JPS61171565A - Injection cylinder for dispenser - Google Patents

Injection cylinder for dispenser

Info

Publication number
JPS61171565A
JPS61171565A JP60013036A JP1303685A JPS61171565A JP S61171565 A JPS61171565 A JP S61171565A JP 60013036 A JP60013036 A JP 60013036A JP 1303685 A JP1303685 A JP 1303685A JP S61171565 A JPS61171565 A JP S61171565A
Authority
JP
Japan
Prior art keywords
piston
resin composition
cylinder
dispenser
pleat
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP60013036A
Other languages
Japanese (ja)
Other versions
JPH0410390B2 (en
Inventor
Nobuo Ichimura
市村 信雄
Iwao Maekawa
前川 磐雄
Yasuo Miyamoto
宮本 泰雄
Daisuke Makino
大輔 牧野
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Resonac Corp
Original Assignee
Hitachi Chemical Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Hitachi Chemical Co Ltd filed Critical Hitachi Chemical Co Ltd
Priority to JP60013036A priority Critical patent/JPS61171565A/en
Publication of JPS61171565A publication Critical patent/JPS61171565A/en
Publication of JPH0410390B2 publication Critical patent/JPH0410390B2/ja
Granted legal-status Critical Current

Links

Classifications

    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/74Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies
    • H01L24/741Apparatus for manufacturing means for bonding, e.g. connectors
    • H01L24/743Apparatus for manufacturing layer connectors
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/74Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies and for methods related thereto
    • H01L2224/741Apparatus for manufacturing means for bonding, e.g. connectors
    • H01L2224/743Apparatus for manufacturing layer connectors
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/15Details of package parts other than the semiconductor or other solid state devices to be connected
    • H01L2924/151Die mounting substrate
    • H01L2924/156Material
    • H01L2924/15786Material with a principal constituent of the material being a non metallic, non metalloid inorganic material
    • H01L2924/15787Ceramics, e.g. crystalline carbides, nitrides or oxides

Abstract

PURPOSE:To make it possible to rapidly coat a resin composition in a proper emitting amount, by providing pleats to the piston mounted to a cylinder part. CONSTITUTION:In an injection cylinder used in a die bonding silver paste applied to a lead frame or ceramic substrate, a piston 8 having a pleat 9 comprises polyethylene, polypropylene or glass and a pleat 9 with a thickness of 0.05-0.5mm is formed to the piston 8 at a position longer by 3-40% to the diameter of the piston 8 and separated by 2-5mm from a tapered part. If the piston 8 having this pleat 9 is placed on a resin composition 3 to be mounted in a cylinder part 1 and pressed from the upper part 6 of the cylinder part 1 by N2-gas, the resin composition is emitted from a leading end nozzle in an emitting amount corresponding to a pressurizing time.

Description

【発明の詳細な説明】 (産業上の利用分野) 本発明は樹脂組成物をリードフレーム、セラミック基板
、キャビティー、回路板等に塗布する時に用いられるデ
ィスペンサー用注射筒に係わる。
DETAILED DESCRIPTION OF THE INVENTION (Field of Industrial Application) The present invention relates to a syringe barrel for a dispenser used when applying a resin composition to a lead frame, a ceramic substrate, a cavity, a circuit board, etc.

(従来の技術) 従来から樹脂組成物の製造業者は樹脂組成物を第4図に
示すようなディスペン丈−用注射簡のシリンダー部1に
注入し、ゴム製ピストン4を装てんし当該使用者(例え
ば半導体メーカ、回路板メーカ等)に供給している。使
用者は第4図のシリンダー上部6からNzガス、空気等
によって加圧し。
(Prior Art) Manufacturers of resin compositions have conventionally injected the resin composition into the cylinder portion 1 of a dispenser-length syringe as shown in FIG. For example, they are supplied to semiconductor manufacturers, circuit board manufacturers, etc.). The user pressurizes the cylinder with Nz gas, air, etc. from the upper part 6 of the cylinder shown in FIG.

