JPS61240687A - Light-emitting element - Google Patents
Light-emitting elementInfo
- Publication number
- JPS61240687A JPS61240687A JP60082822A JP8282285A JPS61240687A JP S61240687 A JPS61240687 A JP S61240687A JP 60082822 A JP60082822 A JP 60082822A JP 8282285 A JP8282285 A JP 8282285A JP S61240687 A JPS61240687 A JP S61240687A
- Authority
- JP
- Japan
- Prior art keywords
- emitting element
- light
- light emitting
- resin
- element piece
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000011347 resin Substances 0.000 claims abstract description 38
- 229920005989 resin Polymers 0.000 claims abstract description 38
- 239000000758 substrate Substances 0.000 claims abstract description 28
- 229910052751 metal Inorganic materials 0.000 claims description 18
- 239000002184 metal Substances 0.000 claims description 18
- 239000000853 adhesive Substances 0.000 claims description 2
- 230000001070 adhesive effect Effects 0.000 claims description 2
- 238000007789 sealing Methods 0.000 abstract description 4
- PNEYBMLMFCGWSK-UHFFFAOYSA-N Alumina Chemical compound [O-2].[O-2].[O-2].[Al+3].[Al+3] PNEYBMLMFCGWSK-UHFFFAOYSA-N 0.000 abstract description 3
- 238000007493 shaping process Methods 0.000 abstract 1
- 239000000919 ceramic Substances 0.000 description 3
- 238000005476 soldering Methods 0.000 description 3
- 230000000694 effects Effects 0.000 description 2
- 238000000034 method Methods 0.000 description 2
- 229910001111 Fine metal Inorganic materials 0.000 description 1
- 230000015572 biosynthetic process Effects 0.000 description 1
- 239000003795 chemical substances by application Substances 0.000 description 1
- 239000004020 conductor Substances 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 238000010304 firing Methods 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- SWELZOZIOHGSPA-UHFFFAOYSA-N palladium silver Chemical compound [Pd].[Ag] SWELZOZIOHGSPA-UHFFFAOYSA-N 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
- H01L33/483—Containers
- H01L33/486—Containers adapted for surface mounting
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/4805—Shape
- H01L2224/4809—Loop shape
- H01L2224/48091—Arched
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/481—Disposition
- H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/48225—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
- H01L2224/48227—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation connecting the wire to a bond pad of the item
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Power Engineering (AREA)
- Led Device Packages (AREA)
Abstract
Description
【発明の詳細な説明】
産業上の利用分野
本発明は、電子機器の小型化ならびに組立の自動化をは
かることができ、さらに、電子機器の信頼性を高めるこ
ともできる構造を具備する発光素子に関する。DETAILED DESCRIPTION OF THE INVENTION Field of the Invention The present invention relates to a light-emitting element having a structure that allows miniaturization of electronic equipment and automation of assembly, and further improves the reliability of electronic equipment. .
従来の技術
発光ダイオード（以下ＬＥＤと記す）の構造は多岐にわ
たっており、その１つに、外部リードを排してチップ部
品化したリードレス構造のものがある。BACKGROUND OF THE INVENTION Conventional light emitting diodes (hereinafter referred to as LEDs) have a wide variety of structures, one of which is a leadless structure that eliminates external leads and is made into a chip component.
第２図（、）および（ｂ）は、かがるリードレス構造と
されだＬＥＤの一実施例を示す斜視図および同図をＢ−
Ｂ線に沿って切断して示した断面図である。FIGS. 2(a) and 2(b) are perspective views showing one embodiment of a leadless structure and a leadless LED, and FIGS.
FIG. 3 is a cross-sectional view taken along line B;
この構造のＬＥＤは、セラミック基板１の表面に金属膜
２および３を印刷して配線層を形成した支持基板を準備
し、この支持基板上の一方の金属膜３の上に発光素子片
４をボンディングしたのち、３・＼−７
この発光素子片上の旬；極と他方の金属膜２との間の金
属細線６で接続し、さらに透光性樹脂６を滴下して封止
したものである。In the LED of this structure, a support substrate is prepared by printing metal films 2 and 3 on the surface of a ceramic substrate 1 to form a wiring layer, and a light emitting element piece 4 is placed on one metal film 3 on the support substrate. After bonding, 3.＼-7 on this light-emitting element piece is connected with a thin metal wire 6 between the electrode and the other metal film 2, and then a translucent resin 6 is dropped to seal it. .
