JPH0513818A - Surface package-type light-emitting diode - Google Patents

Abstract

PURPOSE:To make three kinds or more of LED chips to be housed in one package by a method wherein electrode parts of the form of a through hole are respectively provided at the four corners of a chip placing part and the electrodes of the LED chips placed on the chip placing part are respectively connected to some one of the electrode parts provided at the four corners. CONSTITUTION:Through holes 5 are respectively formed in the four corners of a chip placing part 2. Electrodes 6a, 6b, 6c and 6d are respectively formed at the parts of these holes 5 by a plating treatment. A common electrode 3a, a red electrode 3b, a blue electrode 3c and a yellow and green electrode 3d are respectively connected to the electrodes 6a, 6b, 6c and 6d. When an LED is subjected to surface package, the electrodes 6a to 6d are made to electrically connect to the upper part of a mounting substrate. Thereby, a mounting density can be improved. Moreover, the electrode parts are respectively constituted of the through holes 5, whereby the self-alignment effect of the electrode parts at the time of a solder reflow is high and the positional accuracy of the electrode parts can be improved.

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to an improvement of a surface mount type light emitting diode element on which three or less types of light emitting diode (LED) chips are mounted.

[0002]

2. Description of the Related Art Usually, a surface-mount type LED has an LED chip mounted and bonded on a lead frame,
It is formed by sealing with epoxy resin or the like. For example, FIG. 6 shows a plan view of a conventional surface mount LED, in which an LED chip (not shown) is encapsulated in a mold resin 11 and a lead frame terminal 12 is projected from the mold resin 11. The LED shown in the figure is one in which two types of LED chips are enclosed, and there are two pairs of lead terminals 12a and 12b.
Is projected. FIG. 7 is a circuit diagram of an LED in which the two pairs of LED chips are enclosed.

[0003]

By the way, in recent years blue L
Development of ED is in progress. Along with this, attention has been focused on the development of an LED that accommodates three types of LED chips of blue, green, and red in one package instead of the package that accommodates the two types of LED chips shown in FIG.

An object of the present invention is to provide a surface mount LED in which three or less kinds of LED chips are housed in one package.
To provide.

[0005]

A surface mount type light emitting diode of the present invention has not more than three kinds of LED chip mounting portions and through-hole shaped electrode portions at four corners of the chip mounting portions. , LED mounted on the chip mounting part
It is characterized in that the electrodes of the chip are connected to any of the four corner electrode portions.

A lens portion having an arbitrary shape may be provided on the electrode portion.

[0007]

In the present invention, the electrode portions are provided at the four corners of the chip mounting portion. For example, when three types of LED chips are mounted on the chip mounting portion, one of the four electrode portions is 3 types of LE with common electrode and other 3 as individual electrodes
D chips can be connected. A lens portion having an arbitrary shape is formed on the mounting portion of the LED chip to collect the light of the LED chip.

[0008]

1 (A), 1 (B) and 1 (C) are a plan view, a side view and a bottom view of a surface mount type LED according to an embodiment of the present invention, and FIGS. Example LED
It is the figure which showed. 4 is a plan view of a substrate used for these LEDs, and FIG. 5 is a circuit diagram of the LED.

In FIG. 4, circular chip mounting portions 2 are arranged in a matrix on the surface of the substrate 1. The diameter of the chip mounting portion 2 is approximately 3.5 to 7.5 mm, and the electrodes 3a, 3b, 3c and 3d are formed on the surface of the chip mounting portion 2 as shown in FIGS. Has been formed. The electrodes 3a to 3d are a common electrode 3a, a red electrode 3b, a blue electrode 3c, and a yellow-green electrode 3d, respectively.
LED chips 4b, 4c, and 4d are mounted on a. LED chip 4b is a red LED, LED chip 4c
Is a blue LED, and the LED chip 4d is a yellow-green LED. The two blue LEDs 4c are mounted because the blue LEDs have low brightness.

Through holes 5 are provided at the four corners of the chip mounting portion 2.
Are formed. Electrodes 6a, 6b, 6c and 6d are formed in the through holes 5 by plating. The common electrode 3a is connected to the electrode 6a, the red electrode 3b is connected to the electrode 6b, the blue electrode 3c is connected to the electrode 6c, and the yellow-green electrode 3d is connected to the electrode 6d. The electrodes 6a to 6d are L
When the ED is surface-mounted, it is electrically connected to the mounting board. FIG. 5 shows a circuit diagram of the connection. On the upper surface of the chip mounting portion 2 on which the LED chips are mounted, resin is molded into a shape such as a convex lens shape, a planar shape, or a concave lens shape by a process such as transfer molding. 1, FIG. 2 and FIG. 3 respectively show a mold resin having a convex lens shape (7 in FIG. 1), a planar shape (8 in FIG. 2) and a concave lens shape (FIG. 3).
It is formed in 9).

After the LED chip mounting, resin molding and the like as described above are performed on the substrate 1 as shown in FIG. 4, the matrix substrate is cut into individual LEDs. The figures showing this state are shown in FIGS.

[0012]

Since the LED of the present invention is a surface mounting type, the mounting density is improved and the electrode portion is a chip mounting portion.
Since it is provided in the through hole formed in the corner, the mounting density can be further improved as compared with the conventional configuration in which the leads protrude laterally. In addition, since the electrode portion is configured by the through hole, there is an advantage that the self-alignment effect at the time of solder reflow is high and the positional accuracy is improved.

[Brief description of drawings]

FIG. 1 is a plan view, a side view, and a bottom view of an LED that is an embodiment of the present invention.

FIG. 2 is a plan view, a side view, and a bottom view of an LED of another embodiment.

FIG. 3 is a plan view, a side view, and a bottom view of an LED of another embodiment.

FIG. 4 is a plan view of a substrate on which LEDs are mounted.

FIG. 5 is a circuit diagram of an LED in which three types of LED chips of the present invention are packaged.

FIG. 6 is a plan view of a conventional surface mount LED.

FIG. 7 is a circuit diagram of a conventional LED packaged with two types of LED chips.

[Explanation of symbols]

1 substrate 2 Chip mounting part 3a, 3b, 3c, 3d electrodes 4b, 4c, 4d LED chips 5 through holes 6a, 6b, 6c, 6d electrodes 7,8,9 Mold resin

Claims (2)

[Claims] 1. A chip mounting portion for mounting three or less types of light emitting diode chips, and through-hole shaped electrode portions at four corners of the chip mounting portion are mounted on the chip mounting portion. A surface mount type light emitting diode in which the electrodes of the LED chip are connected to any of the four corners. 2. A surface-mounted light emitting diode, wherein a lens portion having an arbitrary shape is provided on the electrode portion.