JPS6122685A - 銅ペースト - Google Patents

銅ペースト

Info

Publication number
JPS6122685A
JPS6122685A JP13861484A JP13861484A JPS6122685A JP S6122685 A JPS6122685 A JP S6122685A JP 13861484 A JP13861484 A JP 13861484A JP 13861484 A JP13861484 A JP 13861484A JP S6122685 A JPS6122685 A JP S6122685A
Authority
JP
Japan
Prior art keywords
conductive paste
adhesion
powder
ceramic substrate
binder
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP13861484A
Other languages
English (en)
Japanese (ja)
Other versions
JPH0420280B2 (enrdf_load_stackoverflow
Inventor
横山　博三
丹羽　紘一
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Fujitsu Ltd
Original Assignee
Fujitsu Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Fujitsu Ltd filed Critical Fujitsu Ltd
Priority to JP13861484A priority Critical patent/JPS6122685A/ja
Publication of JPS6122685A publication Critical patent/JPS6122685A/ja
Publication of JPH0420280B2 publication Critical patent/JPH0420280B2/ja
Granted legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/09—Use of materials for the conductive, e.g. metallic pattern
    • H05K1/092—Dispersed materials, e.g. conductive pastes or inks

Landscapes

  • Parts Printed On Printed Circuit Boards (AREA)
  • Paints Or Removers (AREA)
  • Manufacturing Of Printed Wiring (AREA)
  • Conductive Materials (AREA)
JP13861484A 1984-07-04 1984-07-04 銅ペースト Granted JPS6122685A (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP13861484A JPS6122685A (ja) 1984-07-04 1984-07-04 銅ペースト

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP13861484A JPS6122685A (ja) 1984-07-04 1984-07-04 銅ペースト

Publications (2)

Publication Number Publication Date
JPS6122685A true JPS6122685A (ja) 1986-01-31
JPH0420280B2 JPH0420280B2 (enrdf_load_stackoverflow) 1992-04-02

Family

ID=15226198

Family Applications (1)

Application Number Title Priority Date Filing Date
JP13861484A Granted JPS6122685A (ja) 1984-07-04 1984-07-04 銅ペースト

Country Status (1)

Country Link
JP (1) JPS6122685A (enrdf_load_stackoverflow)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2003023233A (ja) * 2001-07-05 2003-01-24 Sumitomo Metal Electronics Devices Inc 低温焼成セラミック回路基板

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5484270A (en) * 1977-12-16 1979-07-05 Fujitsu Ltd Method of making ceramic multiilayer circuit base board
JPS5868918A (ja) * 1981-10-20 1983-04-25 三菱鉱業セメント株式会社 電極層を有する電子部品とその製造法

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5484270A (en) * 1977-12-16 1979-07-05 Fujitsu Ltd Method of making ceramic multiilayer circuit base board
JPS5868918A (ja) * 1981-10-20 1983-04-25 三菱鉱業セメント株式会社 電極層を有する電子部品とその製造法

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2003023233A (ja) * 2001-07-05 2003-01-24 Sumitomo Metal Electronics Devices Inc 低温焼成セラミック回路基板

Also Published As

Publication number Publication date
JPH0420280B2 (enrdf_load_stackoverflow) 1992-04-02

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