JP3520820B2 - Adhesive transfer method - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a transfer method for an adhesive for application in even thickness and shape while the adhesive is surely prevented from being transferred to the position of a pressure guiding hole. SOLUTION: Related to a transfer pin 15, a cylinder wall of its tip end 15a which is almost cylindrical is provided with a notch 15d reaching a almost U-shape tip end surface 15b. When an adhesive 4 supplied to the tip end surface 15b of the transfer pin 15 is transferred to a die-fitted part, the transfer pin 5 is rotated with the axis of it as a center while the tip end surface 15b of the transfer pin 15 is pressed to the die-fitted part, so that the adhesive 4 is annularly transferred.

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to an adhesive transfer method for transferring an adhesive used for mounting a semiconductor pressure sensor chip to a mounting position.

[0002]

2. Description of the Related Art FIG. 10 is a cross-sectional view showing an example of a semiconductor pressure sensor in which a semiconductor pressure sensor chip is mounted on a die attaching portion of a package having a pressure introducing hole by using an adhesive. The pressure sensor is used for measuring pressure in a low pressure region. In FIG. 10, the semiconductor pressure sensor chip 1
Is fixed to the glass pedestal 2 by a method such as anodic bonding,
The glass pedestal 2 is bonded to a package 3 made of a plastic material such as PPS or PBT by an adhesive 4 made of low stress silicone or epoxy resin. Leads 9 are pre-molded in the package 3, and the leads 9 and the aluminum wiring of the semiconductor pressure sensor chip 1 are bonded by a wire 8 of gold or aluminum. A pressure introducing hole 5 for applying a pressure to the semiconductor pressure sensor chip 1 is formed in the glass pedestal 2 and the package 3 as a through hole. Further, in FIG. 10, 7 is a silicon diaphragm, 10 is a lid, and 11 is an overcoat. The semiconductor pressure sensor chip 1 may be directly bonded to the die attaching portion 6 with the adhesive 4 without the glass pedestal 2 interposed.

FIG. 11 shows the die attaching portion 6 of the package 3.
FIG. 11 shows an example of a conventional example in which the adhesive 4 is applied from the dispenser nozzle 12. In FIG. 11, the dispenser nozzle 12 is moved around the pressure introducing hole 5 so as to draw an arc, 4 is applied. On the other hand, FIG.
Shows another conventional example in which the adhesive 4 is applied from the dispenser nozzle 12 to the die attaching portion 6 of the package 3, and in FIG. 12, the adhesive is applied to a large number of points scattered around the pressure introducing hole 5. Agent 4 is applied.

However, in the method shown in FIG. 11, the adhesive 4
It was difficult to continuously apply a uniform thickness.
That is, the discharge amount of the adhesive 4 from the dispenser nozzle 12 tends to be faint at the start point, and tends to be applied a large amount due to the dripping of the adhesive 4 at the end point after the pressure introducing hole 5 is completed. It was As described above, when the adhesive 4 cannot be continuously applied to the periphery of the pressure introducing hole 5 with a uniform thickness, the adhesive strength between the pressure sensor chip 1 integrated with the glass pedestal 2 and the package 3 is poor. Therefore, there arises a problem that the breakdown withstand voltage is reduced, and a variation in the offset voltage of the pressure sensor chip 1 is increased due to a variation in the coating shape of the adhesive 4.

In the method shown in FIG. 12, the adhesive 4 applied to a large number of points scattered around the pressure introducing hole 5 spreads with the lapse of time, and eventually they will be connected, but the adhesive 4
It is difficult to apply a uniform thickness due to variations in the amount of coating applied, etc. As a result, variations in the coating shape occur, and as a result, the breakdown voltage of the semiconductor pressure sensor decreases, and the offset voltage of the pressure sensor chip also varies. There was a problem that it became large. Further, since the coating is applied to a large number of points, the coating time is long and the cost is increased.

