JPS61240665A - 半導体装置 - Google Patents

半導体装置

Info

Publication number
JPS61240665A
JPS61240665A JP8182785A JP8182785A JPS61240665A JP S61240665 A JPS61240665 A JP S61240665A JP 8182785 A JP8182785 A JP 8182785A JP 8182785 A JP8182785 A JP 8182785A JP S61240665 A JPS61240665 A JP S61240665A
Authority
JP
Japan
Prior art keywords
heat sink
thermal expansion
copper
semiconductor element
expansion coefficient
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP8182785A
Other languages
English (en)
Japanese (ja)
Other versions
JPH0322706B2 (enrdf_load_stackoverflow
Inventor
Akira Kazami
風見　明
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Sanyo Electric Co Ltd
Original Assignee
Sanyo Electric Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Sanyo Electric Co Ltd filed Critical Sanyo Electric Co Ltd
Priority to JP8182785A priority Critical patent/JPS61240665A/ja
Publication of JPS61240665A publication Critical patent/JPS61240665A/ja
Publication of JPH0322706B2 publication Critical patent/JPH0322706B2/ja
Granted legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/36—Selection of materials, or shaping, to facilitate cooling or heating, e.g. heatsinks
    • H01L23/373—Cooling facilitated by selection of materials for the device or materials for thermal expansion adaptation, e.g. carbon
    • H01L23/3735—Laminates or multilayers, e.g. direct bond copper ceramic substrates
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00

Landscapes

  • Engineering & Computer Science (AREA)
  • Chemical & Material Sciences (AREA)
  • Ceramic Engineering (AREA)
  • Materials Engineering (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
JP8182785A 1985-04-17 1985-04-17 半導体装置 Granted JPS61240665A (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP8182785A JPS61240665A (ja) 1985-04-17 1985-04-17 半導体装置

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP8182785A JPS61240665A (ja) 1985-04-17 1985-04-17 半導体装置

Publications (2)

Publication Number Publication Date
JPS61240665A true JPS61240665A (ja) 1986-10-25
JPH0322706B2 JPH0322706B2 (enrdf_load_stackoverflow) 1991-03-27

Family

ID=13757304

Family Applications (1)

Application Number Title Priority Date Filing Date
JP8182785A Granted JPS61240665A (ja) 1985-04-17 1985-04-17 半導体装置

Country Status (1)

Country Link
JP (1) JPS61240665A (enrdf_load_stackoverflow)

Cited By (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH02104641U (enrdf_load_stackoverflow) * 1989-02-06 1990-08-20
JPH0475369A (ja) * 1990-07-18 1992-03-10 Hitachi Ltd 電子装置と、これを用いたエンジンの点火装置
JPH0511450U (ja) * 1991-07-22 1993-02-12 三洋電機株式会社 混成集積回路
JPH0515440U (ja) * 1991-07-31 1993-02-26 京セラ株式会社 光半導体素子収納用パツケージ
JPH06188324A (ja) * 1992-12-16 1994-07-08 Kyocera Corp 半導体装置
EP0746022A1 (en) * 1995-05-30 1996-12-04 Motorola, Inc. Hybrid multi-chip module and method of fabricating
GB2401481A (en) * 2003-04-30 2004-11-10 Agilent Technologies Inc Application specific heat sink assembly
JP2006013368A (ja) * 2004-06-29 2006-01-12 Sanyo Electric Co Ltd 回路装置およびその製造方法
US7456492B2 (en) 2005-12-26 2008-11-25 Denso Corporation Semiconductor device having semiconductor element, insulation substrate and metal electrode

Cited By (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH02104641U (enrdf_load_stackoverflow) * 1989-02-06 1990-08-20
JPH0475369A (ja) * 1990-07-18 1992-03-10 Hitachi Ltd 電子装置と、これを用いたエンジンの点火装置
JPH0511450U (ja) * 1991-07-22 1993-02-12 三洋電機株式会社 混成集積回路
JPH0515440U (ja) * 1991-07-31 1993-02-26 京セラ株式会社 光半導体素子収納用パツケージ
JPH06188324A (ja) * 1992-12-16 1994-07-08 Kyocera Corp 半導体装置
EP0746022A1 (en) * 1995-05-30 1996-12-04 Motorola, Inc. Hybrid multi-chip module and method of fabricating
US5751552A (en) * 1995-05-30 1998-05-12 Motorola, Inc. Semiconductor device balancing thermal expansion coefficient mismatch
GB2401481A (en) * 2003-04-30 2004-11-10 Agilent Technologies Inc Application specific heat sink assembly
GB2401481B (en) * 2003-04-30 2006-07-12 Agilent Technologies Inc Heat sink
JP2006013368A (ja) * 2004-06-29 2006-01-12 Sanyo Electric Co Ltd 回路装置およびその製造方法
US7456492B2 (en) 2005-12-26 2008-11-25 Denso Corporation Semiconductor device having semiconductor element, insulation substrate and metal electrode

Also Published As

Publication number Publication date
JPH0322706B2 (enrdf_load_stackoverflow) 1991-03-27

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Legal Events

Date Code Title Description
EXPY Cancellation because of completion of term