JPS6120758Y2 - - Google Patents
Info
- Publication number
- JPS6120758Y2 JPS6120758Y2 JP1980075049U JP7504980U JPS6120758Y2 JP S6120758 Y2 JPS6120758 Y2 JP S6120758Y2 JP 1980075049 U JP1980075049 U JP 1980075049U JP 7504980 U JP7504980 U JP 7504980U JP S6120758 Y2 JPS6120758 Y2 JP S6120758Y2
- Authority
- JP
- Japan
- Prior art keywords
- lead
- semiconductor element
- sub
- thin metal
- substrate
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
Classifications
-
- H10W90/756—
Landscapes
- Wire Bonding (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1980075049U JPS6120758Y2 (enExample) | 1980-05-29 | 1980-05-29 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1980075049U JPS6120758Y2 (enExample) | 1980-05-29 | 1980-05-29 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS57945U JPS57945U (enExample) | 1982-01-06 |
| JPS6120758Y2 true JPS6120758Y2 (enExample) | 1986-06-21 |
Family
ID=29437739
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1980075049U Expired JPS6120758Y2 (enExample) | 1980-05-29 | 1980-05-29 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS6120758Y2 (enExample) |
Families Citing this family (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS63211638A (ja) * | 1988-01-08 | 1988-09-02 | Nec Home Electronics Ltd | 樹脂封止型半導体装置の製造方法 |
-
1980
- 1980-05-29 JP JP1980075049U patent/JPS6120758Y2/ja not_active Expired
Also Published As
| Publication number | Publication date |
|---|---|
| JPS57945U (enExample) | 1982-01-06 |
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