JPS61216316A - 半導体装置の製造方法 - Google Patents

半導体装置の製造方法

Info

Publication number
JPS61216316A
JPS61216316A JP60033862A JP3386285A JPS61216316A JP S61216316 A JPS61216316 A JP S61216316A JP 60033862 A JP60033862 A JP 60033862A JP 3386285 A JP3386285 A JP 3386285A JP S61216316 A JPS61216316 A JP S61216316A
Authority
JP
Japan
Prior art keywords
gaas
semiconductor layer
concentration
doped
doping
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP60033862A
Other languages
English (en)
Japanese (ja)
Other versions
JPH0318733B2 (enExample
Inventor
Masahiko Sasa
佐々　誠彦
Kazuhiro Kondo
和博 近藤
Shunichi Muto
俊一 武藤
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Fujitsu Ltd
Original Assignee
Fujitsu Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Fujitsu Ltd filed Critical Fujitsu Ltd
Priority to JP60033862A priority Critical patent/JPS61216316A/ja
Priority to DE8686400366T priority patent/DE3666646D1/de
Priority to EP86400366A priority patent/EP0196245B1/en
Priority to KR1019860001253A priority patent/KR900001233B1/ko
Publication of JPS61216316A publication Critical patent/JPS61216316A/ja
Publication of JPH0318733B2 publication Critical patent/JPH0318733B2/ja
Granted legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10D—INORGANIC ELECTRIC SEMICONDUCTOR DEVICES
    • H10D30/00—Field-effect transistors [FET]
    • H10D30/40—FETs having zero-dimensional [0D], one-dimensional [1D] or two-dimensional [2D] charge carrier gas channels
    • H10D30/47—FETs having zero-dimensional [0D], one-dimensional [1D] or two-dimensional [2D] charge carrier gas channels having two-dimensional [2D] charge carrier gas channels, e.g. nanoribbon FETs or high electron mobility transistors [HEMT]
    • H10D30/471—High electron mobility transistors [HEMT] or high hole mobility transistors [HHMT]
    • H10D30/475—High electron mobility transistors [HEMT] or high hole mobility transistors [HHMT] having wider bandgap layer formed on top of lower bandgap active layer, e.g. undoped barrier HEMTs such as i-AlGaN/GaN HEMTs
    • H10D30/4755—High electron mobility transistors [HEMT] or high hole mobility transistors [HHMT] having wider bandgap layer formed on top of lower bandgap active layer, e.g. undoped barrier HEMTs such as i-AlGaN/GaN HEMTs having wide bandgap charge-carrier supplying layers, e.g. modulation doped HEMTs such as n-AlGaAs/GaAs HEMTs
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10D—INORGANIC ELECTRIC SEMICONDUCTOR DEVICES
    • H10D62/00—Semiconductor bodies, or regions thereof, of devices having potential barriers
    • H10D62/60—Impurity distributions or concentrations
    • H10D62/605—Planar doped, e.g. atomic-plane doped or delta-doped
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10D—INORGANIC ELECTRIC SEMICONDUCTOR DEVICES
    • H10D62/00—Semiconductor bodies, or regions thereof, of devices having potential barriers
    • H10D62/80—Semiconductor bodies, or regions thereof, of devices having potential barriers characterised by the materials
    • H10D62/85—Semiconductor bodies, or regions thereof, of devices having potential barriers characterised by the materials being Group III-V materials, e.g. GaAs
    • H10D62/854—Semiconductor bodies, or regions thereof, of devices having potential barriers characterised by the materials being Group III-V materials, e.g. GaAs further characterised by the dopants
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P14/00—Formation of materials, e.g. in the shape of layers or pillars
    • H10P14/20—Formation of materials, e.g. in the shape of layers or pillars of semiconductor materials
    • H10P14/22—Formation of materials, e.g. in the shape of layers or pillars of semiconductor materials using physical deposition, e.g. vacuum deposition or sputtering
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P14/00—Formation of materials, e.g. in the shape of layers or pillars
    • H10P14/20—Formation of materials, e.g. in the shape of layers or pillars of semiconductor materials
    • H10P14/29—Formation of materials, e.g. in the shape of layers or pillars of semiconductor materials characterised by the substrates
    • H10P14/2901—Materials
    • H10P14/2907—Materials being Group IIIA-VA materials
    • H10P14/2911—Arsenides
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P14/00—Formation of materials, e.g. in the shape of layers or pillars
    • H10P14/20—Formation of materials, e.g. in the shape of layers or pillars of semiconductor materials
    • H10P14/32—Formation of materials, e.g. in the shape of layers or pillars of semiconductor materials characterised by intermediate layers between substrates and deposited layers
    • H10P14/3202—Materials thereof
    • H10P14/3214—Materials thereof being Group IIIA-VA semiconductors
    • H10P14/3221—Arsenides
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P14/00—Formation of materials, e.g. in the shape of layers or pillars
    • H10P14/20—Formation of materials, e.g. in the shape of layers or pillars of semiconductor materials
    • H10P14/34—Deposited materials, e.g. layers
    • H10P14/3402—Deposited materials, e.g. layers characterised by the chemical composition
    • H10P14/3414—Deposited materials, e.g. layers characterised by the chemical composition being group IIIA-VIA materials
    • H10P14/3421—Arsenides
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P14/00—Formation of materials, e.g. in the shape of layers or pillars
    • H10P14/20—Formation of materials, e.g. in the shape of layers or pillars of semiconductor materials
    • H10P14/34—Deposited materials, e.g. layers
    • H10P14/3438—Doping during depositing
    • H10P14/3441—Conductivity type
    • H10P14/3442—N-type
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P14/00—Formation of materials, e.g. in the shape of layers or pillars
    • H10P14/20—Formation of materials, e.g. in the shape of layers or pillars of semiconductor materials
    • H10P14/34—Deposited materials, e.g. layers
    • H10P14/3438—Doping during depositing
    • H10P14/3441—Conductivity type
    • H10P14/3444—P-type