先端7につけた所定の径をもつノズルから樹脂組成物3
を吐出させ、塗布面上に必要量を塗布している。しかし
ながらこの構造では、ゴム製ピストン4とシリンダー部
1の内壁との接触部5の摩擦により、先端7につけたノ
ズルからの吐出量が一定しないため、被着体を接着後の
接着強さにバラツキが生じるか、吐出された樹脂組成物
上に被着体をのせて接着する際に吐出量が多すぎて樹脂
組成物3の被着体表面へのはいあがり1表面の電極への
付着等による被着体の汚染、導通不良などが問題になっ
ている。
The resin composition 3 is supplied from a nozzle with a predetermined diameter attached to the tip 7.
is discharged to apply the required amount onto the coating surface. However, with this structure, the amount of discharge from the nozzle attached to the tip 7 is not constant due to the friction of the contact part 5 between the rubber piston 4 and the inner wall of the cylinder part 1, resulting in variations in the adhesive strength after bonding the adherend. This may be caused by the resin composition 3 creeping up on the surface of the adherend or adhesion to the electrode on the surface of 1 due to the amount of the discharged resin composition being too large when placing the adherend on the discharged resin composition and adhering it. Problems include contamination of adherends and poor conductivity.

そこで使用者は、第5図に示すようにゴム製ピストンを
除去し使用していたが、第5図のものではシリンダー部
1の内壁に樹脂組成物3が付着するために残存樹脂組成
物2の量が多くなり、高価な樹脂組成物の歩留を犠牲に
しなければならず。
Therefore, the user removed the rubber piston and used it as shown in FIG. 5, but in the one shown in FIG. , and the yield of the expensive resin composition must be sacrificed.

またシリンダー部内壁に付着した樹脂組成物によって残
存樹脂組成物2の量がわからないという問題がめった。
Further, there was a frequent problem that the amount of residual resin composition 2 could not be determined due to the resin composition adhering to the inner wall of the cylinder portion.

(発明の目的) 本発明は、これらの問題に鑑みなされたものでピストン
を装着した状態で樹脂組成物を吐出できる。吐出量が加
圧時間に対応する。吐出が迅速になる。樹脂組成物の歩
留が向上する。外部から樹脂組成物の残存量がわかる等
の利点を有するディスペンサー用注射筒を提供すること
を目的とする。
(Object of the Invention) The present invention has been made in view of these problems, and allows the resin composition to be discharged with the piston attached. The discharge amount corresponds to the pressurization time. Discharge becomes faster. The yield of the resin composition is improved. An object of the present invention is to provide a syringe barrel for a dispenser that has advantages such as being able to see the remaining amount of a resin composition from the outside.

(問題点を解決するための手段) 本発明は、樹脂組成物を入れるシリンダー部と樹脂組成
物上にのせるひだを有するピストンとを具えたディスペ
ンサー用注射筒に関する。
(Means for Solving the Problems) The present invention relates to a syringe barrel for a dispenser, which includes a cylinder portion into which a resin composition is placed and a piston having a pleat that is placed on the resin composition.

本発明を本発明の一実施例になるディスペンサー用注射
筒を示す第1図、そのA部の拡大断面図である第2図及
びひだを有するピストンの寸法の一例を示す第3図によ
り説明する。
The present invention will be explained with reference to FIG. 1 showing a syringe for a dispenser according to an embodiment of the present invention, FIG. 2 showing an enlarged sectional view of part A thereof, and FIG. 3 showing an example of the dimensions of a piston having corrugations. .