A transfer pin 13 as shown in FIG. 13 is known as a transfer pin capable of transferring the adhesive only around the pressure introducing hole formed in the die attaching portion of the package (Japanese Patent Laid-Open No. 9-148349). No. conventional technology column). In FIG. 13, (a) is a side view and (b) is a plan view. Since the transfer pin 13 shown in FIG. 13 has a concave portion 13c having a hexagonal shape in plan view formed on the distal end surface 13b of the distal end portion 13a to which the adhesive is applied, the adhesive agent is applied only to the distal end surface 13b around the concave portion 13c. The adhesive can be adhered, the adhesive is not transferred to the position where the pressure introducing hole is present, and the adhesive can be transferred only around the pressure introducing hole in a short time.

[0007]

The transfer pin 13 shown in FIG. 13 is used as a transfer pin for transferring the adhesive to the mounting position.
In the case of using, the adhesive can be applied to the die attaching portion in a short time without transferring the adhesive to the position where the pressure introducing hole exists, and as shown in FIGS. 11 and 12. Compared with the method, it becomes possible to apply the adhesive around the pressure introducing hole in a uniform thickness and in a uniform shape. However, when the transfer pin 13 shown in FIG. 13 is used, when the tip end surface 13b of the transfer pin 13 is pressed against the adhesive placed on the tray, the air in the recess 13c is compressed and the tip end surface 1
There is a case where a part of the air is pushed out to the outside of the transfer pin 13 through the top surface 3b, and when this phenomenon occurs, the tip surface 13b
It becomes difficult to adhere the adhesive having a uniform thickness to the adhesive, and as a result, the adhesive cannot be applied to the periphery of the pressure introducing hole in a uniform thickness and in a uniform shape. In addition, an adhesive film may be formed across the opening surface of the recess 13c formed in the center of the tip surface 13b. If the adhesive film is transferred to the die attaching part with this film formed, The adhesive is transferred to the position of the pressure introducing hole formed in the die attaching portion, which causes a serious problem of hole clogging, and its improvement is also required.

The present invention has been made in view of the above-mentioned problems of the prior art, and is uniform in the application of the adhesive to the peripheral portion of the pressure introducing hole in the die attaching portion in which the pressure introducing hole is formed. An object of the present invention is to provide a method of transferring an adhesive, which can be applied in a uniform thickness and with a uniform thickness, and can reliably prevent the transfer of the adhesive to the position of the pressure introducing hole.

If it becomes possible to apply the adhesive to the die-attached portion in a uniform thickness and in a uniform shape, the adhesive strength between the pressure sensor chip and the package will be poor due to the uneven coating thickness. As a result, it is possible to solve the problems that the breakdown withstand voltage is reduced and the problem that the offset voltage of the pressure sensor chip is greatly varied due to the variation of the application shape of the adhesive, and the characteristics of the semiconductor pressure sensor can be improved and stabilized. Become.

[0010]

[0011]

[0012]

The invention according to claim 1 is
A semiconductor pressure sensor chip equipped with a silicon diaphragm is mounted on the die attachment part where a pressure introduction hole is formed.
A method for transferring the adhesive to transfer the adhesive using a transfer pin, the tip surface gutter-shaped groove is formed on the tip
Use a transfer pin that has a substantially C shape, and use the transfer pin tip.
After pressing the surface of the adhesive on the tray,
The adhesive is supplied on the same tip surface by
The adhesive supplied on the tip surface of the transfer pin,
It is a mounting part and is pressed to the position around the pressure introducing hole,
To form a continuous ring around the pressure introducing hole
A method of transferring an adhesive characterized by transferring the adhesive
Yes, the adhesive supplied to the tip surface of the transfer pin is transferred in a substantially C-shape around the pressure introducing hole of the die attaching portion to perform the first transfer, and then the tip of the transfer pin. The direction of the surface is directed from the direction of the first transfer to a direction rotated about 180 ° around the axis of the transfer pin, and the newly supplied adhesive is introduced to the tip surface of the die by the pressure of the die attaching part. An adhesive that transfers the adhesive in a substantially inverted C shape around the hole and performs the second transfer so that the transferred adhesive forms a substantially annular shape around the pressure introducing hole. Is a transfer method.

