JPH058959U - Light emitting device storage package - Google Patents

Abstract

(57) [Abstract] [Purpose] To provide a package for housing a light-emitting element in which a light-emitting element housed inside can be accurately electrically connected to an external electric circuit. [Structure] A first groove 2a is formed from one side surface of a rectangular insulating substrate 1 having a recessed portion 1a for accommodating a light emitting element 4 on the upper surface to the upper surface, and the other side surface is formed from the bottom surface. The second groove portion 2b was formed over the same height as the bottom surface of the recess. Since the position of the first groove 2a can be confirmed from the upper surface of the insulating substrate 1, if the polarity of the light emitting element 4 is kept constant on the groove 2a side, when the light emitting device is surface-mounted on the wiring conductor of the external electric circuit board, It is possible to confirm the polarity of the light emitting element 4 housed in the device from the outside, whereby the light emitting element 4 can be accurately connected to an external electric circuit, and the light emitting element 4 can always emit light normally.

Description

[Detailed description of the device]

[0001]

[Industrial applications]

 The present invention relates to a package for housing a light emitting device used in a light emitting device, and more particularly to an improvement of a package for housing a light emitting device used in a light emitting device surface-mounted on a circuit wiring board.

[0002]

[Prior Art]

 Conventionally, as shown in FIGS. 4 and 5, a package for housing a light emitting element used in a light emitting device has a recess for accommodating the light emitting element 23 on the upper surface of a rectangular insulating substrate 21 made of an electrically insulating material such as alumina ceramics. It has a structure in which a pair of metallized wiring layers 22, 22 is formed and led out from the bottom surface of the recess to the bottom surface through the side surface. The light emitting element 23 is provided on the bottom surface of the recess of the insulating base 21. Of the metallized wiring layers 22 and 22 are electrically connected to each other via a conductive adhesive 24 so that they are electrically connected to each other, and then sealed in the concave portion of the insulating substrate 21 with a transparent resin portion or the like. A light emitting device as a final product is obtained by filling the material 25 and hermetically sealing the light emitting element 23.

In such a light emitting device, the metallized wiring layers 22 and 22 led out to the bottom surface of the insulating substrate 21 are adhered to the wiring conductors of the external circuit wiring board via an adhesive such as solder, and the metallized wiring layer 22 and Surface mounting is performed on the external circuit wiring board by electrically connecting 22 to a predetermined wiring conductor.

[0004]

[Problems to be solved by the device]

 However, in this conventional light emitting device, the light emitting element housed inside has a polarity, whereas the light emitting element housing package does not have a mark for recognizing the polarity. A light-emitting device that contains a light-emitting element in a package for a light source cannot recognize the polarity of the light-emitting element from the outside. As a result, when the light-emitting device is surface-mounted on the wiring conductor of the external circuit wiring board, The polarity of the light emitting element is often reversed, and when the polarity of the light emitting element is reversed, the problem that the light emitting device does not emit light even when power is applied to the light emitting element 23 occurs. ..

In order to solve the above-mentioned drawbacks, a paint or the like is printed on the outer surface of the insulating substrate that constitutes the package for housing the light emitting element to attach a mark to the light emitting element housed inside the light emitting device. It is conceivable to make the polarity recognizable.

However, when a mark such as paint is attached to the outer surface of the insulating base, when the light emitting element is attached to the bottom surface of the concave portion of the insulating base by using an automatic machine or the like, the outer surface of the insulating base is a line of the automatic machine. The above-mentioned drawbacks cannot be completely eliminated because the sign easily peels off when sliding on the top.

[0007]

[Means for Solving the Problems]

 According to the present invention, a first groove is formed on one of the opposite side surfaces of a rectangular insulating substrate having a recess for accommodating a light emitting element on the top surface from the bottom surface to the top surface, and on the other side surface from the bottom surface to the recess bottom surface. It is characterized in that the second groove portion is formed over substantially the same height.

[0008]

【Example】

 Next, the present invention will be described in detail with reference to the accompanying drawings. FIG. 1 is a sectional view showing an embodiment of a package for housing a light emitting device of the present invention, FIG. 2 is a plan view thereof, 1 is a rectangular insulating substrate, 2a and 2b are grooves, and 3 is a metallized wiring layer. Is.

The insulating base 1 is made of an electrically insulating material such as alumina ceramics, and a recess 1a for accommodating a light emitting element is provided on the upper surface thereof, and the light emitting element 4 is provided with a conductive adhesive 5 on the bottom surface of the recess 1a. It is attached and fixed via.

Further, the insulating base 1 has a first groove portion 2a on one of the opposite side surfaces from the bottom surface to the top surface, and on the other side surface from the bottom surface to the substantially same height as the bottom surface of the recess 1a. Two groove portions 2b are formed.

The groove portion 2a provided in the insulating base 1 is formed from the bottom surface to the upper surface of the insulating base 1, and its position can be confirmed from the upper surface of the insulating base 1. Therefore, a mark for recognizing the polarity of the light emitting element 4 housed inside is provided. When the light emitting device 4 is housed in the wiring conductor of the external electric circuit board, the light emitting device 4 is housed in the recess 1a of the insulating substrate 1 with the + side of the light emitting device 4 as the groove 2a side. By checking the position of the groove 2a and connecting the groove a side to the + side of the wiring conductor of the external electric circuit board, the light emitting element 4 can be accurately connected to the external electric circuit. It is possible to always emit light accurately. The grooves 2a and 2b provided on the insulating base 1 also function as wiring forming grooves when forming the metallized wiring layer 3, and a pair of grooves are formed from the bottom of the recess 1a of the insulating base 1 to the bottom of the insulating base 1 through the side surface. When the metallized wiring layers 3 and 3 are led out, the metallized wiring layers 3 are formed in the groove portions 2a and 2b on the side surface of the insulating substrate 1.

