JPS61237429A - 蒸気乾燥洗浄装置 - Google Patents

蒸気乾燥洗浄装置

Info

Publication number
JPS61237429A
JPS61237429A JP60078397A JP7839785A JPS61237429A JP S61237429 A JPS61237429 A JP S61237429A JP 60078397 A JP60078397 A JP 60078397A JP 7839785 A JP7839785 A JP 7839785A JP S61237429 A JPS61237429 A JP S61237429A
Authority
JP
Japan
Prior art keywords
ipa
water
container
cleaning
vapor
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP60078397A
Other languages
English (en)
Japanese (ja)
Other versions
JPH0457094B2 (https=
Inventor
Masaki Kusuhara
昌樹 楠原
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Wakomu KK
Original Assignee
Wakomu KK
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Wakomu KK filed Critical Wakomu KK
Priority to JP60078397A priority Critical patent/JPS61237429A/ja
Priority to US06/821,545 priority patent/US4736758A/en
Priority to EP86101834A priority patent/EP0198169B1/en
Priority to AT86101834T priority patent/ATE75784T1/de
Priority to DE8686101834T priority patent/DE3685148D1/de
Publication of JPS61237429A publication Critical patent/JPS61237429A/ja
Priority to US07/108,555 priority patent/US4777970A/en
Publication of JPH0457094B2 publication Critical patent/JPH0457094B2/ja
Granted legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/04—Apparatus for manufacture or treatment
    • H10P72/0402—Apparatus for fluid treatment
    • H10P72/0406—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like
    • H10P72/0408—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for drying
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B01—PHYSICAL OR CHEMICAL PROCESSES OR APPARATUS IN GENERAL
    • B01D—SEPARATION
    • B01D12/00—Displacing liquid, e.g. from wet solids or from dispersions of liquids or from solids in liquids, by means of another liquid
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23G—CLEANING OR DE-GREASING OF METALLIC MATERIAL BY CHEMICAL METHODS OTHER THAN ELECTROLYSIS
    • C23G5/00—Cleaning or de-greasing metallic material by other methods; Apparatus for cleaning or de-greasing metallic material with organic solvents
    • C23G5/02—Cleaning or de-greasing metallic material by other methods; Apparatus for cleaning or de-greasing metallic material with organic solvents using organic solvents
    • C23G5/04—Apparatus
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F26—DRYING
    • F26B—DRYING SOLID MATERIALS OR OBJECTS BY REMOVING LIQUID THEREFROM
    • F26B21/00—Arrangements for supplying or controlling air or other gases for drying solid materials or objects
    • F26B21/40—Arrangements for supplying or controlling air or other gases for drying solid materials or objects using gases other than air
    • F26B21/471—Arrangements for supplying or controlling air or other gases for drying solid materials or objects using gases other than air condensing vapours onto the surface of the materials to be dried

Landscapes

  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • General Engineering & Computer Science (AREA)
  • General Chemical & Material Sciences (AREA)
  • Materials Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Dispersion Chemistry (AREA)
  • Cleaning Or Drying Semiconductors (AREA)
  • Cleaning By Liquid Or Steam (AREA)
JP60078397A 1985-04-15 1985-04-15 蒸気乾燥洗浄装置 Granted JPS61237429A (ja)

Priority Applications (6)

Application Number Priority Date Filing Date Title
JP60078397A JPS61237429A (ja) 1985-04-15 1985-04-15 蒸気乾燥洗浄装置
US06/821,545 US4736758A (en) 1985-04-15 1986-01-21 Vapor drying apparatus
EP86101834A EP0198169B1 (en) 1985-04-15 1986-02-13 Vapor drying apparatus
AT86101834T ATE75784T1 (de) 1985-04-15 1986-02-13 Einrichtung zum dampftrocknen.
DE8686101834T DE3685148D1 (de) 1985-04-15 1986-02-13 Einrichtung zum dampftrocknen.
US07/108,555 US4777970A (en) 1985-04-15 1987-10-14 Vapor drying apparatus

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP60078397A JPS61237429A (ja) 1985-04-15 1985-04-15 蒸気乾燥洗浄装置

Publications (2)

Publication Number Publication Date
JPS61237429A true JPS61237429A (ja) 1986-10-22
JPH0457094B2 JPH0457094B2 (https=) 1992-09-10

Family

ID=13660883

Family Applications (1)

Application Number Title Priority Date Filing Date
JP60078397A Granted JPS61237429A (ja) 1985-04-15 1985-04-15 蒸気乾燥洗浄装置

Country Status (1)

Country Link
JP (1) JPS61237429A (https=)

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5431179A (en) * 1993-02-16 1995-07-11 Tokyo Electron Limited Wafer drying apparatus and fire-extinguishing method therefor
JPH07211689A (ja) * 1994-01-18 1995-08-11 Shin Etsu Handotai Co Ltd ウェーハホルダー
US5443540A (en) * 1992-12-25 1995-08-22 Tokyo Electron Limited Apparatus and method for drying substrates

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5310274U (https=) * 1976-07-09 1978-01-27
JPS5850740A (ja) * 1981-09-21 1983-03-25 Hitachi Ltd 半導体処理装置

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5310274U (https=) * 1976-07-09 1978-01-27
JPS5850740A (ja) * 1981-09-21 1983-03-25 Hitachi Ltd 半導体処理装置

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5443540A (en) * 1992-12-25 1995-08-22 Tokyo Electron Limited Apparatus and method for drying substrates
US5431179A (en) * 1993-02-16 1995-07-11 Tokyo Electron Limited Wafer drying apparatus and fire-extinguishing method therefor
JPH07211689A (ja) * 1994-01-18 1995-08-11 Shin Etsu Handotai Co Ltd ウェーハホルダー

Also Published As

Publication number Publication date
JPH0457094B2 (https=) 1992-09-10

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Legal Events

Date Code Title Description
EXPY Cancellation because of completion of term