JPS61190953A - ワイヤボンダ - Google Patents

ワイヤボンダ

Info

Publication number
JPS61190953A
JPS61190953A JP60030389A JP3038985A JPS61190953A JP S61190953 A JPS61190953 A JP S61190953A JP 60030389 A JP60030389 A JP 60030389A JP 3038985 A JP3038985 A JP 3038985A JP S61190953 A JPS61190953 A JP S61190953A
Authority
JP
Japan
Prior art keywords
bonding
lead
wire
capillary
wire bonder
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP60030389A
Other languages
English (en)
Japanese (ja)
Other versions
JPH0447973B2 (enExample
Inventor
Hiroshi Munakata
広志 宗像
Nobuhiro Takasugi
高杉　信博
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Hitachi Ltd
Renesas Eastern Japan Semiconductor Inc
Original Assignee
Hitachi Tokyo Electronics Co Ltd
Hitachi Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Hitachi Tokyo Electronics Co Ltd, Hitachi Ltd filed Critical Hitachi Tokyo Electronics Co Ltd
Priority to JP60030389A priority Critical patent/JPS61190953A/ja
Publication of JPS61190953A publication Critical patent/JPS61190953A/ja
Publication of JPH0447973B2 publication Critical patent/JPH0447973B2/ja
Granted legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/075—Connecting or disconnecting of bond wires
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/0711—Apparatus therefor
    • H10W72/07141—Means for applying energy, e.g. ovens or lasers
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/50—Bond wires
    • H10W72/531—Shapes of wire connectors
    • H10W72/536—Shapes of wire connectors the connected ends being ball-shaped
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/50—Bond wires
    • H10W72/531—Shapes of wire connectors
    • H10W72/5363—Shapes of wire connectors the connected ends being wedge-shaped
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/50—Bond wires
    • H10W72/541—Dispositions of bond wires
    • H10W72/5449—Dispositions of bond wires not being orthogonal to a side surface of the chip, e.g. fan-out arrangements
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/90—Bond pads, in general
    • H10W72/931—Shapes of bond pads
    • H10W72/932—Plan-view shape, i.e. in top view
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
    • H10W90/751—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires
    • H10W90/756—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires between a chip and a stacked lead frame, conducting package substrate or heat sink

Landscapes

  • Wire Bonding (AREA)
JP60030389A 1985-02-20 1985-02-20 ワイヤボンダ Granted JPS61190953A (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP60030389A JPS61190953A (ja) 1985-02-20 1985-02-20 ワイヤボンダ

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP60030389A JPS61190953A (ja) 1985-02-20 1985-02-20 ワイヤボンダ

Publications (2)

Publication Number Publication Date
JPS61190953A true JPS61190953A (ja) 1986-08-25
JPH0447973B2 JPH0447973B2 (enExample) 1992-08-05

Family

ID=12302551

Family Applications (1)

Application Number Title Priority Date Filing Date
JP60030389A Granted JPS61190953A (ja) 1985-02-20 1985-02-20 ワイヤボンダ

Country Status (1)

Country Link
JP (1) JPS61190953A (enExample)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP0262777A3 (en) * 1986-09-02 1989-08-23 Kabushiki Kaisha Toshiba Wire bonding device wire bonding device
JPH05160192A (ja) * 1991-12-06 1993-06-25 Toshiba Corp 半導体製造装置

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP0262777A3 (en) * 1986-09-02 1989-08-23 Kabushiki Kaisha Toshiba Wire bonding device wire bonding device
JPH05160192A (ja) * 1991-12-06 1993-06-25 Toshiba Corp 半導体製造装置

Also Published As

Publication number Publication date
JPH0447973B2 (enExample) 1992-08-05

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Legal Events

Date Code Title Description
EXPY Cancellation because of completion of term