JPS61214453A - 混成集積回路装置 - Google Patents

混成集積回路装置

Info

Publication number
JPS61214453A
JPS61214453A JP5734785A JP5734785A JPS61214453A JP S61214453 A JPS61214453 A JP S61214453A JP 5734785 A JP5734785 A JP 5734785A JP 5734785 A JP5734785 A JP 5734785A JP S61214453 A JPS61214453 A JP S61214453A
Authority
JP
Japan
Prior art keywords
ceramic substrate
thermal conductivity
thermal expansion
conductivity member
semiconductor element
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP5734785A
Other languages
English (en)
Japanese (ja)
Other versions
JPH0321092B2 (enrdf_load_stackoverflow
Inventor
Masahide Yamauchi
山内　眞英
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Mitsubishi Electric Corp
Original Assignee
Mitsubishi Electric Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Mitsubishi Electric Corp filed Critical Mitsubishi Electric Corp
Priority to JP5734785A priority Critical patent/JPS61214453A/ja
Publication of JPS61214453A publication Critical patent/JPS61214453A/ja
Publication of JPH0321092B2 publication Critical patent/JPH0321092B2/ja
Granted legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/36—Selection of materials, or shaping, to facilitate cooling or heating, e.g. heatsinks
    • H01L23/373—Cooling facilitated by selection of materials for the device or materials for thermal expansion adaptation, e.g. carbon
    • H01L23/3735—Laminates or multilayers, e.g. direct bond copper ceramic substrates
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805—Shape
    • H01L2224/4809—Loop shape
    • H01L2224/48091—Arched
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/481—Disposition
    • H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/48225—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
    • H01L2224/48227—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation connecting the wire to a bond pad of the item
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0271—Arrangements for reducing stress or warp in rigid printed circuit boards, e.g. caused by loads, vibrations or differences in thermal expansion
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/03—Use of materials for the substrate
    • H05K1/05—Insulated conductive substrates, e.g. insulated metal substrate
    • H05K1/053—Insulated conductive substrates, e.g. insulated metal substrate the metal substrate being covered by an inorganic insulating layer
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/0058—Laminating printed circuit boards onto other substrates, e.g. metallic substrates
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
    • H05K3/341—Surface mounted components

Landscapes

  • Engineering & Computer Science (AREA)
  • Chemical & Material Sciences (AREA)
  • Ceramic Engineering (AREA)
  • Materials Engineering (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
JP5734785A 1985-03-19 1985-03-19 混成集積回路装置 Granted JPS61214453A (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP5734785A JPS61214453A (ja) 1985-03-19 1985-03-19 混成集積回路装置

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP5734785A JPS61214453A (ja) 1985-03-19 1985-03-19 混成集積回路装置

Publications (2)

Publication Number Publication Date
JPS61214453A true JPS61214453A (ja) 1986-09-24
JPH0321092B2 JPH0321092B2 (enrdf_load_stackoverflow) 1991-03-20

Family

ID=13053037

Family Applications (1)

Application Number Title Priority Date Filing Date
JP5734785A Granted JPS61214453A (ja) 1985-03-19 1985-03-19 混成集積回路装置

Country Status (1)

Country Link
JP (1) JPS61214453A (enrdf_load_stackoverflow)

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH01183139A (ja) * 1988-01-16 1989-07-20 Sumitomo Special Metals Co Ltd 放熱基板
EP0963142A3 (en) * 1998-05-29 2000-04-05 Lucent Technologies Inc. Assembly having a back plate with inserts
WO2020040725A1 (en) * 2018-08-20 2020-02-27 Comet Ag Multi-stack cooling structure for radiofrequency component

Cited By (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH01183139A (ja) * 1988-01-16 1989-07-20 Sumitomo Special Metals Co Ltd 放熱基板
EP0963142A3 (en) * 1998-05-29 2000-04-05 Lucent Technologies Inc. Assembly having a back plate with inserts
US6292374B1 (en) 1998-05-29 2001-09-18 Lucent Technologies, Inc. Assembly having a back plate with inserts
WO2020040725A1 (en) * 2018-08-20 2020-02-27 Comet Ag Multi-stack cooling structure for radiofrequency component
CN112586090A (zh) * 2018-08-20 2021-03-30 康姆艾德公司 用于射频部件的多层冷却结构
KR20210042902A (ko) * 2018-08-20 2021-04-20 코멧 아게 무선주파수 구성요소를 위한 다중 스택 냉각 구조체
TWI738019B (zh) * 2018-08-20 2021-09-01 瑞士商康美特公司 用於射頻組件之多堆疊冷卻結構
US11382206B2 (en) 2018-08-20 2022-07-05 Comet Ag Multi-stack cooling structure for radiofrequency component
CN112586090B (zh) * 2018-08-20 2024-06-04 康姆艾德公司 用于射频部件的多层冷却结构

Also Published As

Publication number Publication date
JPH0321092B2 (enrdf_load_stackoverflow) 1991-03-20

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