JPS6122351U - 樹脂封止形半導体装置 - Google Patents

樹脂封止形半導体装置

Info

Publication number
JPS6122351U
JPS6122351U JP10643584U JP10643584U JPS6122351U JP S6122351 U JPS6122351 U JP S6122351U JP 10643584 U JP10643584 U JP 10643584U JP 10643584 U JP10643584 U JP 10643584U JP S6122351 U JPS6122351 U JP S6122351U
Authority
JP
Japan
Prior art keywords
resin
semiconductor device
recess
strip
strips
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP10643584U
Other languages
English (en)
Japanese (ja)
Other versions
JPH0135478Y2 (OSRAM
Inventor
哲雄 石川
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Sanken Electric Co Ltd
Original Assignee
Sanken Electric Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Sanken Electric Co Ltd filed Critical Sanken Electric Co Ltd
Priority to JP10643584U priority Critical patent/JPS6122351U/ja
Publication of JPS6122351U publication Critical patent/JPS6122351U/ja
Application granted granted Critical
Publication of JPH0135478Y2 publication Critical patent/JPH0135478Y2/ja
Granted legal-status Critical Current

Links

Landscapes

  • Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
JP10643584U 1984-07-16 1984-07-16 樹脂封止形半導体装置 Granted JPS6122351U (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP10643584U JPS6122351U (ja) 1984-07-16 1984-07-16 樹脂封止形半導体装置

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP10643584U JPS6122351U (ja) 1984-07-16 1984-07-16 樹脂封止形半導体装置

Publications (2)

Publication Number Publication Date
JPS6122351U true JPS6122351U (ja) 1986-02-08
JPH0135478Y2 JPH0135478Y2 (OSRAM) 1989-10-30

Family

ID=30665723

Family Applications (1)

Application Number Title Priority Date Filing Date
JP10643584U Granted JPS6122351U (ja) 1984-07-16 1984-07-16 樹脂封止形半導体装置

Country Status (1)

Country Link
JP (1) JPS6122351U (OSRAM)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6453426A (en) * 1987-05-11 1989-03-01 Sanken Electric Co Ltd Manufacture of resin sealed semiconductor device
JPH04132734U (ja) * 1991-05-29 1992-12-09 日本電気株式会社 圧電振動子

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6453426A (en) * 1987-05-11 1989-03-01 Sanken Electric Co Ltd Manufacture of resin sealed semiconductor device
JPH04132734U (ja) * 1991-05-29 1992-12-09 日本電気株式会社 圧電振動子

Also Published As

Publication number Publication date
JPH0135478Y2 (OSRAM) 1989-10-30

Similar Documents

Publication Publication Date Title
JPS6122351U (ja) 樹脂封止形半導体装置
JPS60118252U (ja) 樹脂封止半導体装置用リ−ドフレ−ム
JPS596839U (ja) 半導体装置
JPS60130649U (ja) 樹脂封止型半導体装置
JPS5952697U (ja) 包装用テ−プ
JPS5834742U (ja) 樹脂封止形半導体装置の放熱構造
JPS58191645U (ja) 半導体装置のパツケ−ジ
JPS585347U (ja) 樹脂封止型半導体装置
JPS6033452U (ja) 樹脂封止型半導体装置
JPS6016553U (ja) 樹脂封止型半導体装置
JPS60176558U (ja) 半導体圧力センサ
JPS59109149U (ja) 半導体用パツケ−ジ
JPS59164251U (ja) 半導体装置用リ−ドフレ−ム
JPS6073249U (ja) 樹脂封止半導体装置
JPS6117750U (ja) 半導体装置用フレ−ム
JPS5820539U (ja) 半導体集積回路装置
JPS6163849U (OSRAM)
JPS58111938U (ja) 半導体装置用セラミツク・パツケ−ジ
JPS6068656U (ja) 放熱板付半導体装置
JPS59117162U (ja) 樹脂封止型半導体装置
JPS5834741U (ja) 樹脂封止型半導体装置
JPS60109330U (ja) 樹脂封止半導体装置
JPS6099547U (ja) 半導体装置
JPS6113943U (ja) 樹脂封止型半導体装置
JPS60156752U (ja) 半導体装置