JPS60262476A - Light-emitting element - Google Patents

Light-emitting element

Info

Publication number
JPS60262476A
JPS60262476A JP59118426A JP11842684A JPS60262476A JP S60262476 A JPS60262476 A JP S60262476A JP 59118426 A JP59118426 A JP 59118426A JP 11842684 A JP11842684 A JP 11842684A JP S60262476 A JPS60262476 A JP S60262476A
Authority
JP
Japan
Prior art keywords
light
emitting element
substrate
frame
small
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP59118426A
Inventor
Hikoo Nakamura
Original Assignee
Matsushita Electric Ind Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Matsushita Electric Ind Co Ltd filed Critical Matsushita Electric Ind Co Ltd
Priority to JP59118426A priority Critical patent/JPS60262476A/en
Publication of JPS60262476A publication Critical patent/JPS60262476A/en
Application status is Pending legal-status Critical

Links

Classifications

    • HELECTRICITY
    • H01BASIC ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H01L33/00Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L33/48Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
    • H01L33/483Containers
    • H01L33/486Containers adapted for surface mounting
    • HELECTRICITY
    • H01BASIC ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H01L24/00Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/93Batch processes
    • H01L24/95Batch processes at chip-level, i.e. with connecting carried out on a plurality of singulated devices, i.e. on diced chips
    • H01L24/97Batch processes at chip-level, i.e. with connecting carried out on a plurality of singulated devices, i.e. on diced chips the devices being connected to a common substrate, e.g. interposer, said common substrate being separable into individual assemblies after connecting
    • HELECTRICITY
    • H01BASIC ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42Wire connectors; Manufacturing methods related thereto
    • H01L2224/47Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805Shape
    • H01L2224/4809Loop shape
    • H01L2224/48091Arched
    • HELECTRICITY
    • H01BASIC ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42Wire connectors; Manufacturing methods related thereto
    • H01L2224/47Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/481Disposition
    • H01L2224/48151Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/48221Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/48225Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
    • H01L2224/48227Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation connecting the wire to a bond pad of the item
    • HELECTRICITY
    • H01BASIC ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42Wire connectors; Manufacturing methods related thereto
    • H01L2224/47Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/484Connecting portions
    • H01L2224/48463Connecting portions the connecting portion on the bonding area of the semiconductor or solid-state body being a ball bond
    • H01L2224/48465Connecting portions the connecting portion on the bonding area of the semiconductor or solid-state body being a ball bond the other connecting portion not on the bonding area being a wedge bond, i.e. ball-to-wedge, regular stitch
    • HELECTRICITY
    • H01BASIC ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H01L2924/00Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/10Details of semiconductor or other solid state devices to be connected
    • H01L2924/11Device type
    • H01L2924/12Passive devices, e.g. 2 terminal devices
    • H01L2924/1204Optical Diode
    • H01L2924/12041LED
    • HELECTRICITY
    • H01BASIC ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H01L2924/00Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/15Details of package parts other than the semiconductor or other solid state devices to be connected
    • H01L2924/151Die mounting substrate
    • H01L2924/156Material
    • H01L2924/15786Material with a principal constituent of the material being a non metallic, non metalloid inorganic material
    • H01L2924/15787Ceramics, e.g. crystalline carbides, nitrides or oxides

Abstract

PURPOSE:To obtain a small-sized light-emitting element changed into a chip electrode by laminating a printed wiring substrate and a frame-shaped insulating substrate, incorporating a light-emitting element into the frame of the laminated substrates and sealing the light-emitting element by a resin. CONSTITUTION:Tungsten metallized through-hole electrodes 6 are formed to a ceramic substrate 5, and a frame-shaped ceramic substrate 7 is laminated onto the ceramic printed wiring substrate. The upper section of a surface wiring layer 8 in the substrate 5 is plated with a metal, and a light-emitting element 9 is formed onto the metallic plating through bonding. A high heat-resistant resin 10 having excellent adhesive properties to ceramics is injected into a space on the light-emitting element 9 and cured, thus obtaining a small-sized light-emitting diode element.
JP59118426A 1984-06-08 1984-06-08 Light-emitting element Pending JPS60262476A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP59118426A JPS60262476A (en) 1984-06-08 1984-06-08 Light-emitting element

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP59118426A JPS60262476A (en) 1984-06-08 1984-06-08 Light-emitting element