第3図はひだ9を有するピストンの一実施例を示し、ピ
ストンの材質はポリエチレン、ポリプロピレン。テフロ
ン、ガラス、アルミニウム、ステンレス、スチール等と
される。第1図、第2図のシリンダー部1の内径と第3
図のピストンの直径12との差10(第2図)は0.1
m以下が好ましい。またひだ9の厚さは0.05〜0.
5 mnの範囲が好ましい。ひだの長さ11はピストン
の直径12に対し3〜40チの範囲の長さが好ましい。
FIG. 3 shows an embodiment of a piston having corrugations 9, the material of which is polyethylene or polypropylene. Teflon, glass, aluminum, stainless steel, steel, etc. The inner diameter of the cylinder part 1 and the third
The difference 10 from the piston diameter 12 in the figure (Figure 2) is 0.1
m or less is preferable. Moreover, the thickness of the pleats 9 is 0.05 to 0.
A range of 5 mn is preferred. The length 11 of the pleats is preferably in the range of 3 to 40 inches relative to the diameter 12 of the piston.

ひたの位置はテーパ一部より2〜5■程度離すことが好
ましく、1枚に限らず複数枚としてもよい。ピストンを
軽量化するためにその内部を空洞にしてもよい。
The position of the flap is preferably about 2 to 5 cm away from the taper part, and it is not limited to one but may be multiple. The inside of the piston may be hollow to reduce its weight.

このようなひだ9を有するピストン8を樹脂組成物3に
のせてシリンダー部1に装てんし、シリ     プン
ダー上部6からN2ガス等によって加圧し、先端7に装
着したノズルから樹脂組成物3は吐出される。
The piston 8 having such pleats 9 is placed on the resin composition 3 and loaded into the cylinder part 1, pressurized with N2 gas etc. from the upper part 6 of the cylinder, and the resin composition 3 is discharged from the nozzle attached to the tip 7. Ru.

樹脂組成物とは、熱可塑性樹脂組成物、熱硬化性樹脂組
成物、光硬化性樹脂組成物などでアリ。
The resin composition includes thermoplastic resin compositions, thermosetting resin compositions, photocurable resin compositions, etc.

シリカ、アルミナ、メルク等の非導電性粉末、銀粉、ニ
ッケル粉等の導電性粉末などを含んでも良い。用いられ
る樹脂には特に制限はないが9例えばエポキシ樹脂、ポ
リエステル樹脂、アクリル樹脂、ポリイミド前駆体など
が用いられる。
It may also contain non-conductive powders such as silica, alumina, and Merck, and conductive powders such as silver powder and nickel powder. There are no particular restrictions on the resin used, but examples include epoxy resins, polyester resins, acrylic resins, and polyimide precursors.

樹脂組成物は、必要に応じて、N−メチル−2=ヒロリ
ドン、ブチルセロソルブ、ジメチルアセトアミド等の溶
剤を含んでもよい。
The resin composition may contain a solvent such as N-methyl-2-hydrolidone, butyl cellosolve, dimethylacetamide, etc., as necessary.

また樹脂組成物は、必要に応じてγ−グリシドキシプロ
ビルトリメトキシシラン、N−フェニルアミノプロピル
トリメトキシシラン等のカップリング剤、染料、顔料な
どを含んでもよい。
The resin composition may also contain coupling agents such as γ-glycidoxypropyltrimethoxysilane and N-phenylaminopropyltrimethoxysilane, dyes, pigments, etc., as necessary.

本発明になる注射筒はグイボンディング用接着剤、半導
体素子を封止するペースト状の封止材。
The syringe according to the present invention is a glue bonding adhesive, a paste-like sealing material for sealing semiconductor elements.

回路板の面付用接着剤、α線じゃへい膜用樹脂などを塗
布する場合に有効であるが、特にリードフレーム、セラ
ミック基板、キャビティー等へ塗布されるグイボンディ
ング用銀ペーストの場合に好ましい結果が得られる。
It is effective when applying adhesives for mounting circuit boards, resins for α-ray blocking films, etc., but is especially preferred for silver paste for bonding applied to lead frames, ceramic substrates, cavities, etc. Get results.