In the transfer method of the invention according to claim 1 ,
Since a transfer pin having a substantially C-shaped cross section at the front end surface and its front end portion is used, the front end surface 13 of the transfer pin 13 shown in FIG. 13 is used.
Since the air in the recess 13c is compressed when b is pressed against the adhesive placed on the tray, the problem that the adhesive having a uniform thickness cannot be attached to the tip surface 13b is solved. Further, the phenomenon that the adhesive film is formed across the opening surface of the recess 13c, which occurs in the case of the transfer pin 13 shown in FIG. 13, does not occur.

[0014] The invention according to claim 2, the semiconductor pressure sensor chip having a silicon diaphragm is mounted, the die mounting portion where the pressure introducing hole is formed, the adhesive for transferring the adhesive using a transfer pin a transfer method, the distal end
A gutter-shaped groove was formed, and the tip surface became a C shape.
Use a transfer pin and place the tip of the transfer pin on the tray.
By pressing it against the adhesive and then releasing it from this adhesive.
The adhesive on the tip surface, and then the transfer pin
Use the adhesive supplied to the tip surface to
Press in the position around the pressure introducing hole to
Transfer the adhesive to form a continuous ring around
A method of transferring an adhesive, characterized in that
After using the two pins, the adhesive supplied to the tip surface of the first transfer pin is transferred in a substantially C shape around the pressure introducing hole of the die attaching part, and after the first transfer is performed. , The opening direction of the substantially C-shaped front end surface of the second transfer pin is centered on the axis of the transfer pin from the opening direction of the substantially C-shaped front end surface of the first transfer pin at the time of the first transfer. The adhesive supplied to the tip end surface of the second transfer pin is transferred in a substantially inverted C-shape around the pressure introducing hole of the die attaching portion in a direction rotated by about 180 ° by the second time. This is a method of transferring an adhesive by transferring the adhesive so that the transferred adhesive forms a substantially annular shape around the pressure introducing hole.

In the transfer method of the invention according to claim 2 ,
Since different transfer pins are used, the transfer process time can be shortened as compared with the transfer method according to the first aspect of the invention.

According to the third aspect of the present invention, the surface in the axial direction can be divided substantially equally into the left and right, and the tip end surface to which the adhesive is supplied has a substantially annular shape with a concave portion formed in the center. The transfer pin has a substantially columnar shape and a head that supports the transfer pin at the end opposite to the tip surface side to which the adhesive of the transfer pin is supplied. A semiconductor pressure sensor chip provided with a silicon diaphragm using a transfer device in which the transfer pin is mounted on the head so that the transfer pin after division can move in a direction substantially orthogonal to the boundary surface so that the transfer pin can move toward and away from the head. there are mounted, a method for transferring the adhesive to transfer the adhesive to the die attachment portion pressure introduction hole is formed, the transfer pin after the division
Gutter-shaped groove is formed at the tip of the
Use a transfer pin that has a substantially C shape.
After pressing the end face against the adhesive on the tray,
The adhesive is supplied onto the same tip surface by
The adhesive supplied on the tip surface of the transfer pin.
B) Pressed at the position around the pressure introducing hole
To form a continuous ring around the pressure introducing hole.
Transfer method of adhesive, characterized by transferring adhesive
In the state where the transfer pins are divided and separated from each other, an adhesive is supplied to each tip surface of the divided transfer pins, and then the divided transfer pins are brought close to each other and integrated, The tip of the integrated transfer pin has a substantially annular shape, and the adhesive supplied to the tip of the transfer pin is transferred to the periphery of the pressure introducing hole of the die attaching part. This is an adhesive transfer method.

In the transfer method of the invention according to claim 3 ,
Since the adhesive is supplied to the tip surfaces of the respective transfer pins in a state where the divided transfer pins are separated from each other with a gap, the adhesive agent in which the tip surfaces 13b of the transfer pins 13 shown in FIG. Since the air in the recess 13c is compressed when it is pressed against, the problem that the adhesive having a uniform thickness cannot be attached to the tip surface 13b is solved. Further, the phenomenon that the adhesive film is formed across the opening surface of the recess 13c, which occurs in the case of the transfer pin 13 shown in FIG. 13, does not occur.

