JPS6120693A - ボンデイングワイヤ− - Google Patents

ボンデイングワイヤ−

Info

Publication number
JPS6120693A
JPS6120693A JP59139108A JP13910884A JPS6120693A JP S6120693 A JPS6120693 A JP S6120693A JP 59139108 A JP59139108 A JP 59139108A JP 13910884 A JP13910884 A JP 13910884A JP S6120693 A JPS6120693 A JP S6120693A
Authority
JP
Japan
Prior art keywords
wire
ball
bonding
strength
bonding wire
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP59139108A
Other languages
English (en)
Japanese (ja)
Other versions
JPH0520493B2 (cs
Inventor
Shigemi Yamane
山根　茂美
Koichiro Atsumi
幸一郎 渥美
Tetsuo Ando
安藤　鉄男
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Toshiba Corp
Original Assignee
Toshiba Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Toshiba Corp filed Critical Toshiba Corp
Priority to JP59139108A priority Critical patent/JPS6120693A/ja
Publication of JPS6120693A publication Critical patent/JPS6120693A/ja
Publication of JPH0520493B2 publication Critical patent/JPH0520493B2/ja
Granted legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
    • H01B1/00—Conductors or conductive bodies characterised by the conductive materials; Selection of materials as conductors
    • H01B1/02—Conductors or conductive bodies characterised by the conductive materials; Selection of materials as conductors mainly consisting of metals or alloys
    • H01B1/026—Alloys based on copper
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
    • B23K35/22—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by the composition or nature of the material
    • B23K35/24—Selection of soldering or welding materials proper
    • B23K35/30—Selection of soldering or welding materials proper with the principal constituent melting at less than 1550 degrees C
    • B23K35/302—Cu as the principal constituent
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/44—Structure, shape, material or disposition of the wire connectors prior to the connecting process
    • H01L2224/45—Structure, shape, material or disposition of the wire connectors prior to the connecting process of an individual wire connector
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
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    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/44—Structure, shape, material or disposition of the wire connectors prior to the connecting process
    • H01L2224/45—Structure, shape, material or disposition of the wire connectors prior to the connecting process of an individual wire connector
    • H01L2224/45001—Core members of the connector
    • H01L2224/45099—Material
    • H01L2224/451—Material with a principal constituent of the material being a metal or a metalloid, e.g. boron (B), silicon (Si), germanium (Ge), arsenic (As), antimony (Sb), tellurium (Te) and polonium (Po), and alloys thereof
    • H01L2224/45138—Material with a principal constituent of the material being a metal or a metalloid, e.g. boron (B), silicon (Si), germanium (Ge), arsenic (As), antimony (Sb), tellurium (Te) and polonium (Po), and alloys thereof the principal constituent melting at a temperature of greater than or equal to 950°C and less than 1550°C
    • H01L2224/45147—Copper (Cu) as principal constituent
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    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/481—Disposition
    • H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/48245—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
    • H01L2224/48247—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic connecting the wire to a bond pad of the item
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Landscapes

  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Wire Bonding (AREA)
JP59139108A 1984-07-06 1984-07-06 ボンデイングワイヤ− Granted JPS6120693A (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP59139108A JPS6120693A (ja) 1984-07-06 1984-07-06 ボンデイングワイヤ−

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP59139108A JPS6120693A (ja) 1984-07-06 1984-07-06 ボンデイングワイヤ−

Related Child Applications (1)

Application Number Title Priority Date Filing Date
JP6095481A Division JP2501303B2 (ja) 1994-04-11 1994-04-11 半導体装置

Publications (2)

Publication Number Publication Date
JPS6120693A true JPS6120693A (ja) 1986-01-29
JPH0520493B2 JPH0520493B2 (cs) 1993-03-19

Family

ID=15237669

Family Applications (1)

Application Number Title Priority Date Filing Date
JP59139108A Granted JPS6120693A (ja) 1984-07-06 1984-07-06 ボンデイングワイヤ−