(実施例) 実施例 第1図、第4図および第5図に示す寸法のディスペンサ
ー用注射筒(シリンダー部の内径13.0■、長さ7S
L3m)により銀ペーストを塗布した場合の加圧時間と
吐出量の関係を第6図に示す。
(Example) Example: A syringe barrel for a dispenser having the dimensions shown in Figs.
FIG. 6 shows the relationship between pressurization time and discharge amount when silver paste is applied using L3m).

第4図および第5図に示す注射筒のノズルの内径は、と
もに0.4 un 、第4図のゴム製ピストン径は16
.3anとした。
The inner diameter of the nozzle of the syringe barrel shown in Figures 4 and 5 is both 0.4 un, and the diameter of the rubber piston in Figure 4 is 16 mm.
.. It was set to 3an.

第6図のAは本発明になる注射筒、Bは第4図に示す注
射筒(比較例1)、Cは第5図に示す注射筒(比較例2
)を用いた場合を示す。
In Fig. 6, A indicates the syringe according to the present invention, B indicates the syringe shown in Fig. 4 (Comparative Example 1), and C indicates the syringe shown in Fig. 5 (Comparative Example 2).
) is used.

N2ガスによる吐出圧力は1.0 kg/cm” 、ノ
ズル内径は0.4+amとした。ひだを有するピストン
の寸法は第3図のようにしひだを有するピストンの材質
はテフロン。
The discharge pressure of N2 gas was 1.0 kg/cm'', and the nozzle inner diameter was 0.4+am. The dimensions of the piston with corrugations were as shown in Figure 3, and the material of the piston with corrugations was Teflon.

ピストンの長さは10m+a、ひだの厚さは0.211
111!、ピストンの直径は13mm(シリンダー部の
内径と同一としり)、ひだの長さは直径の8.5% (
1,1an) 、先端テーパーの角度は15°、ひだの
位置はテーパ一部より21mn、ピストンは厚さ3mm
の空洞とした。
The length of the piston is 10m+a, the thickness of the folds is 0.211
111! , the diameter of the piston is 13 mm (same as the inner diameter of the cylinder), and the length of the pleats is 8.5% of the diameter (
1, 1an), the angle of the tip taper is 15°, the pleat position is 21mm from the taper part, and the piston is 3mm thick.
It was made into a hollow.

銀ペーストとしては日立化成工業株式会社製商品名エビ
ナール4000 (フェノール樹脂硬化型エポキシ樹脂
系銀ペースト)を用いた。
As the silver paste, Evinal 4000 (phenol resin-curable epoxy resin silver paste) manufactured by Hitachi Chemical Co., Ltd. was used.

また第1表に上記の場合の銀ペーストの歩留の比較を示
す。
Further, Table 1 shows a comparison of the yield of silver paste in the above cases.

第1表 歩留の比較(単位wt%) 実施例及び比較例1はピストンを装着した状態で、銀ペ
ーストを塗布した。その結果第6図に見られるように、
B(比較例1)では加圧時間が0.1秒以下では銀ペー
ストが吐出されず、また加圧時間と吐出量に比例関係が
無く、加圧時間の長さに応じた吐出量が得られない。
Table 1 Comparison of Yield (Unit: wt%) In Examples and Comparative Example 1, silver paste was applied with the piston attached. As a result, as shown in Figure 6,
In B (Comparative Example 1), the silver paste was not discharged when the pressurization time was 0.1 seconds or less, and there was no proportional relationship between the pressurization time and the discharge amount, and the discharge amount was obtained according to the length of the pressurization time. I can't do it.

一方人(実施例)は加圧時間が0.1秒以下でも吐出が
可能であす且つ加圧時間の長さに応じた吐出量が得られ
る。更にA(実施例)の加圧時間をC(比較例2)と同
一にし吐出量を比較した場合A(実施例)の吐出量が多
い。これは、一定量吐出する場合C(比較例2)より短
時間の加圧ですみ、すなわち、吐出が迅速になっている
On the other hand, a person (example) can discharge even if the pressurization time is 0.1 seconds or less, and can obtain a discharge amount corresponding to the length of the pressurization time. Further, when the pressurization time of A (Example) is the same as that of C (Comparative Example 2) and the discharge amount is compared, the discharge amount of A (Example) is larger. This requires less pressurization than C (comparative example 2) when a fixed amount is discharged, that is, the discharge is faster.

