JPS61171565A - デイスペンサ−用注射筒 - Google Patents
デイスペンサ−用注射筒Info
- Publication number
- JPS61171565A JPS61171565A JP60013036A JP1303685A JPS61171565A JP S61171565 A JPS61171565 A JP S61171565A JP 60013036 A JP60013036 A JP 60013036A JP 1303685 A JP1303685 A JP 1303685A JP S61171565 A JPS61171565 A JP S61171565A
- Authority
- JP
- Japan
- Prior art keywords
- piston
- resin composition
- cylinder
- dispenser
- pleat
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 238000002347 injection Methods 0.000 title abstract 2
- 239000007924 injection Substances 0.000 title abstract 2
- 239000011342 resin composition Substances 0.000 claims abstract description 33
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 abstract description 14
- 229910052709 silver Inorganic materials 0.000 abstract description 13
- 239000004332 silver Substances 0.000 abstract description 13
- -1 polyethylene Polymers 0.000 abstract description 4
- 239000000919 ceramic Substances 0.000 abstract description 3
- 239000000758 substrate Substances 0.000 abstract description 3
- 239000004698 Polyethylene Substances 0.000 abstract description 2
- 239000004743 Polypropylene Substances 0.000 abstract description 2
- 239000011521 glass Substances 0.000 abstract description 2
- 229920000573 polyethylene Polymers 0.000 abstract description 2
- 229920001155 polypropylene Polymers 0.000 abstract description 2
- 230000000052 comparative effect Effects 0.000 description 7
- 239000000853 adhesive Substances 0.000 description 3
- 230000001070 adhesive effect Effects 0.000 description 3
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 2
- 239000004809 Teflon Substances 0.000 description 2
- 229920006362 Teflon® Polymers 0.000 description 2
- 239000003822 epoxy resin Substances 0.000 description 2
- 239000000463 material Substances 0.000 description 2
- 229920000647 polyepoxide Polymers 0.000 description 2
- 239000000843 powder Substances 0.000 description 2
- 229920005989 resin Polymers 0.000 description 2
- 239000011347 resin Substances 0.000 description 2
- 239000004065 semiconductor Substances 0.000 description 2
- POAOYUHQDCAZBD-UHFFFAOYSA-N 2-butoxyethanol Chemical compound CCCCOCCO POAOYUHQDCAZBD-UHFFFAOYSA-N 0.000 description 1
- 239000004925 Acrylic resin Substances 0.000 description 1
- 229920000178 Acrylic resin Polymers 0.000 description 1
- FXHOOIRPVKKKFG-UHFFFAOYSA-N N,N-Dimethylacetamide Chemical compound CN(C)C(C)=O FXHOOIRPVKKKFG-UHFFFAOYSA-N 0.000 description 1
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 description 1
- ISWSIDIOOBJBQZ-UHFFFAOYSA-N Phenol Chemical compound OC1=CC=CC=C1 ISWSIDIOOBJBQZ-UHFFFAOYSA-N 0.000 description 1
- 239000004642 Polyimide Substances 0.000 description 1
- 229910000831 Steel Inorganic materials 0.000 description 1
- 238000004026 adhesive bonding Methods 0.000 description 1
- 230000005260 alpha ray Effects 0.000 description 1
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 1
- 229910052782 aluminium Inorganic materials 0.000 description 1
- PNEYBMLMFCGWSK-UHFFFAOYSA-N aluminium oxide Inorganic materials [O-2].[O-2].[O-2].[Al+3].[Al+3] PNEYBMLMFCGWSK-UHFFFAOYSA-N 0.000 description 1
- 230000000903 blocking effect Effects 0.000 description 1
- QHIWVLPBUQWDMQ-UHFFFAOYSA-N butyl prop-2-enoate;methyl 2-methylprop-2-enoate;prop-2-enoic acid Chemical compound OC(=O)C=C.COC(=O)C(C)=C.CCCCOC(=O)C=C QHIWVLPBUQWDMQ-UHFFFAOYSA-N 0.000 description 1
- 239000011248 coating agent Substances 0.000 description 1
- 238000000576 coating method Methods 0.000 description 1
- 238000011109 contamination Methods 0.000 description 1
- 239000007822 coupling agent Substances 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 239000000975 dye Substances 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- LNEPOXFFQSENCJ-UHFFFAOYSA-N haloperidol Chemical compound C1CC(O)(C=2C=CC(Cl)=CC=2)CCN1CCCC(=O)C1=CC=C(F)C=C1 LNEPOXFFQSENCJ-UHFFFAOYSA-N 0.000 description 1
- KBJFYLLAMSZSOG-UHFFFAOYSA-N n-(3-trimethoxysilylpropyl)aniline Chemical compound CO[Si](OC)(OC)CCCNC1=CC=CC=C1 KBJFYLLAMSZSOG-UHFFFAOYSA-N 0.000 description 1
- 239000000049 pigment Substances 0.000 description 1
- 229920001225 polyester resin Polymers 0.000 description 1
- 239000004645 polyester resin Substances 0.000 description 1
- 229920001721 polyimide Polymers 0.000 description 1
- 239000002243 precursor Substances 0.000 description 1
- 238000007789 sealing Methods 0.000 description 1
- 239000003566 sealing material Substances 0.000 description 1
- 239000000377 silicon dioxide Substances 0.000 description 1
- 239000002904 solvent Substances 0.000 description 1
- 229910001220 stainless steel Inorganic materials 0.000 description 1
- 239000010935 stainless steel Substances 0.000 description 1
- 239000010959 steel Substances 0.000 description 1
- 229920005992 thermoplastic resin Polymers 0.000 description 1