Landscapes

  • Physical Deposition Of Substances That Are Components Of Semiconductor Devices (AREA)
  • Junction Field-Effect Transistors (AREA)
  • Semiconductor Lasers (AREA)
JP60033862A 1985-02-22 1985-02-22 半導体装置の製造方法 Granted JPS61216316A (ja)

Priority Applications (4)

Application Number Priority Date Filing Date Title
JP60033862A JPS61216316A (ja) 1985-02-22 1985-02-22 半導体装置の製造方法
DE8686400366T DE3666646D1 (en) 1985-02-22 1986-02-21 Compound semiconductor layer having high carrier concentration and method of forming same
EP86400366A EP0196245B1 (en) 1985-02-22 1986-02-21 Compound semiconductor layer having high carrier concentration and method of forming same
KR1019860001253A KR900001233B1 (ko) 1985-02-22 1986-02-22 고캐리어 농도를 갖는 화합물 반도체층 및 그의 제조방법

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP60033862A JPS61216316A (ja) 1985-02-22 1985-02-22 半導体装置の製造方法

Publications (2)

Publication Number Publication Date
JPS61216316A true JPS61216316A (ja) 1986-09-26
JPH0318733B2 JPH0318733B2 (enExample) 1991-03-13

Family

ID=12398309

Family Applications (1)

Application Number Title Priority Date Filing Date
JP60033862A Granted JPS61216316A (ja) 1985-02-22 1985-02-22 半導体装置の製造方法

Country Status (4)

Country Link
EP (1) EP0196245B1 (enExample)
JP (1) JPS61216316A (enExample)
KR (1) KR900001233B1 (enExample)
DE (1) DE3666646D1 (enExample)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6294923A (ja) * 1985-10-22 1987-05-01 Nec Corp 半導体材料への不純物ド−ピング方法

Families Citing this family (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
FR2620268A1 (fr) * 1987-09-03 1989-03-10 Centre Nat Rech Scient Procede de dopage d'une couche semi-conductrice et transistor obtenu par ce procede
JP2586053B2 (ja) * 1987-09-25 1997-02-26 日本電気株式会社 電界効果トランジスタ
EP0525297A3 (en) * 1991-05-08 1993-10-06 Fujitsu Limited Method of growing doped crystal
US5888886A (en) * 1997-06-30 1999-03-30 Sdl, Inc. Method of doping gan layers p-type for device fabrication
CN112670356B (zh) * 2020-12-24 2023-05-12 湖南科莱特光电有限公司 单分子层内δ掺杂的半导体材料及其制备方法和探测器
CN116884830A (zh) * 2023-07-18 2023-10-13 武汉高芯科技有限公司 一种半导体材料的掺杂方法

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5395571A (en) * 1977-02-02 1978-08-21 Hitachi Ltd Semiconductor device
JPS57164573A (en) * 1982-02-26 1982-10-09 Hitachi Ltd Semiconductor device
JPS5844774A (ja) * 1981-09-11 1983-03-15 Konishiroku Photo Ind Co Ltd アモルフアスシリコン半導体装置及びその製造方法

Family Cites Families (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4882609A (en) * 1984-11-19 1989-11-21 Max-Planck Gesellschaft Zur Forderung Der Wissenschafter E.V. Semiconductor devices with at least one monoatomic layer of doping atoms

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5395571A (en) * 1977-02-02 1978-08-21 Hitachi Ltd Semiconductor device
JPS5844774A (ja) * 1981-09-11 1983-03-15 Konishiroku Photo Ind Co Ltd アモルフアスシリコン半導体装置及びその製造方法
JPS57164573A (en) * 1982-02-26 1982-10-09 Hitachi Ltd Semiconductor device

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6294923A (ja) * 1985-10-22 1987-05-01 Nec Corp 半導体材料への不純物ド−ピング方法

Also Published As

Publication number Publication date
EP0196245B1 (en) 1989-10-25
EP0196245A1 (en) 1986-10-01
DE3666646D1 (en) 1989-11-30
JPH0318733B2 (enExample) 1991-03-13
KR900001233B1 (ko) 1990-03-05
KR860006828A (ko) 1986-09-15

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