第1表に示すように比較例2は銀ベーヌトの80チを吐
出したが、残りの20%はシリンダー内壁に付着してい
る。内壁に付着した銀ペーストは不透明なため、途中段
階では銀ペーストの残存量が見えない。しかし実施例で
は銀ペーストの98%を吐出し、シリンダー内壁にはほ
とんど付着せずに吐出されるためシリンダー内部が良く
観察でき、銀ペーストの残存量が一目でわかる。
As shown in Table 1, in Comparative Example 2, 80 pieces of silver beneto were discharged, but the remaining 20% adhered to the inner wall of the cylinder. Since the silver paste attached to the inner wall is opaque, the remaining amount of silver paste cannot be seen during the intermediate stage. However, in the example, 98% of the silver paste was discharged with almost no adhesion to the inner wall of the cylinder, so the inside of the cylinder could be clearly observed and the remaining amount of silver paste could be seen at a glance.

以上から本発明になるディスペン丈−用注射筒を使用す
ることにより、従来の注射筒に比べて。
From the above, by using the syringe for dispensing length according to the present invention, compared to the conventional syringe.

ピストンを装置した状態で樹脂組成物を吐出できる。吐
出量が加圧時間に対応する。吐出が迅速になる。樹脂組
成物の歩留が向上する。外部から樹脂組成物の残存量が
わかる等の効果が得られる。
The resin composition can be discharged with the piston installed. The discharge amount corresponds to the pressurization time. Discharge becomes faster. The yield of the resin composition is improved. Effects such as being able to see the remaining amount of the resin composition from the outside can be obtained.

【図面の簡単な説明】[Brief explanation of the drawing]

第1図は本発明の一実施例になる注射筒の断面略図、第
2図は第1図のA部の拡大断面略図、第3図はひだを有
するピストンの拡大略図、第4図および第5図は従来の
ディスペンサー用注射簡の断面略図ならびに第6図は実
施例で行なったディスペンス時の加圧時間と吐出量の関
係について示す図である。 符号の説明 1・・・シリンダー部  2・・・残存樹脂組成物3・
・・樹脂組成物   4・・・ゴム製ピストン5・・・
接触部     6・・・シリンダー上部7・・・先端
      8・・・ひだを有するピストン9・・・ひ
だ 10・・・シリンダー部内壁とひだとの間隙11・・・
ひだの長さ   12・・・ピストンの直径13・・・
テーパ一部
FIG. 1 is a schematic cross-sectional view of a syringe barrel according to an embodiment of the present invention, FIG. 2 is an enlarged cross-sectional view of part A in FIG. FIG. 5 is a schematic cross-sectional view of a conventional syringe for a dispenser, and FIG. 6 is a diagram showing the relationship between pressurization time and discharge amount during dispensing performed in an example. Explanation of symbols 1... Cylinder part 2... Residual resin composition 3.
...Resin composition 4...Rubber piston 5...
Contact part 6...Cylinder upper part 7...Tip 8...Piston with folds 9...Folds 10...Gap between the inner wall of the cylinder part and the folds 11...
Length of pleats 12...Diameter of piston 13...
Part of the taper

Claims (1)