[0018]

First, a reference example of the present invention will be described. FIG. 1 is a cross-sectional view for explaining this reference example . A transfer pin 15 used in this reference example has a cylindrical shape as shown in FIG. A notch 15d reaching 15b is formed. As is apparent from the perspective view of the tip portion 15a shown in FIG. 2, the tip surface 15b of the transfer pin 15 is a flat surface and has a horseshoe shape.

A method ( reference example ) of transferring an adhesive using the transfer pin 15 will be described. As shown in FIG. 1, after the tip surface 15b of the transfer pin 15 is pressed against the adhesive agent 4 provided on the tray 17, the tip surface 15b is separated from the adhesive agent 4 provided on the tray 17, so that the adhesive agent 4 is formed. Is supplied onto the tip surface 15b. In that case, the air in the hollow portion 15c inside the cylindrical transfer pin 15 is transferred to the transfer pin 15.
Since it can escape to the outside from the notch 15d,
The air in the cavity 15c is not compressed and is not pushed out of the transfer pin 15 through the tip surface 15b. Therefore, in this reference example , on the tip surface 15b of the transfer pin 15,
It is possible to attach an adhesive of uniform thickness. Further, due to the function of the cutout portion 15d, an adhesive film may be formed across the opening surface of the hollow portion 15c formed at the center of the tip surface 15b, or the adhesive may creep up into the hollow portion 15c. Is also prevented.

Next, as shown in FIG. 3, the tip surface 15b is formed.
With the adhesive 4 attached to the die 3, the substantially horseshoe-shaped tip surface 15b of the transfer pin 15 is attached to the die attaching portion 6 of the package 3.
That is, the adhesive is transferred by pressing it around the pressure introducing hole 5. At that time, the shaft 15 of the transfer pin 15 is pressed while pressing the tip end surface 15b of the transfer pin 15 against the die attaching part 6.
When the transfer pin 15 is rotationally moved about 30 ° to about 180 ° about e, for example, the substantially horseshoe-shaped gap is filled with the adhesive, and the adhesive is transferred to the position around the pressure introducing hole 5 in a substantially annular shape. be able to.

In the transfer method of this reference example, since the transfer is performed as described above, the application of the adhesive to the peripheral portion of the pressure introducing hole in the die attaching portion in which the pressure introducing hole is formed,
The adhesive can be applied in a uniform thickness and in a uniform shape, and the transfer of the adhesive to the position of the pressure introducing hole is reliably prevented. Since the adhesive can be applied to the die-attached portion in a uniform thickness and in a uniform shape, the adhesive strength between the pressure sensor chip and the package is deteriorated due to the uneven coating thickness. The problem that the breakdown withstand voltage is lowered and the problem that the offset voltage of the pressure sensor chip varies greatly due to the variation in the application shape of the adhesive are solved, and the characteristics of the semiconductor pressure sensor can be improved and the characteristics can be stabilized.

Next, a first embodiment corresponding to the invention of claim 1 will be described. FIG. 4 is a sectional view for explaining the first embodiment, and the transfer pin 16 used in this embodiment.
As shown in FIG. 4, the shape is a semi-cylindrical shape as a whole, and a gutter-shaped groove is formed in the tip portion 16a so that the tip surface 16b and the tip portion 16a have a substantially C-shaped cross section. 16
c is formed. A perspective view of the tip portion 16a is shown in FIG.

