JPS61183425A - リードフレーム用析出型銅合金材の製造法 - Google Patents

リードフレーム用析出型銅合金材の製造法

Info

Publication number
JPS61183425A
JPS61183425A JP60020832A JP2083285A JPS61183425A JP S61183425 A JPS61183425 A JP S61183425A JP 60020832 A JP60020832 A JP 60020832A JP 2083285 A JP2083285 A JP 2083285A JP S61183425 A JPS61183425 A JP S61183425A
Authority
JP
Japan
Prior art keywords
lead frame
strength
plating
conductivity
copper alloy
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP60020832A
Other languages
English (en)
Japanese (ja)
Other versions
JPS6320906B2 (enExample
Inventor
Kiichi Akasaka
赤坂　喜一
Hirohisa Iwai
岩井　博久
Shigeo Shinozaki
篠崎　重雄
Masato Asai
真人 浅井
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Furukawa Electric Co Ltd
Original Assignee
Furukawa Electric Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Furukawa Electric Co Ltd filed Critical Furukawa Electric Co Ltd
Priority to JP60020832A priority Critical patent/JPS61183425A/ja
Publication of JPS61183425A publication Critical patent/JPS61183425A/ja
Publication of JPS6320906B2 publication Critical patent/JPS6320906B2/ja
Granted legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
    • H01L23/488—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of soldered or bonded constructions
    • H01L23/495—Lead-frames or other flat leads
    • H01L23/49579—Lead-frames or other flat leads characterised by the materials of the lead frames or layers thereon
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00

Landscapes

  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Lead Frames For Integrated Circuits (AREA)
  • Conductive Materials (AREA)
JP60020832A 1985-02-07 1985-02-07 リードフレーム用析出型銅合金材の製造法 Granted JPS61183425A (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP60020832A JPS61183425A (ja) 1985-02-07 1985-02-07 リードフレーム用析出型銅合金材の製造法

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP60020832A JPS61183425A (ja) 1985-02-07 1985-02-07 リードフレーム用析出型銅合金材の製造法

Publications (2)

Publication Number Publication Date
JPS61183425A true JPS61183425A (ja) 1986-08-16
JPS6320906B2 JPS6320906B2 (enExample) 1988-05-02

Family

ID=12038029

Family Applications (1)

Application Number Title Priority Date Filing Date
JP60020832A Granted JPS61183425A (ja) 1985-02-07 1985-02-07 リードフレーム用析出型銅合金材の製造法

Country Status (1)

Country Link
JP (1) JPS61183425A (enExample)

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO1991002099A1 (en) * 1989-07-26 1991-02-21 Olin Corporation Copper alloys having improved softening resistance and a method of manufacture thereof
US5039478A (en) * 1989-07-26 1991-08-13 Olin Corporation Copper alloys having improved softening resistance and a method of manufacture thereof
JP2007100136A (ja) * 2005-09-30 2007-04-19 Nikko Kinzoku Kk 均一めっき性に優れたリードフレーム用銅合金
EP2610359A4 (en) * 2010-08-27 2017-08-02 Furukawa Electric Co., Ltd. Copper alloy sheet and method for producing same

Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS54119328A (en) * 1978-03-10 1979-09-17 Nippon Mining Co Ltd Copper alloy for lead frames

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS54119328A (en) * 1978-03-10 1979-09-17 Nippon Mining Co Ltd Copper alloy for lead frames

Cited By (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO1991002099A1 (en) * 1989-07-26 1991-02-21 Olin Corporation Copper alloys having improved softening resistance and a method of manufacture thereof
US5017250A (en) * 1989-07-26 1991-05-21 Olin Corporation Copper alloys having improved softening resistance and a method of manufacture thereof
US5039478A (en) * 1989-07-26 1991-08-13 Olin Corporation Copper alloys having improved softening resistance and a method of manufacture thereof
US5336342A (en) * 1989-07-26 1994-08-09 Olin Corporation Copper-iron-zirconium alloy having improved properties and a method of manufacture thereof
JP2007100136A (ja) * 2005-09-30 2007-04-19 Nikko Kinzoku Kk 均一めっき性に優れたリードフレーム用銅合金
EP2610359A4 (en) * 2010-08-27 2017-08-02 Furukawa Electric Co., Ltd. Copper alloy sheet and method for producing same

Also Published As

Publication number Publication date
JPS6320906B2 (enExample) 1988-05-02

Similar Documents

Publication Publication Date Title
JP3550233B2 (ja) 高強度高導電性銅基合金の製造法
JPH0641660A (ja) 微細組織を有する電気電子部品用Ｃｕ合金板材
JP3049137B2 (ja) 曲げ加工性が優れた高力銅合金及びその製造方法
JPS61183425A (ja) リードフレーム用析出型銅合金材の製造法
JP4251672B2 (ja) 電気電子部品用銅合金
JPS59145745A (ja) 半導体機器のリ−ド材用銅合金
JP3306585B2 (ja) 晶出物および析出物が微細で、その分布割合が低いＣｕ合金圧延薄板
JPS62185847A (ja) 熱・電気高伝導用高力銅合金とその製造法
JP2597773B2 (ja) 異方性が少ない高強度銅合金の製造方法
JP3032869B2 (ja) 高強度高導電性銅基合金
JPS63109132A (ja) 高力導電性銅合金及びその製造方法
JPH01165733A (ja) 高強度高導電性銅合金
JPH0219432A (ja) 半導体機器リード材又は導電性ばね材用高力高導電銅合金
JPS6345342A (ja) 高力伝導性銅合金
JP2007100136A (ja) 均一めっき性に優れたリードフレーム用銅合金
JP2883524B2 (ja) 半導体リードフレーム用銅合金
JP3044384B2 (ja) 高強度高導電性銅基合金およびその製造法
JPS63105941A (ja) 高力導電性銅合金及びその製造方法
JPS59145747A (ja) 半導体機器のリ−ド材用銅合金
JPS6342360A (ja) 半導体機器用銅系リ−ド材の製造法
JPH06184678A (ja) 電気部品用銅合金
JPH0243336A (ja) 半導体装置用Ｃｕ合金製リードフレーム材
JPH0375346A (ja) 高強度・高導電型リードフレーム用金属板の製造方法
JPH0437151B2 (enExample)
JPH08296012A (ja) 銅合金の製造方法

Legal Events

Date Code Title Description
LAPS Cancellation because of no payment of annual fees