発明が解決しようとする問題点
従来のリードレス形ＬＥＤでは、発光素子片を封止する
透光性樹脂１１の形状が半球状となる。Problems to be Solved by the Invention In the conventional leadless LED, the shape of the translucent resin 11 that seals the light emitting element piece is hemispherical.
ところで、電子機器の組立にあたり、この発光素子の電
子機器への装着を真空吸着ノズルをもつ自動装着機を用
いて行うと、半球状の透光性樹脂部分の吸着固定が困難
となる。このため、自動装着は殆んど不可能である。捷
だ、セラミック基板６と透光性樹脂１１との間の接着面
積が小さいだめ、接着強度が十分でなく、さらに、図示
した構造ではセラミック基板側面の金属膜面積も小さい
ため、発光素子を電子機器へ取りつける際の半田付面積
が小さくなり、十分な半田付強度を得ることができなか
った。このような問題に加えて、封止が透光性樹脂の滴
下と硬化の過程を経てなされることから、その形状が樹
脂の粘度によって変化するおそれがあり、完成した発光
素子の外観形状にばらつきがもたらされる問題もあった
。By the way, when assembling electronic equipment, if this light emitting element is attached to the electronic equipment using an automatic mounting machine having a vacuum suction nozzle, it becomes difficult to suction and fix the hemispherical translucent resin portion. For this reason, automatic attachment is almost impossible. Unfortunately, the bonding area between the ceramic substrate 6 and the translucent resin 11 is small, so the bonding strength is insufficient.Furthermore, in the structure shown, the area of the metal film on the side of the ceramic substrate is also small, so the light emitting element cannot be used electronically. The soldering area when attaching to equipment became small, and sufficient soldering strength could not be obtained. In addition to these problems, since sealing is done through the process of dropping and curing translucent resin, there is a risk that the shape may change depending on the viscosity of the resin, resulting in variations in the external shape of the completed light emitting device. There were also problems caused by
問題点を解決するための手段
本発明の発光素子は、成形樹脂の形状をその天面が平坦
である箱形形状とし、この樹脂部分内に発光素子を封止
するとともに、箱形形状の樹脂部で被覆されない支持基
板」−の部分は、箱形形状の樹脂部分と連続する薄い樹
脂層で被覆し、さらに支持基板に形成する電極で、支持
基板の側面を広く覆うように構成されている。Means for Solving the Problems In the light emitting device of the present invention, the shape of the molded resin is a box shape with a flat top surface, the light emitting device is sealed within this resin portion, and the box shaped resin is sealed. The part of the supporting substrate that is not covered by the box-shaped resin part is covered with a thin resin layer that is continuous with the box-shaped resin part, and the electrodes formed on the supporting substrate are configured to widely cover the sides of the supporting substrate. .
作用
本発明の発光米子構造によれば、自動装着機の真空吸着
ノズルで成形樹脂の天面を確実に吸着固定することが可
能と々るので、電子機器への装着作業を自動化すること
が可能である。また、成形樹脂が支持基板の上表面全域
を覆うため樹脂と支持基板との接着面積が著るしく広く
なる。Function: According to the luminous Yonago structure of the present invention, it is possible to reliably suction and fix the top surface of the molded resin with the vacuum suction nozzle of the automatic mounting machine, so it is possible to automate the mounting work on electronic equipment. It is. Furthermore, since the molded resin covers the entire upper surface of the support substrate, the bonding area between the resin and the support substrate becomes significantly large.
実施例
本発明の発光素子について、第１図を参照して詳しく説
明する。EXAMPLE A light emitting device of the present invention will be explained in detail with reference to FIG.
第１図は、本発明の発光素子の構造例を示す図で５ヘー
、
あり、第１図（ｄ）は斜視図、第１図（ｂ）は第１図（
ａ）のＢ−Ｂ線に沿った断面図である。FIG. 1 is a diagram showing an example of the structure of the light emitting device of the present invention, and FIG. 1(d) is a perspective view, and FIG.
It is a sectional view along line BB of a).