A method ( first embodiment) of transferring an adhesive using the transfer pin 16 will be described. As shown in FIG. 4, the substantially C-shaped tip surface 16 b of the transfer pin 16 is pressed against the adhesive 4 on the tray 17, and then the tip surface 1
By separating 6b from the adhesive 4 on the tray 17, the adhesive 4 is supplied onto the tip surface 16b. In that case,
Since the gutter-shaped groove 16c is formed in the tip portion 16a of the transfer pin 16, the air is not compressed inside the transfer pin 16, and therefore the air inside the transfer pin 16 is compressed and Since the phenomenon of being pushed out to the outside of the transfer pin 16 through the surface 16b does not occur, it becomes possible to adhere an adhesive having a uniform thickness to the tip surface 16b. Further, it is also possible to prevent an adhesive film from being formed across the opening surface on the tip end surface side of the groove 16c surrounded by the tip end surface 16b and to prevent the adhesive agent from creeping up into the groove 16c.

Next, with the adhesive 4 adhered to the tip surface 16b of the transfer pin 16, the substantially C-shaped tip surface 16b of the transfer pin 16 is applied to the die attaching portion 6 of the package 3 under pressure. The adhesive is transferred by pressing the position around the introduction hole 5 to perform the first transfer (FIG. 6A).

Next, the tip surface 16b of the transfer pin 16 is again used.
After the adhesive 4 is supplied to the transfer pin 16, the direction of the substantially C-shaped front end surface 16b of the transfer pin 16 is the same as that of the first transfer.
The adhesive 4 newly supplied to the tip end surface 16b thereof is transferred in a substantially inverted C-shape around the pressure introducing hole 5 of the die attaching portion 6 in a direction rotated by about 180 ° about the axis 16e of The second transfer is performed. Then, in the second transfer, the adhesive applied to the die attaching portion 6 in the first transfer and the adhesive applied to the die attaching portion 6 in the second transfer are the pressure introducing holes 5 The adhesive is transferred so as to form a continuous annular shape around the periphery of the (FIG. 6 (b)).

In the transfer method of the first embodiment, the transfer is performed as described above. Therefore, regarding the application of the adhesive to the peripheral portion of the pressure introducing hole in the die attaching portion in which the pressure introducing hole is formed,
The adhesive can be applied in a uniform thickness and in a uniform shape, and the transfer of the adhesive to the position of the pressure introducing hole is reliably prevented. Since the adhesive can be applied to the die-attached portion in a uniform thickness and in a uniform shape, the adhesive strength between the pressure sensor chip and the package is deteriorated due to the uneven coating thickness. The problem that the breakdown withstand voltage is lowered and the problem that the offset voltage of the pressure sensor chip varies greatly due to the variation in the application shape of the adhesive are solved, and the characteristics of the semiconductor pressure sensor can be improved and the characteristics can be stabilized.

Next, a second embodiment corresponding to the invention of claim 2 will be described with reference to FIG. In the second embodiment, the first
Different transfer pins are used for the transfer pin 18A used for the second transfer and the transfer pin 18B used for the second transfer. The shapes thereof are similar to those of the transfer pin 16 in the first embodiment.

Hereinafter, a method ( second embodiment) of transferring an adhesive using these transfer pins 18A and 18B will be described. First, one transfer pin (first transfer pin) 1
8A is used to perform the first transfer in the same manner as in the first embodiment (FIG. 7A). Then, the second transfer is performed using another transfer pin (second transfer pin) 18B in the same manner as in the first embodiment (FIG. 7B). That is,
The opening direction of the substantially C-shaped tip surface of the second transfer pin 18B is
From the opening direction of the substantially C-shaped tip surface of the first transfer pin 18A at the time of the first transfer, the transfer pin 18B is rotated in a direction rotated by about 180 ° about the axis of the first transfer pin 18A. The adhesive supplied to the tip surface is attached to the die attaching section 6
Around the pressure introducing hole 5 is transferred in a substantially inverted C shape. Then, in the second transfer, the adhesive applied to the die attaching portion 6 in the first transfer and the adhesive applied to the die attaching portion 6 in the second transfer are the pressure introducing holes 5 The adhesive is transferred to form a continuous annular shape around the.

[0029] In the transfer method of the second embodiment, while achieving the same effects as those of the first embodiment described above, since the use of separate two transfer pins, the transfer method of the invention according to claim 1 In comparison, the time required for the transfer process can be shortened.

