JPH06283561A - Package of semiconductor device - Google Patents

Abstract

PURPOSE:To obtain a package of semiconductor device capable of being manufactured at extremely low cost. CONSTITUTION:Linearly arrayed through holes 11 and wiring patterns 12 concentrated from respective through holes 11 on the position for mounting a semiconductor flip chip 2 are formed on a printed-wiring substrate 1 so as to junction respective end parts 13 of the concentrated wiring patterns 12 with the terminals of the semiconductor flip chip 2 through the intermediary of a bump 21. Besides, after coating the semiconductor chip 2 with a synthetic resin 14, the printed- wiring substrate 1 is cut off as if dividing itself along almost central line of the linearly arrayed respective through holes 11 to turn the through holes 10 of the cut-off respective halves into terminals. Furthermore, respective end parts 13 of the wiring patterns 12 are connected to the terminals of the semiconductor flip chip 2 by wire-bonding step.

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a semiconductor device package, and more particularly to a semiconductor device package which can be manufactured at low cost.

[0002]

2. Description of the Related Art As a package for sealing a semiconductor element, various packages such as a ceramic package using a lead frame, a package molded with a synthetic resin, a package in which a semiconductor flip chip having bumps is bonded to a tape carrier are conventionally available. More suggested.

[0003]

However, in such a conventional semiconductor device package, the cost of the semiconductor chip is often higher than the cost of the semiconductor chip, and the package is inexpensive and suitable for mass production. Was expected.

[0004]

SOLUTION: A printed wiring board is formed with a plurality of linearly arranged through holes and a wiring pattern concentrated from the through holes at a position where a semiconductor flip chip is mounted, Connect each tip of the wiring pattern to the terminal of the semiconductor chip, coat the semiconductor chip with synthetic resin, and cut the printed wiring board so that it is divided along almost the center of each through hole arranged linearly. The divided through holes are used as terminals.

[0005]

DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS A semiconductor device package according to the present invention is shown in FIG.
As shown in the side view of FIG. 1, it is mainly suitable for sealing the semiconductor flip chip 2 having the bumps 21 formed on the surface of the semiconductor chip by swelling the connection parts to be electrodes with solder or the like. Next, the package of the present invention will be described in the order of manufacturing steps.

(First Embodiment) A plan view of FIG. 1 and FIG.
As shown in the sectional view of (a), the printed wiring board 1 is provided with a plurality of through holes 11 so as to surround a rectangular plane 15, and the wiring pattern 12 is formed from each of these through holes 11 toward the center of the plane 15. And the end portions 13 of the wiring pattern 12 concentrated in the center are bumps of the semiconductor flip chip 2.
Prepare the one positioned so as to correspond to 21.

A plurality of basic patterns composed of such a plurality of through holes 11 and wiring patterns 12 and separated by dotted lines are repeatedly formed in a plane shape in the vertical and horizontal directions of the printed wiring board 1.

Then, as shown in the sectional view of FIG.
In the central part where the wiring patterns 12 of each basic pattern are concentrated,
The semiconductor flip chip 2 is inverted and placed. At this time, the bumps 21 of the semiconductor flip chip 2 are aligned and placed on each end portion 13 of the wiring pattern 12, and soldered and connected.

Next, as shown in the sectional view of FIG. 2 (c), after masking the through holes 11 of the printed wiring board 1 to prevent the resin from flowing in, the entire semiconductor flip chip 2 including The synthetic resin 14 is coated so as to cover the surface. After the coated synthetic resin 14 is cured, the synthetic resin 14 is cut substantially along the center of the through hole 11 shown by the dotted line in FIG. As shown in the cross-sectional view and the perspective view of FIG. 3, each of the cut through holes 10 is a terminal package.

(Second Embodiment) When the printed wiring board is larger than the semiconductor chip to be mounted, it is not necessary to coat it with a synthetic resin so as to cover the entire surface of the printed wiring board. In that case, as shown in FIG. 4A, after the resist is applied to the central portion where the wiring patterns 12 of each basic pattern are concentrated, the through holes 11 and the remaining wiring patterns are formed.
Solder plating is applied to 12 and the printed wiring board 1 with the resist removed is prepared. If solder plating is not required, this step can be omitted.

Then, as shown in the sectional view of FIG.
In the central part where the wiring patterns 12 of the printed wiring board 1 are concentrated,
Place the semiconductor flip chip 2 and
Each bump 21 of the chip 2 and each end 13 of the wiring pattern 12 are connected.

Next, as shown in the sectional view of FIG. 4C, a synthetic resin 14 is coated and cured so as to cover at least the surface including the semiconductor flip chip 2, and
By cutting along substantially the center of the through hole 11, as shown in FIG. 4D, a package is formed in which each of the cut through holes 10 serves as a terminal.

(Third Embodiment) In each of the embodiments described above, a plurality of through holes 11 are provided so as to surround a rectangular plane 15 on which the semiconductor flip chip 2 is mounted. The arrangement is not limited to such a square, and the terminals are formed by arranging linearly and forming a half-through hole on the side surface like a dual in-line package (DIP) or a single in-line package (SIP). May be.

When a semiconductor chip having no bumps is sealed, the terminals of the semiconductor chip and each tip of the wiring pattern may be connected by wire bonding.

The package of the present invention is not limited to the sealing of semiconductor chips, but is also applicable to the sealing of various electronic components such as the sealing of small electronic circuit elements formed on a substrate such as ceramic or glass. be able to.

The semiconductor device or similar device sealed by each of the embodiments described above is suitable for surface mounting.
That is, as shown in the cross-sectional view of FIG. 5, the wiring pattern 31 of the printed wiring board 3 to be mounted is temporarily fixed with the adhesive 4 and then the half through hole 10 and the wiring pattern 31 are connected by the solder 5. And fix it.

[0017]

As is clear from the description based on the above embodiments, according to the semiconductor device package of the present invention,
It can be manufactured at extremely low cost without requiring expensive equipment and materials.

[Brief description of drawings]

FIG. 1 is a plan view showing an example of a wiring pattern of a printed wiring board used in a package of a semiconductor device of the present invention,

FIG. 2 is a sectional view showing an embodiment of the present invention in the order of manufacturing steps,

3 is a perspective view showing a semiconductor device packaged according to the embodiment of FIG.

FIG. 4 is a sectional view showing another embodiment of the present invention in the order of manufacturing steps,

5 is a sectional view showing a state in which the semiconductor device packaged according to the embodiment of FIG. 2 is surface-mounted;

FIG. 6 is a side view showing a semiconductor flip chip packaged according to the present invention.

[Explanation of symbols]

 1 Printed Wiring Board 10 Cut Half Hole (Terminal) 11 Through Hole 12 Wiring Pattern 13 End of Wiring Pattern 14 Coated Synthetic Resin 15 Plane Surrounding Semiconductor Flip Chip 2 Semiconductor Flip Chip 21 Bump 3 Mounting Printed wiring board 4 adhesive 5 solder

Claims (2)

[Claims] 1. A printed wiring board is provided with a plurality of linearly arranged through holes, and a wiring pattern concentrated from the through holes to a position where a semiconductor chip is mounted,
After connecting the respective tips of the concentrated wiring pattern to the terminals of the semiconductor chip and coating the semiconductor chip with a synthetic resin, the printed wiring board is divided so as to divide the through holes arranged in a line. A package of a semiconductor device, wherein each through hole obtained by cutting and dividing is used as a terminal. 2. The printed wiring board including a semiconductor chip is coated on its entire surface with a synthetic resin, and the printed wiring board is cut so as to divide each through hole together with the coated synthetic resin. 1. The semiconductor device package according to 1.