本発明の発光素子では、その製作にあたり、例えば、支
持基板１としてアルミナセラミック基板に銀・パラジウ
ム（Ａｄ−Ｐｄ）導体を印刷し、さらに焼成して金属膜
２と３を形成したものを準備する。ところで１、支持基
板１は図示するように金属膜２と３がアルミナセラミッ
ク基板の側面部でのび、しかも、１つの側面部のほぼ全
域が金属膜によって覆われた構造とされている。この支
持基板上の金属膜３に発光素子片４がボンディングがな
され、寸だ、金属細線５による接続がなされ、さらに、
透光性樹脂６による封止がなされて発光素子が形成され
ているが、この透光性樹脂６は、図示するように天面が
平坦な箱形形状である。In manufacturing the light-emitting device of the present invention, for example, a support substrate 1 is prepared by printing a silver-palladium (Ad-Pd) conductor on an alumina ceramic substrate and then firing it to form metal films 2 and 3. . By the way, 1. As shown in the figure, the supporting substrate 1 has a structure in which metal films 2 and 3 extend on the side surfaces of an alumina ceramic substrate, and moreover, almost the entire area of one side surface is covered with the metal films. A light emitting element piece 4 is bonded to the metal film 3 on this support substrate, and a connection is made with a thin metal wire 5, and further,
A light emitting element is formed by sealing with a translucent resin 6, and the translucent resin 6 has a box shape with a flat top surface as shown.
本発明の発光素子では、このような構造に加えて、支持
基板の透光性樹脂６による被覆部以外の表面上も薄い樹
脂層で覆われた構造が採用されている。In addition to such a structure, the light emitting element of the present invention employs a structure in which the surface of the support substrate other than the portion covered with the transparent resin 6 is also covered with a thin resin layer.
この薄い樹脂層の形成は、透光性樹脂６による封止の過
程で同時に行えばよい。Formation of this thin resin layer may be performed simultaneously with the process of sealing with the translucent resin 6.
６ ・
なお、透光性樹脂６の厚さは、必要最小限の厚さに選定
することかのぞ寸しい。6. It should be noted that the thickness of the transparent resin 6 must be selected to be the minimum necessary thickness.
発明の効果
本発明の発光素子は、天面が平坦な箱形形状の成形樹脂
で発光素子片の封止がなされたリードレス構造であり、
完成した発光素子を自動装着機で取り扱うことが可能で
あるため、電子機器への装着に際して作業を自動化する
ことができる。また、成形樹脂の厚みを必要最小限に抑
えるとともに、厚みの制御が高い精度でなされるため、
発光素子の小型化をはかり、これを利用する電子機器の
小型化をはかることができる。Effects of the Invention The light emitting device of the present invention has a leadless structure in which a light emitting device piece is sealed with a box-shaped molded resin with a flat top surface,
Since the completed light emitting element can be handled by an automatic mounting machine, it is possible to automate the work when mounting it on electronic equipment. In addition, the thickness of the molded resin can be kept to the minimum necessary and the thickness can be controlled with high precision.
By reducing the size of the light emitting element, it is possible to reduce the size of electronic equipment that utilizes the light emitting element.
さらに、本発明の発光素子では、支持基板」二の成形樹
脂による被覆部以外も薄い樹脂層で覆われるため、支持
基板に対する成形樹脂の付着面積が従来のものよりも著
るしく増え、両者間の接着強度が高まる。丑だ、支持基
板の側面部に対する金属膜の被着面積を増加させた構造
であるため、発光素子を電子機器へ固着する際の半田付
面積が増し、固着強度を高める効果も奏される。Furthermore, in the light-emitting element of the present invention, parts other than the part covered by the molded resin on the support substrate are also covered with a thin resin layer, so the adhesion area of the molded resin to the support substrate is significantly increased compared to the conventional one, and there is a gap between the two. Increases adhesive strength. Moreover, since the structure increases the adhesion area of the metal film to the side surface of the support substrate, the soldering area increases when attaching the light emitting element to the electronic device, which also has the effect of increasing the adhesion strength.