Next, a third embodiment corresponding to the invention of claim 3 will be described. 8 and 9 are perspective views for explaining the third embodiment. The transfer device 21 used in this embodiment is, as shown in FIG.
And a head 20. This splittable transfer pin 1
Numeral 9 is a substantially columnar shape, which can be divided substantially evenly in the left and right with the axial surface as a boundary surface, and the tip surface 19b to which the adhesive is supplied has a recess 19c formed in the center thereof.
The tip surface 19b has an annular shape when the transfer pin 19 is not divided but integrated. Then, the head 20 has a transfer pin 19 (19A, 1A, 1A) at an end portion 19d opposite to the tip surface 19b to which the adhesive of the transfer pin 19 is supplied.
9B). Further, the transfer pins 19 (19A, 19B) are the heads so that the individual divided child transfer pins 19A, 19B can move in a direction substantially orthogonal to the division boundary surface 19e of the transfer pin 19 so that they can move toward and away from each other. 20
Is attached to. (Hereinafter, each transfer pin after being divided is referred to as a child transfer pin.) In this embodiment, one child transfer pin 19A in the case of being divided is fixed to the head 20 and the other child transfer pin 19B is fixed. Has a structure in which it can be moved while mounted on the head 20. Therefore,
The transfer device 21 has a structure in which the child transfer pins 19A and 19B can be brought close to each other and integrated (FIG. 9), or can be separated from each other to have a gap (FIG. 8). ing. The movement of the child transfer pin 19B can be achieved by using air pressure or an electromagnetic driving method. Further, as apparent from FIG. 8, each of the child transfer pins 19A and 19B has a semi-cylindrical shape, and a gutter-shaped groove 19f is formed at each tip end thereof.
Each tip surface has a substantially C shape.

A method of transferring an adhesive using the transfer device 21 ( third embodiment) will be described. As shown in FIG. 8, in a state where the child transfer pins 19A and 19B are separated from each other, the front end surfaces of the child transfer pins 19A and 19B are pressed against the adhesive 4 on the tray 17, and then the child transfer pins 19A and 19B are pressed.
By separating the front end surface of 9B from the adhesive agent 4 placed on the tray 17, the adhesive agent 4 is supplied onto the front end surfaces of the child transfer pins 19A and 19B. In that case, child transfer pins 19A, 19B
Since the air is separated, the air is not compressed inside the transfer pin, and therefore the air inside the transfer pin is compressed and pushed out of the transfer pin through the tip surface of the transfer pin. Since the phenomenon does not occur, the child transfer pin 19
It is possible to attach an adhesive having a uniform thickness to the respective tip surfaces of A and 19B. Also, the child transfer pin 19
It is also prevented that an adhesive film is formed across the opening surface of the rain gutter-shaped groove 19f at the tip end portions 19a of the A and 19B on the tip end surface side, and that the adhesive agent does not crawl into the groove 19f.

Next, as shown in FIG. 9, the child transfer pin 1
9A and 19B are brought close to each other and integrated, and the tip surface 19b of the integrated transfer pin 19 is formed into a substantially annular shape. Then, the adhesive supplied to the tip surface 19b of the transfer pin 19 is applied to the package 3 The die attaching part 6 is pressed against a position around the pressure introducing hole 5 to transfer the adhesive.

In the transfer method of the third embodiment, the transfer is performed as described above. Therefore, regarding the application of the adhesive to the peripheral portion of the pressure introducing hole in the die attaching portion where the pressure introducing hole is formed,
The adhesive can be applied in a uniform thickness and in a uniform shape, and the transfer of the adhesive to the position of the pressure introducing hole is reliably prevented. Since the adhesive can be applied to the die-attached portion in a uniform thickness and in a uniform shape, the adhesive strength between the pressure sensor chip and the package is deteriorated due to the uneven coating thickness. The problem that the breakdown withstand voltage is lowered and the problem that the offset voltage of the pressure sensor chip varies greatly due to the variation in the application shape of the adhesive are solved, and the characteristics of the semiconductor pressure sensor can be improved and the characteristics can be stabilized.