Country Status (1)

Country Link
JP (1) JPS6120693A (cs)

Cited By (34)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6199646A (ja) * 1984-10-20 1986-05-17 Tanaka Denshi Kogyo Kk 半導体素子のボンデイング用銅線
JPS6199645A (ja) * 1984-10-20 1986-05-17 Tanaka Denshi Kogyo Kk 半導体素子のボンデイング用銅線
JPS6280241A (ja) * 1985-10-01 1987-04-13 Tanaka Denshi Kogyo Kk 半導体素子のボンデイング用銅線
JPS6320844A (ja) * 1986-07-15 1988-01-28 Toshiba Corp 半導体装置
JPS6321841A (ja) * 1986-07-16 1988-01-29 Toshiba Corp 半導体装置
JPS6329938A (ja) * 1986-07-23 1988-02-08 Toshiba Corp 半導体装置
JPS6364211A (ja) * 1986-09-05 1988-03-22 古河電気工業株式会社 銅細線とその製造方法
JPS63310932A (ja) * 1987-06-11 1988-12-19 Kurasawa Kogaku Kogyo Kk 銅合金
JPS643903A (en) * 1987-06-25 1989-01-09 Furukawa Electric Co Ltd Thin copper wire for electronic devices and manufacture thereof
US7347056B2 (en) 2004-07-09 2008-03-25 Honda Motor Co., Ltd. Vehicle air-conditioning system
JP2008085320A (ja) * 2006-08-31 2008-04-10 Nippon Steel Materials Co Ltd 半導体装置用銅合金ボンディングワイヤ
JP2008085319A (ja) * 2006-08-31 2008-04-10 Nippon Steel Materials Co Ltd 半導体装置用銅合金ボンディングワイヤ
JP2008169422A (ja) * 2007-01-10 2008-07-24 Sumitomo Electric Ind Ltd 銅合金およびその製造方法ならびに銅合金を用いた電線・ケーブル
CN101850481A (zh) * 2010-06-22 2010-10-06 哈尔滨工业大学 一种用于紫铜厚大构件熔化焊的铜合金焊丝及其制备方法
JP2011003745A (ja) * 2009-06-18 2011-01-06 Sumitomo Metal Mining Co Ltd Ｃｕボンディングワイヤ
US8004094B2 (en) 2006-08-31 2011-08-23 Nippon Steel Materials Co., Ltd. Copper alloy bonding wire for semiconductor device
US8119951B2 (en) 2000-05-17 2012-02-21 Hobart Brothers Company Weld wire with enhanced slag removal
KR20120031005A (ko) 2009-06-24 2012-03-29 신닛테츠 마테리알즈 가부시키가이샤 반도체용 구리 합금 본딩 와이어
CN102560184A (zh) * 2012-01-17 2012-07-11 宁波敖达金属新材料有限公司 无铅易切削高导电率的钙铜材料
CN103137237A (zh) * 2011-12-01 2013-06-05 贺利氏材料科技公司 用于微电子装置中接合的具有痕量加入物的3n铜线
CN103137235A (zh) * 2011-12-01 2013-06-05 贺利氏材料科技公司 用于微电子装置中接合的二次合金1n铜线
JPWO2011129256A1 (ja) * 2010-04-14 2013-07-18 タツタ電線株式会社 ボンディングワイヤ
US8653668B2 (en) 2010-02-03 2014-02-18 Nippon Steel & Sumikin Materials Co., Ltd. Copper bonding wire for semiconductor device and bonding structure thereof
JP5937770B1 (ja) * 2015-05-26 2016-06-22 日鉄住金マイクロメタル株式会社 半導体装置用ボンディングワイヤ
TWI550639B (zh) * 2015-05-26 2016-09-21 Nippon Micrometal Corp Connecting wires for semiconductor devices
JP2016225610A (ja) * 2015-05-26 2016-12-28 日鉄住金マイクロメタル株式会社 半導体装置用ボンディングワイヤ
US20170040281A1 (en) * 2014-04-21 2017-02-09 Nippon Steel & Sumikin Materials Co., Ltd. Bonding wire for semiconductor device
CN106514044A (zh) * 2016-11-30 2017-03-22 安徽华众焊业有限公司 铜基钎焊膏
JP2018064050A (ja) * 2016-10-14 2018-04-19 田中電子工業株式会社 ボールボンディング用銅合金線
US10414002B2 (en) 2015-06-15 2019-09-17 Nippon Micrometal Corporation Bonding wire for semiconductor device
US10468370B2 (en) 2015-07-23 2019-11-05 Nippon Micrometal Corporation Bonding wire for semiconductor device
KR20190126459A (ko) * 2016-06-20 2019-11-11 닛데쓰마이크로메탈가부시키가이샤 반도체 장치용 구리 합금 본딩 와이어
KR20200070424A (ko) * 2017-12-28 2020-06-17 닛데쓰마이크로메탈가부시키가이샤 반도체 장치용 본딩 와이어
US10950571B2 (en) 2017-02-22 2021-03-16 Nippon Steel Chemical & Material Co., Ltd. Bonding wire for semiconductor device