【特許請求の範囲】 1、樹脂組成物を入れるシリンダー部と樹脂組成物上に
のせるひだを有するピストンとを具えたディスペンサー
用注射筒。 2、シリンダー部の内径とピストンの直径との差を0.
1mm以下とした特許請求の範囲第1項記載のディスペ
ンサー用注射筒。 3、ひだの厚さを0.05〜0.5mmの範囲とした特
許請求の範囲第1項又は第2項記載のディスペンサー用
注射筒。 4、ひだの長さをピストンの直径に対し3〜40%の範
囲の長さとした特許請求の範囲第1項、第2項又は第3
項記載のディスペンサー用注射筒。
[Scope of Claims] 1. A syringe barrel for a dispenser, comprising a cylinder portion into which a resin composition is placed and a piston having a pleat to be placed on the resin composition. 2. The difference between the inner diameter of the cylinder part and the diameter of the piston is 0.
The syringe barrel for a dispenser according to claim 1, wherein the diameter is 1 mm or less. 3. The syringe barrel for a dispenser according to claim 1 or 2, wherein the thickness of the pleats is in the range of 0.05 to 0.5 mm. 4. Claims 1, 2, or 3 in which the length of the pleats is in the range of 3 to 40% of the diameter of the piston.
Syringe for dispenser as described in section.
JP60013036A 1985-01-25 1985-01-25 Injection cylinder for dispenser Granted JPS61171565A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP60013036A JPS61171565A (en) 1985-01-25 1985-01-25 Injection cylinder for dispenser

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP60013036A JPS61171565A (en) 1985-01-25 1985-01-25 Injection cylinder for dispenser

Publications (2)

Publication Number Publication Date
JPS61171565A true JPS61171565A (en) 1986-08-02
JPH0410390B2 JPH0410390B2 (en) 1992-02-25

Family

ID=11821891

Family Applications (1)

Application Number Title Priority Date Filing Date
JP60013036A Granted JPS61171565A (en) 1985-01-25 1985-01-25 Injection cylinder for dispenser

Country Status (1)

Country Link
JP (1) JPS61171565A (en)

Cited By (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2003010757A (en) * 2001-07-03 2003-01-14 Hitachi Chem Co Ltd Injection cylinder for dispenser and pasty adhesive
JP2009539607A (en) * 2006-06-13 2009-11-19 ノードソン コーポレーション Liquid discharge syringe
JP5101743B1 (en) * 2012-04-02 2012-12-19 加賀ワークス株式会社 Plunger for pneumatic dispenser
US20140366797A1 (en) * 2013-06-17 2014-12-18 Panasonic Corporation Paste supply apparatus and screen printing machine
US9126702B2 (en) 2010-08-24 2015-09-08 Kaga Works Co., Ltd. Viscous-material filling method
US20150258774A1 (en) * 2014-03-17 2015-09-17 Panasonic Intellectual Property Management Co., Ltd. Screen printing machine and screen printing method
US10293361B2 (en) 2015-10-19 2019-05-21 Kaga Works Co., Ltd. Cartridge for viscous-material dispenser
US10479587B2 (en) 2014-08-25 2019-11-19 Kaga Works Co., Ltd. Cartridge for viscous-material dispenser

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JP2009539607A (en) * 2006-06-13 2009-11-19 ノードソン コーポレーション Liquid discharge syringe
US9340306B2 (en) 2010-08-24 2016-05-17 Kaga Works Co., Ltd. Viscous-material filling apparatus
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US9731846B2 (en) 2010-08-24 2017-08-15 Kaga Works Co., Ltd. Viscous-material filling method
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US9598223B2 (en) 2012-04-02 2017-03-21 Kaga Works Co., Ltd. Plunger for pneumatic dispenser
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US20140366797A1 (en) * 2013-06-17 2014-12-18 Panasonic Corporation Paste supply apparatus and screen printing machine
US20150258774A1 (en) * 2014-03-17 2015-09-17 Panasonic Intellectual Property Management Co., Ltd. Screen printing machine and screen printing method
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US10479587B2 (en) 2014-08-25 2019-11-19 Kaga Works Co., Ltd. Cartridge for viscous-material dispenser
US10293361B2 (en) 2015-10-19 2019-05-21 Kaga Works Co., Ltd. Cartridge for viscous-material dispenser
US10507487B2 (en) 2015-10-19 2019-12-17 Kaga Works Co., Ltd. Cartridge for viscous-material dispenser

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