JPS61217317A - テ−ピング電子部品の製造方法 - Google Patents
テ−ピング電子部品の製造方法Info
- Publication number
- JPS61217317A JPS61217317A JP60054806A JP5480685A JPS61217317A JP S61217317 A JPS61217317 A JP S61217317A JP 60054806 A JP60054806 A JP 60054806A JP 5480685 A JP5480685 A JP 5480685A JP S61217317 A JPS61217317 A JP S61217317A
- Authority
- JP
- Japan
- Prior art keywords
- storage tape
- storage
- tape
- cover sheet
- tapes
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 238000004519 manufacturing process Methods 0.000 title claims description 10
- 238000003860 storage Methods 0.000 claims description 104
- 230000001070 adhesive effect Effects 0.000 claims description 13
- 239000000853 adhesive Substances 0.000 claims description 12
- 238000000034 method Methods 0.000 claims description 10
- 239000000463 material Substances 0.000 claims description 9
- 230000003014 reinforcing effect Effects 0.000 claims description 7
- 239000000123 paper Substances 0.000 description 8
- 238000003780 insertion Methods 0.000 description 5
- 230000037431 insertion Effects 0.000 description 5
- 238000003466 welding Methods 0.000 description 4
- 238000004026 adhesive bonding Methods 0.000 description 2
- 238000005520 cutting process Methods 0.000 description 2
- 238000003825 pressing Methods 0.000 description 2
- 229920005989 resin Polymers 0.000 description 2
- 239000011347 resin Substances 0.000 description 2
- 238000007789 sealing Methods 0.000 description 2
- 239000002699 waste material Substances 0.000 description 2
- 239000004677 Nylon Substances 0.000 description 1
- 239000004698 Polyethylene Substances 0.000 description 1
- 229910052782 aluminium Inorganic materials 0.000 description 1
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 1
- 239000003990 capacitor Substances 0.000 description 1
- 238000007796 conventional method Methods 0.000 description 1
- 230000002950 deficient Effects 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 239000011888 foil Substances 0.000 description 1
- 239000003292 glue Substances 0.000 description 1
- 238000010030 laminating Methods 0.000 description 1
- 229910052751 metal Inorganic materials 0.000 description 1
- 239000002184 metal Substances 0.000 description 1
- 229920001778 nylon Polymers 0.000 description 1
- 230000000149 penetrating effect Effects 0.000 description 1
- -1 polyethylene Polymers 0.000 description 1
- 229920000573 polyethylene Polymers 0.000 description 1
- 238000004080 punching Methods 0.000 description 1
- 239000011232 storage material Substances 0.000 description 1
- 229920003002 synthetic resin Polymers 0.000 description 1
- 239000000057 synthetic resin Substances 0.000 description 1
- 229920001169 thermoplastic Polymers 0.000 description 1
- 229920005992 thermoplastic resin Polymers 0.000 description 1
- 239000004416 thermosoftening plastic Substances 0.000 description 1
- 238000004804 winding Methods 0.000 description 1
Landscapes
- Apparatuses And Processes For Manufacturing Resistors (AREA)
- Fixed Capacitors And Capacitor Manufacturing Machines (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP60054806A JPS61217317A (ja) | 1985-03-18 | 1985-03-18 | テ−ピング電子部品の製造方法 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP60054806A JPS61217317A (ja) | 1985-03-18 | 1985-03-18 | テ−ピング電子部品の製造方法 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS61217317A true JPS61217317A (ja) | 1986-09-26 |
| JPH052564B2 JPH052564B2 (enrdf_load_stackoverflow) | 1993-01-12 |
Family
ID=12980973
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP60054806A Granted JPS61217317A (ja) | 1985-03-18 | 1985-03-18 | テ−ピング電子部品の製造方法 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS61217317A (enrdf_load_stackoverflow) |
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS63291010A (ja) * | 1987-05-25 | 1988-11-28 | Fujitsu Ltd | 光導波路モジュ−ル |
| JP2003011913A (ja) * | 2001-06-25 | 2003-01-15 | Ueno Seiki Kk | 電子部品のテープ梱包方法 |
| US8179225B2 (en) | 2008-02-20 | 2012-05-15 | Tdk Corporation | Ceramic electronic component, manufacturing method of ceramic electronic component, and packaging method of ceramic electronic components |
| US10060852B2 (en) | 2013-03-19 | 2018-08-28 | Murata Manufacturing Co., Ltd. | Multilayer ceramic electronic component |
Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5596660U (enrdf_load_stackoverflow) * | 1978-12-26 | 1980-07-04 | ||
| JPS5784200A (en) * | 1980-11-13 | 1982-05-26 | Murata Manufacturing Co | Automatic production device for chip electronic part assembly |
| JPS6045130A (ja) * | 1983-08-11 | 1985-03-11 | ケイエル株式会社 | ロ−ルラベル供給用ラベリングマシン |
| JPS60241300A (ja) * | 1984-05-15 | 1985-11-30 | 日東電工株式会社 | チツプ部品パツケ−ジテ−プの接続方法 |
-
1985
- 1985-03-18 JP JP60054806A patent/JPS61217317A/ja active Granted
Patent Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5596660U (enrdf_load_stackoverflow) * | 1978-12-26 | 1980-07-04 | ||
| JPS5784200A (en) * | 1980-11-13 | 1982-05-26 | Murata Manufacturing Co | Automatic production device for chip electronic part assembly |
| JPS6045130A (ja) * | 1983-08-11 | 1985-03-11 | ケイエル株式会社 | ロ−ルラベル供給用ラベリングマシン |
| JPS60241300A (ja) * | 1984-05-15 | 1985-11-30 | 日東電工株式会社 | チツプ部品パツケ−ジテ−プの接続方法 |
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS63291010A (ja) * | 1987-05-25 | 1988-11-28 | Fujitsu Ltd | 光導波路モジュ−ル |
| JP2003011913A (ja) * | 2001-06-25 | 2003-01-15 | Ueno Seiki Kk | 電子部品のテープ梱包方法 |
| US8179225B2 (en) | 2008-02-20 | 2012-05-15 | Tdk Corporation | Ceramic electronic component, manufacturing method of ceramic electronic component, and packaging method of ceramic electronic components |
| US10060852B2 (en) | 2013-03-19 | 2018-08-28 | Murata Manufacturing Co., Ltd. | Multilayer ceramic electronic component |
Also Published As
| Publication number | Publication date |
|---|---|
| JPH052564B2 (enrdf_load_stackoverflow) | 1993-01-12 |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| EXPY | Cancellation because of completion of term |