JPS61178172A - ウエハ−の自動剥離装置 - Google Patents
ウエハ−の自動剥離装置Info
- Publication number
- JPS61178172A JPS61178172A JP60015526A JP1552685A JPS61178172A JP S61178172 A JPS61178172 A JP S61178172A JP 60015526 A JP60015526 A JP 60015526A JP 1552685 A JP1552685 A JP 1552685A JP S61178172 A JPS61178172 A JP S61178172A
- Authority
- JP
- Japan
- Prior art keywords
- wafer
- plate
- index table
- peeling
- chuck
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 235000012431 wafers Nutrition 0.000 claims abstract description 91
- 238000001514 detection method Methods 0.000 claims description 8
- 238000004299 exfoliation Methods 0.000 abstract 1
- 238000003754 machining Methods 0.000 abstract 1
- 230000032258 transport Effects 0.000 description 8
- 238000003860 storage Methods 0.000 description 6
- 230000002950 deficient Effects 0.000 description 4
- 230000000694 effects Effects 0.000 description 4
- 238000007517 polishing process Methods 0.000 description 4
- 238000000034 method Methods 0.000 description 3
- 230000008569 process Effects 0.000 description 3
- 230000001105 regulatory effect Effects 0.000 description 3
- 241000282472 Canis lupus familiaris Species 0.000 description 2
- 239000000853 adhesive Substances 0.000 description 2
- 230000001070 adhesive effect Effects 0.000 description 2
- 241000544061 Cuculus canorus Species 0.000 description 1
- 230000009471 action Effects 0.000 description 1
- 238000011109 contamination Methods 0.000 description 1
- 230000001276 controlling effect Effects 0.000 description 1
- 230000008878 coupling Effects 0.000 description 1
- 238000010168 coupling process Methods 0.000 description 1
- 238000005859 coupling reaction Methods 0.000 description 1
- 238000005520 cutting process Methods 0.000 description 1
- 238000007599 discharging Methods 0.000 description 1
- 230000007257 malfunction Effects 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 230000007246 mechanism Effects 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 230000003287 optical effect Effects 0.000 description 1
- 230000002093 peripheral effect Effects 0.000 description 1
- 238000005498 polishing Methods 0.000 description 1
Landscapes
- Mechanical Treatment Of Semiconductor (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP60015526A JPS61178172A (ja) | 1985-01-31 | 1985-01-31 | ウエハ−の自動剥離装置 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP60015526A JPS61178172A (ja) | 1985-01-31 | 1985-01-31 | ウエハ−の自動剥離装置 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS61178172A true JPS61178172A (ja) | 1986-08-09 |
| JPH0442136B2 JPH0442136B2 (enrdf_load_stackoverflow) | 1992-07-10 |
Family
ID=11891250
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP60015526A Granted JPS61178172A (ja) | 1985-01-31 | 1985-01-31 | ウエハ−の自動剥離装置 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS61178172A (enrdf_load_stackoverflow) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS63242842A (ja) * | 1987-03-28 | 1988-10-07 | Mitsubishi Metal Corp | ウエ−ハ剥離装置 |
Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS52151995A (en) * | 1976-06-14 | 1977-12-16 | Hitachi Ltd | Wafer grinder |
| JPS58223561A (ja) * | 1982-06-16 | 1983-12-26 | Disco Abrasive Sys Ltd | ポリツシングマシン |
-
1985
- 1985-01-31 JP JP60015526A patent/JPS61178172A/ja active Granted
Patent Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS52151995A (en) * | 1976-06-14 | 1977-12-16 | Hitachi Ltd | Wafer grinder |
| JPS58223561A (ja) * | 1982-06-16 | 1983-12-26 | Disco Abrasive Sys Ltd | ポリツシングマシン |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS63242842A (ja) * | 1987-03-28 | 1988-10-07 | Mitsubishi Metal Corp | ウエ−ハ剥離装置 |
Also Published As
| Publication number | Publication date |
|---|---|
| JPH0442136B2 (enrdf_load_stackoverflow) | 1992-07-10 |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| LAPS | Cancellation because of no payment of annual fees |