JPS6122856B2 - - Google Patents
Info
- Publication number
- JPS6122856B2 JPS6122856B2 JP14345577A JP14345577A JPS6122856B2 JP S6122856 B2 JPS6122856 B2 JP S6122856B2 JP 14345577 A JP14345577 A JP 14345577A JP 14345577 A JP14345577 A JP 14345577A JP S6122856 B2 JPS6122856 B2 JP S6122856B2
- Authority
- JP
- Japan
- Prior art keywords
- boat
- heat treatment
- boats
- wafer
- time
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
- 238000010438 heat treatment Methods 0.000 claims description 27
- 238000009792 diffusion process Methods 0.000 claims description 12
- 238000000034 method Methods 0.000 claims description 12
- 239000004065 semiconductor Substances 0.000 claims description 6
- 239000000758 substrate Substances 0.000 claims description 4
- 235000012431 wafers Nutrition 0.000 description 27
- 238000003780 insertion Methods 0.000 description 6
- 230000037431 insertion Effects 0.000 description 6
- 238000002474 experimental method Methods 0.000 description 4
- 230000003647 oxidation Effects 0.000 description 4
- 238000007254 oxidation reaction Methods 0.000 description 4
- 238000001816 cooling Methods 0.000 description 3
- 239000012535 impurity Substances 0.000 description 3
- 239000000463 material Substances 0.000 description 3
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 2
- 230000007547 defect Effects 0.000 description 2
- OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical compound [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 description 1
- 238000006243 chemical reaction Methods 0.000 description 1
- 238000000151 deposition Methods 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 229910002804 graphite Inorganic materials 0.000 description 1
- 239000010439 graphite Substances 0.000 description 1
- 239000003779 heat-resistant material Substances 0.000 description 1
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP14345577A JPS5475985A (en) | 1977-11-29 | 1977-11-29 | Heat treatment method of semiconductor substrate and its unit |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP14345577A JPS5475985A (en) | 1977-11-29 | 1977-11-29 | Heat treatment method of semiconductor substrate and its unit |
Related Child Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP15902685A Division JPS6144425A (ja) | 1985-07-18 | 1985-07-18 | 半導体基板の熱処理用ボート |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS5475985A JPS5475985A (en) | 1979-06-18 |
| JPS6122856B2 true JPS6122856B2 (enrdf_load_stackoverflow) | 1986-06-03 |
Family
ID=15339093
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP14345577A Granted JPS5475985A (en) | 1977-11-29 | 1977-11-29 | Heat treatment method of semiconductor substrate and its unit |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS5475985A (enrdf_load_stackoverflow) |
Families Citing this family (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5961534U (ja) * | 1982-10-15 | 1984-04-23 | 日本電気株式会社 | 搬送用ボ−ト |
| DE3440111C1 (de) * | 1984-11-02 | 1986-05-15 | Heraeus Quarzschmelze Gmbh, 6450 Hanau | Traegerhorde |
| US6799940B2 (en) | 2002-12-05 | 2004-10-05 | Tokyo Electron Limited | Removable semiconductor wafer susceptor |
-
1977
- 1977-11-29 JP JP14345577A patent/JPS5475985A/ja active Granted
Also Published As
| Publication number | Publication date |
|---|---|
| JPS5475985A (en) | 1979-06-18 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| JPH11176822A (ja) | 半導体処理装置 | |
| JPS584811B2 (ja) | 半導体装置の製造方法 | |
| JPS6122856B2 (enrdf_load_stackoverflow) | ||
| JPS5588323A (en) | Manufacture of semiconductor device | |
| JP3103718B2 (ja) | 太陽電池用半導体接合の形成装置 | |
| JPS6224938B2 (enrdf_load_stackoverflow) | ||
| JPH11121311A (ja) | 炭化ケイ素材およびその製造方法並びに炭化ケイ素ウエハ | |
| JPS6047981B2 (ja) | 横型熱処理炉の内部温度検出用治具 | |
| JPH06333914A (ja) | 半導体製造装置 | |
| JPH1131639A (ja) | 半導体製造装置 | |
| JPH05315272A (ja) | 石英ボート | |
| JPS6020510A (ja) | 不純物拡散方法 | |
| JPS5832266Y2 (ja) | 薄板体の立替具 | |
| JPS586136A (ja) | 半導体ウエ−ハの熱処理法 | |
| JPH10112437A (ja) | 半導体基板処理装置 | |
| JPS6319817A (ja) | 半導体製造装置 | |
| JPH09139389A (ja) | 半導体デバイス製造用治具及び半導体デバイスの製造方法 | |
| JPS63110632A (ja) | 不純物拡散方法 | |
| JPS5922114Y2 (ja) | 熱処理装置 | |
| JPS5934139Y2 (ja) | ボ−ト保持具 | |
| JPS6220999Y2 (enrdf_load_stackoverflow) | ||
| JPS61237431A (ja) | ウエ−ハのアニ−ル処理用基板ホルダ | |
| JPH0555154A (ja) | 半導体基板用熱処理炉 | |
| JP2006093315A (ja) | 成膜装置 | |
| JPH06291069A (ja) | 半導体製造装置およびその半導体製造装置を用いた半導体基板の加熱処理方法 |