[0034]

As described above, according to the adhesive transfer method of the inventions of claims 1 to 3 , the die-attached portion having the pressure introducing hole is bonded to the peripheral portion of the pressure introducing hole. With respect to the application of the agent, it is possible to apply the agent with a uniform thickness and a uniform shape, and it is possible to reliably prevent the adhesive agent from being transferred to the position of the pressure introducing hole.

Since the adhesive can be applied to the die-attached portion in a uniform thickness and in a uniform shape, the adhesive strength between the pressure sensor chip and the package is poor due to the uneven coating thickness. As a result, it is possible to solve the problems that the breakdown withstand voltage is reduced and the problem that the offset voltage of the pressure sensor chip is greatly varied due to the variation of the application shape of the adhesive, and the characteristics of the semiconductor pressure sensor can be improved and stabilized. Become.

Further, in the invention according to claim 2 ,
As compared with the invention according to the first aspect , there is an effect that the time of the transfer process can be shortened.

[Brief description of drawings]

FIG. 1 is a cross-sectional view for explaining a reference example of the present invention .

FIG. 2 is a perspective view showing a tip portion of a transfer pin in the reference example .

FIG. 3 is a cross-sectional view for explaining a step of transferring an adhesive to a die attaching portion in the reference example .

FIG. 4 is a sectional view for explaining the first embodiment.

FIG. 5 is a perspective view showing a tip portion of a transfer pin according to the first embodiment.

6A and 6B are perspective views for explaining a step of transferring the adhesive to the die attaching portion in the first embodiment, FIG. 6A shows a state in which the first transfer is finished, and FIG. The state where the second transfer is finished is shown.

FIG. 7 is a perspective view for explaining a step of transferring an adhesive to a die attaching portion in the second embodiment, (a) shows a state where the first transfer is finished, and (b) is a figure. The state where the second transfer is finished is shown.

FIG. 8 is a perspective view for explaining a third embodiment,
It shows a state before the tip surface of the transfer pin is pressed against the adhesive.

FIG. 9 is a perspective view for explaining a third embodiment,
The adhesive supplied to the tip surface of the transfer pin, and shows a state after transferred to a die mounting portion.

FIG. 10 is a sectional view for explaining the structure of a semiconductor pressure sensor.

FIG. 11 is a plan view showing an example of a conventional adhesive application method.

FIG. 12 is a plan view showing an example of a conventional adhesive application method different from that of FIG.

FIG. 13 shows an example of a conventional transfer pin, (a)
Is a side view and (b) is a plan view.

[Explanation of symbols]

1 Pressure sensor chip 2 glass pedestal 3 packages 4 adhesive 5 Pressure introduction hole 6 Die attaching part 7 diaphragm 13 Conventional transfer pin 13a tip 13b Tip surface 13c recess 15 Transfer pin 15a tip 15b Tip surface 15c cavity 15d notch 15e axis 16 transfer pins 16a tip 16b Tip surface 16c groove 16e axis 17 trays 18 Transfer pin 18A One transfer pin 18B Another transfer pin 19 Transfer pin 19A, 19B Child transfer pin 19a tip 19b Tip surface 19c recess 19d end 19e Division boundary surface 19f groove 20 heads 21 Transfer device

─────────────────────────────────────────────────── ─── Continuation of the front page (72) Inventor Tomohiro Inoue 1048, Kadoma, Kadoma, Osaka Prefecture Matsushita Electric Works Co., Ltd. (72) Takamasa Sakai, 1048, Kadoma, Kadoma City, Osaka Matsushita Electric Works, Ltd. (58) Fields surveyed (Int.Cl. ⁷ , DB name) H01L 21/52

Claims (3)

