081958A 1985-04-17 1985-04-17 平面自動研磨装置 Granted JPS61241060A (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP60081958A JPS61241060A (ja) 1985-04-17 1985-04-17 平面自動研磨装置

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP60081958A JPS61241060A (ja) 1985-04-17 1985-04-17 平面自動研磨装置

Publications (2)

Publication Number Publication Date
JPS61241060A true JPS61241060A (ja) 1986-10-27
JPH0457469B2 JPH0457469B2 (enrdf_load_stackoverflow) 1992-09-11

Family

ID=13761006

Family Applications (1)

Application Number Title Priority Date Filing Date
JP60081958A Granted JPS61241060A (ja) 1985-04-17 1985-04-17 平面自動研磨装置

Country Status (1)

Country Link
JP (1) JPS61241060A (enrdf_load_stackoverflow)

Cited By (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH03264262A (ja) * 1990-03-14 1991-11-25 Kyushu Electron Metal Co Ltd 両面精密研摩用ラップ盤
US5174067A (en) * 1990-10-19 1992-12-29 Shin-Etsu Handotai Co., Ltd. Automatic wafer lapping apparatus
WO1993025347A1 (en) * 1992-06-15 1993-12-23 Speedfam Corporation Wafer polishing method and apparatus
WO1996002355A1 (en) * 1994-07-15 1996-02-01 Speedfam Corporation Wafer polishing method and apparatus
EP0931623A1 (en) * 1998-01-21 1999-07-28 Shin-Etsu Handotai Company Limited Automatic workpiece transport apparatus for double-side polishing machine
JP2002321152A (ja) * 2001-04-23 2002-11-05 Fujikoshi Mach Corp 研磨装置システム
JP2010064206A (ja) * 2008-09-12 2010-03-25 Fujikoshi Mach Corp 両面研磨装置
JP2011212768A (ja) * 2010-03-31 2011-10-27 Komatsu Ntc Ltd 棒状ワークの加工方法及びその装置
JP2011212767A (ja) * 2010-03-31 2011-10-27 Komatsu Ntc Ltd 加工システムにおけるワーク搬入出装置及びその方法
WO2015194092A1 (ja) * 2014-06-16 2015-12-23 信越半導体株式会社 自動ハンドリング装置

Cited By (18)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH03264262A (ja) * 1990-03-14 1991-11-25 Kyushu Electron Metal Co Ltd 両面精密研摩用ラップ盤
US5174067A (en) * 1990-10-19 1992-12-29 Shin-Etsu Handotai Co., Ltd. Automatic wafer lapping apparatus
WO1993025347A1 (en) * 1992-06-15 1993-12-23 Speedfam Corporation Wafer polishing method and apparatus
US5329732A (en) * 1992-06-15 1994-07-19 Speedfam Corporation Wafer polishing method and apparatus
US5498196A (en) * 1992-06-15 1996-03-12 Speedfam Corporation Wafer polishing method and apparatus
US5498199A (en) * 1992-06-15 1996-03-12 Speedfam Corporation Wafer polishing method and apparatus
USRE37622E1 (en) 1992-06-15 2002-04-02 Speedfam-Ipec Corporation Wafer polishing method and apparatus
WO1996002355A1 (en) * 1994-07-15 1996-02-01 Speedfam Corporation Wafer polishing method and apparatus
US6135854A (en) * 1998-01-21 2000-10-24 Shin-Etsu Handotai Co., Ltd. Automatic workpiece transport apparatus for double-side polishing machine
EP0931623A1 (en) * 1998-01-21 1999-07-28 Shin-Etsu Handotai Company Limited Automatic workpiece transport apparatus for double-side polishing machine
JP2002321152A (ja) * 2001-04-23 2002-11-05 Fujikoshi Mach Corp 研磨装置システム
JP2010064206A (ja) * 2008-09-12 2010-03-25 Fujikoshi Mach Corp 両面研磨装置
JP2011212768A (ja) * 2010-03-31 2011-10-27 Komatsu Ntc Ltd 棒状ワークの加工方法及びその装置
JP2011212767A (ja) * 2010-03-31 2011-10-27 Komatsu Ntc Ltd 加工システムにおけるワーク搬入出装置及びその方法
WO2015194092A1 (ja) * 2014-06-16 2015-12-23 信越半導体株式会社 自動ハンドリング装置
JP2016002612A (ja) * 2014-06-16 2016-01-12 信越半導体株式会社 自動ハンドリング装置
KR20170018833A (ko) * 2014-06-16 2017-02-20 신에쯔 한도타이 가부시키가이샤 자동 핸들링 장치
US9931730B2 (en) 2014-06-16 2018-04-03 Shin-Etsu Handotai Co., Ltd. Automatic handling apparatus with positioning pins

Also Published As

Publication number Publication date
JPH0457469B2 (enrdf_load_stackoverflow) 1992-09-11

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