- 229920001187 thermosetting polymer Polymers 0.000 description 1
- BPSIOYPQMFLKFR-UHFFFAOYSA-N trimethoxy-[3-(oxiran-2-ylmethoxy)propyl]silane Chemical compound CO[Si](OC)(OC)CCCOCC1CO1 BPSIOYPQMFLKFR-UHFFFAOYSA-N 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
- H01L24/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies
- H01L24/741—Apparatus for manufacturing means for bonding, e.g. connectors
- H01L24/743—Apparatus for manufacturing layer connectors
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies and for methods related thereto
- H01L2224/741—Apparatus for manufacturing means for bonding, e.g. connectors
- H01L2224/743—Apparatus for manufacturing layer connectors
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
- H01L2924/151—Die mounting substrate
- H01L2924/156—Material
- H01L2924/15786—Material with a principal constituent of the material being a non metallic, non metalloid inorganic material
- H01L2924/15787—Ceramics, e.g. crystalline carbides, nitrides or oxides
Landscapes
- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Coating Apparatus (AREA)
- Electric Connection Of Electric Components To Printed Circuits (AREA)
- Die Bonding (AREA)
- Encapsulation Of And Coatings For Semiconductor Or Solid State Devices (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP60013036A JPS61171565A (ja) | 1985-01-25 | 1985-01-25 | デイスペンサ−用注射筒 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP60013036A JPS61171565A (ja) | 1985-01-25 | 1985-01-25 | デイスペンサ−用注射筒 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS61171565A true JPS61171565A (ja) | 1986-08-02 |
| JPH0410390B2 JPH0410390B2 (enrdf_load_stackoverflow) | 1992-02-25 |
Family
ID=11821891
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP60013036A Granted JPS61171565A (ja) | 1985-01-25 | 1985-01-25 | デイスペンサ−用注射筒 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS61171565A (enrdf_load_stackoverflow) |
Cited By (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2003010757A (ja) * | 2001-07-03 | 2003-01-14 | Hitachi Chem Co Ltd | ディスペンサー用注射筒及びペースト状接着剤 |
| JP2009539607A (ja) * | 2006-06-13 | 2009-11-19 | ノードソン コーポレーション | 液体吐出シリンジ |
| JP5101743B1 (ja) * | 2012-04-02 | 2012-12-19 | 加賀ワークス株式会社 | 空圧ディスペンサ用プランジャ |
| US20140366797A1 (en) * | 2013-06-17 | 2014-12-18 | Panasonic Corporation | Paste supply apparatus and screen printing machine |
| US9126702B2 (en) | 2010-08-24 | 2015-09-08 | Kaga Works Co., Ltd. | Viscous-material filling method |
| US20150258774A1 (en) * | 2014-03-17 | 2015-09-17 | Panasonic Intellectual Property Management Co., Ltd. | Screen printing machine and screen printing method |
| US10293361B2 (en) | 2015-10-19 | 2019-05-21 | Kaga Works Co., Ltd. | Cartridge for viscous-material dispenser |
| US10479587B2 (en) | 2014-08-25 | 2019-11-19 | Kaga Works Co., Ltd. | Cartridge for viscous-material dispenser |
-
1985
- 1985-01-25 JP JP60013036A patent/JPS61171565A/ja active Granted
Cited By (15)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2003010757A (ja) * | 2001-07-03 | 2003-01-14 | Hitachi Chem Co Ltd | ディスペンサー用注射筒及びペースト状接着剤 |
| JP2009539607A (ja) * | 2006-06-13 | 2009-11-19 | ノードソン コーポレーション | 液体吐出シリンジ |
| US9340306B2 (en) | 2010-08-24 | 2016-05-17 | Kaga Works Co., Ltd. | Viscous-material filling apparatus |
| US10336478B2 (en) | 2010-08-24 | 2019-07-02 | Kaga Works Co., Ltd. | Viscous-material filling method |
| US9731846B2 (en) | 2010-08-24 | 2017-08-15 | Kaga Works Co., Ltd. | Viscous-material filling method |
| US9126702B2 (en) | 2010-08-24 | 2015-09-08 | Kaga Works Co., Ltd. | Viscous-material filling method |
| US9598223B2 (en) | 2012-04-02 | 2017-03-21 | Kaga Works Co., Ltd. | Plunger for pneumatic dispenser |
| WO2013150683A1 (ja) * | 2012-04-02 | 2013-10-10 | 加賀ワークス株式会社 | 空圧ディスペンサ用プランジャ |
| JP5101743B1 (ja) * | 2012-04-02 | 2012-12-19 | 加賀ワークス株式会社 | 空圧ディスペンサ用プランジャ |
| US20140366797A1 (en) * | 2013-06-17 | 2014-12-18 | Panasonic Corporation | Paste supply apparatus and screen printing machine |
| US20150258774A1 (en) * | 2014-03-17 | 2015-09-17 | Panasonic Intellectual Property Management Co., Ltd. | Screen printing machine and screen printing method |
| US9393775B2 (en) * | 2014-03-17 | 2016-07-19 | Panasonic Intellectual Property Management Co., Ltd. | Screen printing machine and screen printing method |
| US10479587B2 (en) | 2014-08-25 | 2019-11-19 | Kaga Works Co., Ltd. | Cartridge for viscous-material dispenser |
| US10293361B2 (en) | 2015-10-19 | 2019-05-21 | Kaga Works Co., Ltd. | Cartridge for viscous-material dispenser |
| US10507487B2 (en) | 2015-10-19 | 2019-12-17 | Kaga Works Co., Ltd. | Cartridge for viscous-material dispenser |
Also Published As
| Publication number | Publication date |
|---|---|
| JPH0410390B2 (enrdf_load_stackoverflow) | 1992-02-25 |
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