(57) [Claims] 1. A method of transferring an adhesive, wherein a transfer pin is used to transfer the adhesive to a die attachment part having a pressure introducing hole, in which a semiconductor pressure sensor chip having a silicon diaphragm is mounted. A gutter-shaped groove is formed at the tip
Use a transfer pin whose tip surface is approximately C-shaped.
The tip of the transfer pin was pressed against the adhesive on the tray.
After that, by separating it from this adhesive, the adhesive will stay on the same tip surface.
Is then supplied to the tip surface of the transfer pin.
Position the adhesive around the pressure introducing hole on the die attachment part.
And press it to form a continuous ring around the pressure introducing hole.
Adhesion characterized by transferring the adhesive as it forms
This is a method of transferring the agent, in which the adhesive supplied to the tip end surface of the transfer pin is approximately C around the pressure introducing hole of the die attaching part.
After the transfer is performed in the shape of a letter and the first transfer is performed, the direction of the tip surface of the transfer pin is changed by about 180 ° about the axis of the transfer pin from the direction of the first transfer. The adhesive newly supplied to the tip end surface of the die-attached portion is transferred in a substantially inverted C-shape around the pressure introduction hole, and the second transfer is performed. An adhesive transfer method for transferring an adhesive so as to form a substantially annular shape around the pressure introducing hole. 2. A method of transferring an adhesive , wherein a transfer pin is used to transfer the adhesive to a die attachment portion having a pressure introducing hole, in which a semiconductor pressure sensor chip having a silicon diaphragm is mounted. A gutter-shaped groove is formed at the tip
Use a transfer pin whose tip surface is approximately C-shaped.
The tip of the transfer pin was pressed against the adhesive on the tray.
After that, by separating it from this adhesive, the adhesive will stay on the same tip surface.
Is then supplied to the tip surface of the transfer pin.
Position the adhesive around the pressure introducing hole on the die attachment part.
And press it to form a continuous ring around the pressure introducing hole.
Adhesion characterized by transferring the adhesive as it forms
This is a method of transferring an agent, in which two transfer pins are used and the adhesive supplied to the tip surface of the first transfer pin is transferred in a substantially C-shape around the pressure introducing hole of the die attaching part. After the first transfer, the opening direction of the substantially C-shaped tip surface of the second transfer pin is changed from the opening direction of the substantially C-shaped tip surface of the first transfer pin at the time of the first transfer. , The adhesive supplied to the tip surface of the second transfer pin in a direction rotated by about 180 ° about the axis of the transfer pin is formed in a substantially inverted C shape around the pressure introduction hole of the die attaching part. A method of transferring an adhesive by transferring the adhesive in a circular shape and performing a second transfer so that the transferred adhesive forms a substantially annular shape around the pressure introducing hole. 3. A substantially columnar shape, which can be divided substantially evenly into the left and right with the axial surface as a boundary surface, and whose tip surface to which the adhesive is supplied has a substantially annular shape with a concave portion formed in the center. The transfer pin is provided with a head that supports the transfer pin at the end opposite to the front end surface side to which the adhesive of the transfer pin is supplied, and is substantially orthogonal to the dividing boundary surface of the transfer pin. A semiconductor pressure sensor chip equipped with a silicon diaphragm is mounted using a transfer device in which the transfer pin is mounted on the head so that the transfer pin after division in a direction can be moved close to and away from each other. A method of transferring an adhesive to a die-attached portion in which an introduction hole is formed, the method comprising:
-Shaped groove is formed and its tip surface is approximately C-shaped
Use a pin and attach the tip of this transfer pin to the tray.
After pressing on the adhesive, separate it from this adhesive
The adhesive is supplied on the tip surface, and then the tip surface of the transfer pin
The adhesive supplied to the
Press in the position around the inlet hole, and
Transferring the adhesive so as to form a continuous, substantially annular shape
A method of transferring an adhesive, characterized in that the adhesive is supplied to each tip surface of the divided transfer pins in a state where the transfer pins are divided and separated from each other, and then the divided transfer pins are divided. Are integrated so that the tip surface of the integrated transfer pin has a substantially annular shape, and then the adhesive supplied to the tip surface of the transfer pin is applied to the pressure introduction hole of the die attaching part. A method of transferring an adhesive so that it is transferred to the surrounding area.