JPS61233506A - 結晶へき開方法およびその装置 - Google Patents

結晶へき開方法およびその装置

Info

Publication number
JPS61233506A
JPS61233506A JP60074360A JP7436085A JPS61233506A JP S61233506 A JPS61233506 A JP S61233506A JP 60074360 A JP60074360 A JP 60074360A JP 7436085 A JP7436085 A JP 7436085A JP S61233506 A JPS61233506 A JP S61233506A
Authority
JP
Japan
Prior art keywords
crystal
plate
pair
base plate
clamping bodies
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP60074360A
Other languages
English (en)
Japanese (ja)
Other versions
JPH0134126B2 (enExample
Inventor
一郎 加藤
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Toshiba Corp
Original Assignee
Toshiba Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Toshiba Corp filed Critical Toshiba Corp
Priority to JP60074360A priority Critical patent/JPS61233506A/ja
Publication of JPS61233506A publication Critical patent/JPS61233506A/ja
Publication of JPH0134126B2 publication Critical patent/JPH0134126B2/ja
Granted legal-status Critical Current

Links

Landscapes

  • Processing Of Stones Or Stones Resemblance Materials (AREA)
  • Dicing (AREA)
  • Semiconductor Lasers (AREA)
JP60074360A 1985-04-10 1985-04-10 結晶へき開方法およびその装置 Granted JPS61233506A (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP60074360A JPS61233506A (ja) 1985-04-10 1985-04-10 結晶へき開方法およびその装置

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP60074360A JPS61233506A (ja) 1985-04-10 1985-04-10 結晶へき開方法およびその装置

Publications (2)

Publication Number Publication Date
JPS61233506A true JPS61233506A (ja) 1986-10-17
JPH0134126B2 JPH0134126B2 (enExample) 1989-07-18

Family

ID=13544888

Family Applications (1)

Application Number Title Priority Date Filing Date
JP60074360A Granted JPS61233506A (ja) 1985-04-10 1985-04-10 結晶へき開方法およびその装置

Country Status (1)

Country Link
JP (1) JPS61233506A (enExample)

Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5644617A (en) * 1979-09-19 1981-04-23 Kubota Ltd Method of cutting slate board

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5644617A (en) * 1979-09-19 1981-04-23 Kubota Ltd Method of cutting slate board

Also Published As

Publication number Publication date
JPH0134126B2 (enExample) 1989-07-18

Similar Documents

Publication Publication Date Title
US4306351A (en) Method for producing a semiconductor laser element
DE69206868T2 (de) Einrichtung zum Abziehen eines Abdeckfilms von einem Halbleitersubstrat
WO1984000444A1 (en) Lead frame and method
JPH0611071B2 (ja) 化合物半導体基板の分割方法
US5300806A (en) Separation of diode array chips during fabrication thereof
US5253415A (en) Method of making an integrated circuit substrate lead assembly
US6247625B1 (en) Anvil pad configuration for laser cleaving
KR20050082449A (ko) 플라스틱 필름 ｌｃｄ의 셀 커팅 방법 및 그 장치
JPH0134126B2 (enExample)
US20020162437A1 (en) Stripping device for die cutting machine
JPH06204336A (ja) 半導体基板の分割方法
JP2579498B2 (ja) ウエハ処理装置
JP3501164B2 (ja) 基板フレーム及びその割り溝形成方法
JPH07114303B2 (ja) 半導体結晶の分離方法
JPS62193800A (ja) 板状物分断方法およびその分断装置
US5571360A (en) Name plate forming method
JP2841053B2 (ja) 両面プリント回路基板のスルーホール部切断方法
JP2002219690A (ja) 断裁機及び断裁機においてワークを揃える方法
JPH11251267A (ja) 半導体レ−ザ基板の劈開方法
JP3947016B2 (ja) 光コネクタにおけるプラスチック製光ファイバの切断装置及び切断方法
JP2548542B2 (ja) 板状物分断装置
JPS62252150A (ja) 結晶体のへき開方法およびその装置
JPH0857794A (ja) テープカッター
JPH0938900A (ja) 基板分割装置
JPS61226990A (ja) 電気回路用基体