JPS61196538A - 真空処理方法及び装置 - Google Patents

真空処理方法及び装置

Info

Publication number
JPS61196538A
JPS61196538A JP60036321A JP3632185A JPS61196538A JP S61196538 A JPS61196538 A JP S61196538A JP 60036321 A JP60036321 A JP 60036321A JP 3632185 A JP3632185 A JP 3632185A JP S61196538 A JPS61196538 A JP S61196538A
Authority
JP
Japan
Prior art keywords
processing chamber
gas
processing
exhaust
processed
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP60036321A
Other languages
English (en)
Japanese (ja)
Other versions
JPH0476492B2 (enExample
Inventor
Hitoaki Sato
佐藤　仁昭
Kazuo Takada
和男 高田
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Hitachi Ltd
Original Assignee
Hitachi Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Hitachi Ltd filed Critical Hitachi Ltd
Priority to JP60036321A priority Critical patent/JPS61196538A/ja
Publication of JPS61196538A publication Critical patent/JPS61196538A/ja
Publication of JPH0476492B2 publication Critical patent/JPH0476492B2/ja
Granted legal-status Critical Current

Links

Classifications

    • H10P50/00—

Landscapes

  • Drying Of Semiconductors (AREA)
JP60036321A 1985-02-27 1985-02-27 真空処理方法及び装置 Granted JPS61196538A (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP60036321A JPS61196538A (ja) 1985-02-27 1985-02-27 真空処理方法及び装置

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP60036321A JPS61196538A (ja) 1985-02-27 1985-02-27 真空処理方法及び装置

Publications (2)

Publication Number Publication Date
JPS61196538A true JPS61196538A (ja) 1986-08-30
JPH0476492B2 JPH0476492B2 (enExample) 1992-12-03

Family

ID=12466569

Family Applications (1)

Application Number Title Priority Date Filing Date
JP60036321A Granted JPS61196538A (ja) 1985-02-27 1985-02-27 真空処理方法及び装置

Country Status (1)

Country Link
JP (1) JPS61196538A (enExample)

Cited By (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS648039U (enExample) * 1987-06-29 1989-01-17
JPH0246726A (ja) * 1988-08-09 1990-02-16 Nec Corp 真空装置の真空度改善方法
JPH0370130A (ja) * 1989-08-09 1991-03-26 Tokyo Electron Ltd エッチング方法
JPH0684853A (ja) * 1992-06-16 1994-03-25 Applied Materials Inc 半導体デバイス処理における微粒子汚染の低減
US5622595A (en) * 1992-06-16 1997-04-22 Applied Materials, Inc Reducing particulate contamination during semiconductor device processing
US5902494A (en) * 1996-02-09 1999-05-11 Applied Materials, Inc. Method and apparatus for reducing particle generation by limiting DC bias spike
US6121163A (en) * 1996-02-09 2000-09-19 Applied Materials, Inc. Method and apparatus for improving the film quality of plasma enhanced CVD films at the interface
US6139923A (en) * 1996-02-09 2000-10-31 Applied Materials, Inc. Method and apparatus for reducing particle contamination in a substrate processing chamber

Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5491048A (en) * 1977-12-05 1979-07-19 Plasma Physics Corp Method of and device for accumulating thin films
JPS5524424A (en) * 1978-08-09 1980-02-21 Kokusai Electric Co Ltd Forming device of pressure-reduced epitaxial layer
JPS56146876A (en) * 1980-01-16 1981-11-14 Nat Res Dev Adhering method and apparatus
JPS6042831A (ja) * 1983-08-19 1985-03-07 Toshiba Corp 半導体製造装置
JPS60234324A (ja) * 1984-05-07 1985-11-21 Nec Corp ドライエツチング装置

Patent Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5491048A (en) * 1977-12-05 1979-07-19 Plasma Physics Corp Method of and device for accumulating thin films
JPS5524424A (en) * 1978-08-09 1980-02-21 Kokusai Electric Co Ltd Forming device of pressure-reduced epitaxial layer
JPS56146876A (en) * 1980-01-16 1981-11-14 Nat Res Dev Adhering method and apparatus
JPS6042831A (ja) * 1983-08-19 1985-03-07 Toshiba Corp 半導体製造装置
JPS60234324A (ja) * 1984-05-07 1985-11-21 Nec Corp ドライエツチング装置

Cited By (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS648039U (enExample) * 1987-06-29 1989-01-17
JPH0246726A (ja) * 1988-08-09 1990-02-16 Nec Corp 真空装置の真空度改善方法
JPH0370130A (ja) * 1989-08-09 1991-03-26 Tokyo Electron Ltd エッチング方法
JPH0684853A (ja) * 1992-06-16 1994-03-25 Applied Materials Inc 半導体デバイス処理における微粒子汚染の低減
US5622595A (en) * 1992-06-16 1997-04-22 Applied Materials, Inc Reducing particulate contamination during semiconductor device processing
US5902494A (en) * 1996-02-09 1999-05-11 Applied Materials, Inc. Method and apparatus for reducing particle generation by limiting DC bias spike
US6121163A (en) * 1996-02-09 2000-09-19 Applied Materials, Inc. Method and apparatus for improving the film quality of plasma enhanced CVD films at the interface
US6139923A (en) * 1996-02-09 2000-10-31 Applied Materials, Inc. Method and apparatus for reducing particle contamination in a substrate processing chamber
US6289843B1 (en) 1996-02-09 2001-09-18 Applied Materials, Inc. Method and apparatus for improving the film quality of plasma enhanced CVD films at the interface
US6291028B1 (en) 1996-02-09 2001-09-18 Applied Materials, Inc. Method and apparatus for improving the film quality of plasma enhanced CVD films at the interface
US6465043B1 (en) 1996-02-09 2002-10-15 Applied Materials, Inc. Method and apparatus for reducing particle contamination in a substrate processing chamber

Also Published As

Publication number Publication date
JPH0476492B2 (enExample) 1992-12-03

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