JPS6120758Y2 - - Google Patents

Info

Publication number
JPS6120758Y2
JPS6120758Y2 JP1980075049U JP7504980U JPS6120758Y2 JP S6120758 Y2 JPS6120758 Y2 JP S6120758Y2 JP 1980075049 U JP1980075049 U JP 1980075049U JP 7504980 U JP7504980 U JP 7504980U JP S6120758 Y2 JPS6120758 Y2 JP S6120758Y2
Authority
JP
Japan
Prior art keywords
lead
semiconductor element
sub
thin metal
substrate
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
JP1980075049U
Other languages
English (en)
Japanese (ja)
Other versions
JPS57945U (enExample
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP1980075049U priority Critical patent/JPS6120758Y2/ja
Publication of JPS57945U publication Critical patent/JPS57945U/ja
Application granted granted Critical
Publication of JPS6120758Y2 publication Critical patent/JPS6120758Y2/ja
Expired legal-status Critical Current

Links

Classifications

    • H10W90/756

Landscapes

  • Wire Bonding (AREA)
JP1980075049U 1980-05-29 1980-05-29 Expired JPS6120758Y2 (enExample)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP1980075049U JPS6120758Y2 (enExample) 1980-05-29 1980-05-29

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP1980075049U JPS6120758Y2 (enExample) 1980-05-29 1980-05-29

Publications (2)

Publication Number Publication Date
JPS57945U JPS57945U (enExample) 1982-01-06
JPS6120758Y2 true JPS6120758Y2 (enExample) 1986-06-21

Family

ID=29437739

Family Applications (1)

Application Number Title Priority Date Filing Date
JP1980075049U Expired JPS6120758Y2 (enExample) 1980-05-29 1980-05-29

Country Status (1)

Country Link
JP (1) JPS6120758Y2 (enExample)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS63211638A (ja) * 1988-01-08 1988-09-02 Nec Home Electronics Ltd 樹脂封止型半導体装置の製造方法

Also Published As

Publication number Publication date
JPS57945U (enExample) 1982-01-06

Similar Documents

Publication Publication Date Title
USRE35109E (en) Semiconductor device and method for fabricating the same
JP2001156253A (ja) 半導体電力モジュール及びその製造方法
US20240258207A1 (en) Lead frame assembly for a semiconductor device
JP2000188366A (ja) 半導体装置
JPH1056124A (ja) リードフレーム及びボトムリード型半導体パッケージ
WO2000068993A1 (en) Semiconductor devices with improved lead frame structures
EP0210371A1 (en) Semiconductor device having a plurality of leads
JP4416140B2 (ja) 樹脂封止型半導体装置
JPS6120758Y2 (enExample)
JPH06338583A (ja) 樹脂封止型半導体装置及びその製造方法
JP2001035961A (ja) 半導体装置及びその製造方法
JP2528192B2 (ja) 半導体装置
JPH07106350A (ja) 半導体装置
KR0148078B1 (ko) 연장된 리드를 갖는 리드 온 칩용 리드프레임
JP2601228B2 (ja) 樹脂封止型回路装置の製造方法
JPH0666354B2 (ja) 半導体装置
CN114520203A (zh) 用于半导体器件封装的接触夹
JP3072632B2 (ja) 圧電発振器
JP3036597B1 (ja) 半導体装置用リードフレーム
KR20020024654A (ko) 적층형 반도체 팩키지 유니트 및, 적층형 반도체 팩키지
JPS61241954A (ja) 半導体装置
JP3015458B2 (ja) リードフレームを用いた半導体装置の製造方法
JP2561470Y2 (ja) 絶縁封止電子部品
JP3388056B2 (ja) 半導体装置
JPS5812452Y2 (ja) 半導体装置