７ ｌｌ−7ll-
第１図（ａｌおよび（ｂ）は、本発明の発光素子の構造
を示す斜視図および断面図、第２図（、）および（ｂ）
は、従来の発光素子の構造を示す斜視図および断面図で
ある。
１・・・・・・支持基板、２，３・・・・・・金属膜、
４・・川・発光素子片、５・・・・・・金属細線、６・
・・・・透光性樹脂、７・・・・・・樹脂層。
代理人の氏名 弁理士 中 尾 敏 男 ほか１名７−
揖脂１
？
４−金七豪り牛FIG. 1 (al and b) is a perspective view and a cross-sectional view showing the structure of the light emitting device of the present invention, and FIG. 2 (,) and (b) are
1A and 1B are a perspective view and a cross-sectional view showing the structure of a conventional light emitting element. 1... Support substrate, 2, 3... Metal film,
4... River/light emitting element piece, 5... Fine metal wire, 6...
...Translucent resin, 7...Resin layer. Name of agent: Patent attorney Toshio Nakao and 1 other person7-
Ibaraki 1? 4-Kinnachi Goryu Cow
Claims (3)
部とこれに繋がるリード部とからなる第１の金属膜と、
金属細線接続部とこれに繋がるリード部とからなる第２
の金属膜とが形成され、さらに、前記第１および第２の
金属膜が前記絶縁性基板の相対向する第１および第２の
側面までのびて構成された支持基板の前記発光素子片接
着部に発光素子片が固着され、同発光素子片の電極と前
記金属細線接続部との間が金属細線で接続されるととも
に、天面が平坦となる箱形に透光性樹脂で封止されてい
ることを特徴とする発光素子。(1) A first metal film consisting of a light emitting element piece adhesive part and a lead part connected thereto on one main surface of a rectangular insulating substrate;
The second part consists of a thin metal wire connection part and a lead part connected to this part.
the light emitting element piece bonding portion of the supporting substrate, wherein the first and second metal films extend to opposing first and second side surfaces of the insulating substrate; A light-emitting element piece is fixed to the light-emitting element piece, the electrode of the light-emitting element piece and the metal thin wire connection part are connected by a thin metal wire, and the top surface is sealed in a box shape with a flat surface with a translucent resin. A light emitting element characterized by:
成形部とこれに繋がる樹脂薄層で覆われていることを特
徴とする特許請求の範囲第１項に記載の発光素子。(2) The entire area on one main surface of the insulating substrate is covered with a box-shaped transparent resin molded part and a thin resin layer connected thereto. Light emitting element.
金属膜が被着していることを特徴とする特許請求の範囲
第１項に記載の発光素子。(3) The light emitting device according to claim 1, wherein the first and second metal films are deposited over the entire first and second side surfaces.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP60082822A JPS61240687A (en) | 1985-04-18 | 1985-04-18 | Light-emitting element |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP60082822A JPS61240687A (en) | 1985-04-18 | 1985-04-18 | Light-emitting element |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS61240687A true JPS61240687A (en) | 1986-10-25 |
Family
ID=13785092
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP60082822A Pending JPS61240687A (en) | 1985-04-18 | 1985-04-18 | Light-emitting element |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS61240687A (en) |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| EP0996172A1 (en) * | 1998-10-23 | 2000-04-26 | Rohm Co., Ltd. | Chip type semiconductor light emitting device |
| EP1168461A2 (en) * | 2000-06-28 | 2002-01-02 | Agilent Technologies, Inc. (a Delaware corporation) | Light source |
| JP2011129646A (en) * | 2009-12-16 | 2011-06-30 | Panasonic Corp | Wiring board for led module, led module, and method of manufacturing wiring board for led module |
-
1985
- 1985-04-18 JP JP60082822A patent/JPS61240687A/en active Pending
Cited By (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| EP0996172A1 (en) * | 1998-10-23 | 2000-04-26 | Rohm Co., Ltd. | Chip type semiconductor light emitting device |
| US6180962B1 (en) | 1998-10-23 | 2001-01-30 | Rohm Co., Ltd. | Chip type semiconductor light emitting device having a solder preventive portion |
| EP1168461A2 (en) * | 2000-06-28 | 2002-01-02 | Agilent Technologies, Inc. (a Delaware corporation) | Light source |
| JP2002064226A (en) * | 2000-06-28 | 2002-02-28 | Agilent Technol Inc | Light source |
| EP1168461A3 (en) * | 2000-06-28 | 2003-01-22 | Agilent Technologies, Inc. (a Delaware corporation) | Light source |
| JP2011129646A (en) * | 2009-12-16 | 2011-06-30 | Panasonic Corp | Wiring board for led module, led module, and method of manufacturing wiring board for led module |
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