Publications (1)

Publication Number Publication Date
JPS60262476A true JPS60262476A (en) 1985-12-25

Family

ID=14736349

Family Applications (1)

Application Number Title Priority Date Filing Date
JP59118426A Pending JPS60262476A (en) 1984-06-08 1984-06-08 Light-emitting element

Country Status (1)

Country Link
JP (1) JPS60262476A (en)

Cited By (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH04363076A (en) * 1991-02-12 1992-12-15 Nec Corp Optical semiconductor device
JPH054529U (en) * 1991-06-27 1993-01-22 ローム株式会社 Structure of the chip-type light emitting diode
JPH0513818A (en) * 1991-07-05 1993-01-22 Sharp Corp Surface package-type light-emitting diode
JPH058959U (en) * 1991-07-17 1993-02-05 京セラ株式会社 For housing a light-emitting element bobbin
EP1011151A2 (en) * 1998-12-16 2000-06-21 Rohm Co., Ltd. Semiconductor device with reflector
DE10227515A1 (en) * 2001-12-24 2003-07-10 Samsung Electro Mech Light-emitting diode device
GB2406439A (en) * 2003-09-23 2005-03-30 Agilent Technologies Inc Ceramic packaging for high brightness LED devices
DE19549726B4 (en) * 1994-12-06 2010-04-22 Sharp K.K. Light emitting diode module for e.g. display panel, LCD back light - has LED chip enclosed in transparent resin package with electrodes being connected to respective P=type and N=type PN junction sides while passing through sealed respective insulating substrate hole
EP2270889B1 (en) * 2002-12-06 2016-03-30 Cree, Inc. LED package comprising leadframe and two-part heatsink
US10115870B2 (en) 2008-09-03 2018-10-30 Nichia Corporation Light emitting device, resin package, resin-molded body, and methods for manufacturing light emitting device, resin package and resin-molded body
JP2019016682A (en) * 2017-07-06 2019-01-31 E&E Japan株式会社 Chip LED

Cited By (16)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH04363076A (en) * 1991-02-12 1992-12-15 Nec Corp Optical semiconductor device
JPH054529U (en) * 1991-06-27 1993-01-22 ローム株式会社 Structure of the chip-type light emitting diode
JPH0513818A (en) * 1991-07-05 1993-01-22 Sharp Corp Surface package-type light-emitting diode
JPH058959U (en) * 1991-07-17 1993-02-05 京セラ株式会社 For housing a light-emitting element bobbin
DE19549726B4 (en) * 1994-12-06 2010-04-22 Sharp K.K. Light emitting diode module for e.g. display panel, LCD back light - has LED chip enclosed in transparent resin package with electrodes being connected to respective P=type and N=type PN junction sides while passing through sealed respective insulating substrate hole
EP1011151A2 (en) * 1998-12-16 2000-06-21 Rohm Co., Ltd. Semiconductor device with reflector
EP1011151A3 (en) * 1998-12-16 2001-08-01 Rohm Co., Ltd. Semiconductor device with reflector
US6355946B1 (en) 1998-12-16 2002-03-12 Rohm Co., Ltd. Semiconductor device with reflector
DE10227515A1 (en) * 2001-12-24 2003-07-10 Samsung Electro Mech Light-emitting diode device
DE10227515B4 (en) * 2001-12-24 2004-04-29 Samsung Electro-Mechanics Co., Ltd., Suwon Light diode with a ceramic substrate and reflector
EP2270889B1 (en) * 2002-12-06 2016-03-30 Cree, Inc. LED package comprising leadframe and two-part heatsink
GB2406439B (en) * 2003-09-23 2006-08-16 Agilent Technologies Inc Ceramic packaging for high brightness LED devices
GB2406439A (en) * 2003-09-23 2005-03-30 Agilent Technologies Inc Ceramic packaging for high brightness LED devices
US7854535B2 (en) 2003-09-23 2010-12-21 Avago Technologies Ecbu Ip (Singapore) Pte. Ltd. Ceramic packaging for high brightness LED devices
US10115870B2 (en) 2008-09-03 2018-10-30 Nichia Corporation Light emitting device, resin package, resin-molded body, and methods for manufacturing light emitting device, resin package and resin-molded body
JP2019016682A (en) * 2017-07-06 2019-01-31 E&E Japan株式会社 Chip LED

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