JPS6121491B2 - - Google Patents

Info

Publication number
JPS6121491B2
JPS6121491B2 JP3713080A JP3713080A JPS6121491B2 JP S6121491 B2 JPS6121491 B2 JP S6121491B2 JP 3713080 A JP3713080 A JP 3713080A JP 3713080 A JP3713080 A JP 3713080A JP S6121491 B2 JPS6121491 B2 JP S6121491B2
Authority
JP
Japan
Prior art keywords
resin
polyphenylene ether
resin composition
weight
chloroform
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
JP3713080A
Other languages
English (en)
Japanese (ja)
Other versions
JPS56133355A (en
Inventor
Akitoshi Sugio
Masanobu Sho
Masatsugu Matsunaga
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Mitsubishi Gas Chemical Co Inc
Original Assignee
Mitsubishi Gas Chemical Co Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Mitsubishi Gas Chemical Co Inc filed Critical Mitsubishi Gas Chemical Co Inc
Priority to JP3713080A priority Critical patent/JPS56133355A/ja
Priority to DE19813111403 priority patent/DE3111403A1/de
Priority to US06/246,314 priority patent/US4389516A/en
Publication of JPS56133355A publication Critical patent/JPS56133355A/ja
Publication of JPS6121491B2 publication Critical patent/JPS6121491B2/ja
Granted legal-status Critical Current

Links

Landscapes

  • Compositions Of Macromolecular Compounds (AREA)
JP3713080A 1980-03-24 1980-03-24 Curable polyphenylene ether resin composition Granted JPS56133355A (en)

Priority Applications (3)

Application Number Priority Date Filing Date Title
JP3713080A JPS56133355A (en) 1980-03-24 1980-03-24 Curable polyphenylene ether resin composition
DE19813111403 DE3111403A1 (de) 1980-03-24 1981-03-23 Haertbare polyphenylenaetherharzmasse
US06/246,314 US4389516A (en) 1980-03-24 1981-03-23 Curable polyphenylene ether resin composition

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP3713080A JPS56133355A (en) 1980-03-24 1980-03-24 Curable polyphenylene ether resin composition

Publications (2)

Publication Number Publication Date
JPS56133355A JPS56133355A (en) 1981-10-19
JPS6121491B2 true JPS6121491B2 (de) 1986-05-27

Family

ID=12489025

Family Applications (1)

Application Number Title Priority Date Filing Date
JP3713080A Granted JPS56133355A (en) 1980-03-24 1980-03-24 Curable polyphenylene ether resin composition

Country Status (1)

Country Link
JP (1) JPS56133355A (de)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0354712Y2 (de) * 1987-01-24 1991-12-03

Families Citing this family (16)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS58164639A (ja) * 1982-03-25 1983-09-29 Mitsubishi Gas Chem Co Inc 硬化性の樹脂組成物
JP5261943B2 (ja) * 2006-02-17 2013-08-14 日立化成株式会社 セミipn型複合体の熱硬化性樹脂組成物並びにこれを用いたワニス、プリプレグ及び金属張積層板
TWI441866B (zh) 2006-02-17 2014-06-21 Hitachi Chemical Co Ltd A thermosetting resin composition of a semi-IPN type composite and a varnish, a prepreg and a metal laminate
JP5303852B2 (ja) * 2006-04-13 2013-10-02 日立化成株式会社 セミipn型複合体の樹脂組成物並びにこれを用いたワニス、プリプレグ及び金属張積層板
JP5303853B2 (ja) * 2006-04-14 2013-10-02 日立化成株式会社 Ipn型複合体の熱硬化性樹脂組成物並びにこれを用いたワニス、プリプレグ及び金属張積層板
JP5303854B2 (ja) * 2006-10-24 2013-10-02 日立化成株式会社 新規なセミipn型複合体の熱硬化性樹脂組成物並びにこれを用いたワニス、プリプレグ及び金属張積層板
JP5104507B2 (ja) 2007-04-26 2012-12-19 日立化成工業株式会社 セミipn型複合体の熱硬化性樹脂を含有する樹脂ワニスの製造方法、並びにこれを用いたプリント配線板用樹脂ワニス、プリプレグ及び金属張積層板
JP5649773B2 (ja) 2007-05-31 2015-01-07 三菱瓦斯化学株式会社 硬化性樹脂組成物および硬化性フィルムならびにそれらの硬化物
TWI464213B (zh) * 2013-03-07 2014-12-11 Taiwan Union Technology Corp 樹脂組合物及其應用
WO2015152427A1 (ja) 2014-04-04 2015-10-08 日立化成株式会社 N-置換マレイミド基を有するポリフェニレンエーテル誘導体、並びにそれを用いた熱硬化性樹脂組成物、樹脂ワニス、プリプレグ、金属張積層板、及び多層プリント配線板
WO2016114286A1 (ja) 2015-01-13 2016-07-21 日立化成株式会社 樹脂組成物、樹脂層付き支持体、プリプレグ、積層板、多層プリント配線板及びミリ波レーダー用プリント配線板
CN104725828B (zh) * 2015-03-04 2017-11-21 广东生益科技股份有限公司 一种树脂组合物以及使用它的预浸料和层压板
CN110982267B (zh) 2016-12-07 2024-03-08 株式会社力森诺科 热固化性树脂组合物及其制造方法、预浸渍体、层叠板以及印制线路板
US10940674B2 (en) 2016-12-07 2021-03-09 Showa Denko Materials Co., Ltd. Resin varnish, prepreg, laminate, and printed wiring board
JP7120219B2 (ja) 2017-03-30 2022-08-17 昭和電工マテリアルズ株式会社 プリプレグの製造方法、プリプレグ、積層板、プリント配線板及び半導体パッケージ
JPWO2021060046A1 (de) * 2019-09-27 2021-04-01

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0354712Y2 (de) * 1987-01-24 1991-12-03

Also Published As

Publication number Publication date
JPS56133355A (en) 1981-10-19

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