The pair of metallized wiring layers 3 and 3 serve to electrically connect the light emitting element 4 housed inside to an external electric circuit, and the metallized wiring layer 3 emits light at the bottom of the concave portion 1 a. The electrodes of the element 4 and the wiring conductor of the external electric circuit board are connected to the bottom surface of the insulating substrate 1, respectively.

The pair of metallized wiring layers 3, 3 are made of a high melting point metal powder such as tungsten and molybdenum, and are deposited on the insulating substrate 1 at predetermined positions by a conventionally known screen printing method or the like.

The pair of metallized wiring layers 3 and 3 are formed by depositing a metal such as nickel and gold having excellent corrosion resistance and good conductivity on the exposed outer surface by plating to a thickness of 1.0 to 20.0 μm. If so, the oxidative corrosion of the metallized wiring layers 3 and 3 is effectively prevented, and the electrical connection between the metallized wiring layers 3 and 3 and the electrode of the light emitting element and the external electric circuit becomes very good. Therefore, in order to prevent oxidative corrosion of the metallized wiring layers 3 and 3 and to make good electrical connection with the electrodes of the light emitting element and the external electric circuit, nickel, gold, etc. should be formed on the exposed outer surface of the metallized wiring layers 3 and 3. It is preferable that the above metal is deposited by plating to a thickness of 1.0 to 20.0 μm.

Thus, according to the package for accommodating the light emitting device of the present invention, the light emitting device 4 is formed on the bottom surface of the recess 1a of the insulating substrate 1, and the electrodes of the light emitting device 4 are electrically connected to the pair of metallized wiring layers 3 3 respectively. To secure the light emitting element 4 in a hermetically sealed state by attaching and fixing it via a conductive adhesive 5 so that the light emitting element 4 is sealed in the recess 1a. By doing so, it becomes a light emitting device as a final product.

Next, a method of manufacturing the package for housing the light emitting device of the present invention will be described with reference to FIG.

First, two ceramic green sheets 11a and 11b to be the insulating substrate 1 are prepared.

The two ceramic green sheets 11a and 11b are, for example, organic solvents and solvents suitable for raw material powders such as alumina (Al ₂ O ₃ ), silica (SiO ₂ ), magnesia (MgO) and calcia (CaO). It is formed by adding and mixing to form a sludge shape, and forming it into a sheet shape by using a conventionally known doctor blade method, calender roll method or the like. Next, the ceramic green sheet 11a is formed with a through hole A which will be the groove 2a and a through hole B which will be the groove 2b of the insulating substrate 1, and the ceramic green sheet 11b will be provided with a recess 1a for accommodating the light emitting element 4 of the insulating substrate 1. A through hole C for forming the groove and a through hole D to be the groove portion 2a are formed.

Each of the through holes A, B, C and D formed in the ceramic green sheets 11a and 11b is a conventionally known ceramic punching method, specifically, punching a ceramic green sheet with a punching punch. Thus, the ceramic green sheets 11a and 11b are formed to have predetermined sizes at predetermined positions.

Then, a metal paste is printed and applied to the ceramic green sheet 11a from the upper surface of the ceramic green sheet 11a to the bottom surface thereof through the through holes A and B to form the metallized wiring metal layers 3 and 3. 13 and 13 are attached.

The metallized wiring metal layers 13, 13 are made of a high melting point metal powder such as tungsten, molybdenum, manganese, etc. The metal paste obtained by adding and mixing an organic solvent and a solvent to the metal powder is a conventionally known screen printing method or the like. The thick film method is applied to the ceramic green sheet 11a in a predetermined pattern to form a predetermined pattern.

Finally, the ceramic green sheet 11b is placed on the upper surface of the ceramic green sheet 11a so that the through holes D are aligned with the through holes A to form a green laminated body and the laminated body at high temperature ( After firing at about 1600 ° C), the two ceramic green sheets 11a and 11b and the metallized wiring metal layers 13 and 13 are sintered and integrated to form a ceramic sintered body. By dividing into a plurality of pieces along the dividing line EE, a rectangular insulating base 1 having a pair of metallized wiring layers 3 and 3 shown in FIGS. 1 and 2 is obtained.

[0023]

[Effect of the device]

 According to the package for housing a light emitting device of the present invention, a groove is formed from the bottom surface to the top surface on one of the opposite side surfaces of a rectangular insulating substrate having a recess for housing the light emitting element. If the groove side is accommodated as the + side, for example, when the light emitting device is surface-mounted on the wiring conductor of the external electric circuit board, the position of the groove section is confirmed, and the groove side is + of the wiring conductor of the external electric circuit board. If it is connected to the side, the light emitting element can be accurately connected to the external electric circuit, and thus the light emitting element can always emit light accurately.

[Brief description of drawings]

FIG. 1 is a sectional view showing an embodiment of a package for housing a light emitting device according to the present invention.

FIG. 2 is a plan view of the package of FIG.

FIG. 3 is a partial cross-sectional view for explaining the method of manufacturing the package shown in FIG.

FIG. 4 is a cross-sectional view of a conventional light emitting device housing package.

5 is a plan view of the package of FIG.

[Explanation of symbols]

 1 ... Insulating substrate 2a, 2b ... Groove 3 ... Metallized wiring layer 4 ... Light emitting element 5 ... Conductive adhesive 6 ... Encapsulating material

Claims (1)

Claims for utility model registration: 1. A first groove is formed from the bottom surface to the top surface on one of opposite side surfaces of a rectangular insulating substrate having a recess for accommodating a light emitting element on the top surface, and The second side extends from the bottom surface to substantially the same height as the bottom surface of the recess.
A package for housing a light-emitting element, characterized in that the groove portion is formed.