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN109402445B (zh) * 2018-11-09 2021-01-15 上海理工大学 一种抗氧化铜基合金键合引线及其制备方法

Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS59139663A (ja) * 1983-01-31 1984-08-10 Mitsubishi Metal Corp 半導体装置のワイヤ・ボンデイング用Ｃｕ合金細線
JPS59139662A (ja) * 1983-01-31 1984-08-10 Mitsubishi Metal Corp 半導体装置のワイヤ・ボンデイング用Ｃｕ合金細線
JPS60124960A (ja) * 1983-12-09 1985-07-04 Sumitomo Electric Ind Ltd 半導体素子結線用線
JPS60236253A (ja) * 1984-05-10 1985-11-25 Furukawa Electric Co Ltd:The 半導体用ボンデイング細線

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS59139663A (ja) * 1983-01-31 1984-08-10 Mitsubishi Metal Corp 半導体装置のワイヤ・ボンデイング用Ｃｕ合金細線
JPS59139662A (ja) * 1983-01-31 1984-08-10 Mitsubishi Metal Corp 半導体装置のワイヤ・ボンデイング用Ｃｕ合金細線
JPS60124960A (ja) * 1983-12-09 1985-07-04 Sumitomo Electric Ind Ltd 半導体素子結線用線
JPS60236253A (ja) * 1984-05-10 1985-11-25 Furukawa Electric Co Ltd:The 半導体用ボンデイング細線

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JPS6199645A (ja) * 1984-10-20 1986-05-17 Tanaka Denshi Kogyo Kk 半導体素子のボンデイング用銅線
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JPS6280241A (ja) * 1985-10-01 1987-04-13 Tanaka Denshi Kogyo Kk 半導体素子のボンデイング用銅線
JPS6320844A (ja) * 1986-07-15 1988-01-28 Toshiba Corp 半導体装置
JPS6321841A (ja) * 1986-07-16 1988-01-29 Toshiba Corp 半導体装置
JPS6329938A (ja) * 1986-07-23 1988-02-08 Toshiba Corp 半導体装置
JPS6364211A (ja) * 1986-09-05 1988-03-22 古河電気工業株式会社 銅細線とその製造方法
JPS63310932A (ja) * 1987-06-11 1988-12-19 Kurasawa Kogaku Kogyo Kk 銅合金
JPS643903A (en) * 1987-06-25 1989-01-09 Furukawa Electric Co Ltd Thin copper wire for electronic devices and manufacture thereof
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JP2008085320A (ja) * 2006-08-31 2008-04-10 Nippon Steel Materials Co Ltd 半導体装置用銅合金ボンディングワイヤ
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JP2008085319A (ja) * 2006-08-31 2008-04-10 Nippon Steel Materials Co Ltd 半導体装置用銅合金ボンディングワイヤ
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