JP2001094121A - Transfer pin and method for transferring adhesive using the same - Google Patents

Transfer pin and method for transferring adhesive using the same

Info

Publication number
JP2001094121A
JP2001094121A JP27071199A JP27071199A JP2001094121A JP 2001094121 A JP2001094121 A JP 2001094121A JP 27071199 A JP27071199 A JP 27071199A JP 27071199 A JP27071199 A JP 27071199A JP 2001094121 A JP2001094121 A JP 2001094121A
Authority
JP
Japan
Prior art keywords
adhesive
transfer pin
die attaching
pressure sensor
attaching portion
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP27071199A
Other languages
Japanese (ja)
Inventor
Hiroshi Saito
宏 齊藤
Shigenari Takami
茂成 高見
Mitsuhiro Kani
充弘 可児
Tomohiro Inoue
智広 井上
Takamasa Sakai
孝昌 酒井
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Panasonic Electric Works Co Ltd
Original Assignee
Matsushita Electric Works Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Matsushita Electric Works Ltd filed Critical Matsushita Electric Works Ltd
Priority to JP27071199A priority Critical patent/JP2001094121A/en
Publication of JP2001094121A publication Critical patent/JP2001094121A/en
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies
    • H01L24/741—Apparatus for manufacturing means for bonding, e.g. connectors
    • H01L24/743—Apparatus for manufacturing layer connectors
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies and for methods related thereto
    • H01L2224/741—Apparatus for manufacturing means for bonding, e.g. connectors
    • H01L2224/743—Apparatus for manufacturing layer connectors

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Pressure Sensors (AREA)
  • Die Bonding (AREA)

Abstract

PROBLEM TO BE SOLVED: To provide a jig and a method which enable application of an adhesive to a die-bonding part with a uniform thickness and a uniform shape, without being applied to a pressure introducing hole formed at the center of the die- bonding part. SOLUTION: This transfer pin comprises a bottom 15 almost flat in a tip 14 which adheres an adhesive, a center subjected to mirror-surface finish in the almost flat bottom 15, and a roughened outer periphery which surrounds this center. Another transfer pin has a projection, of which the top face is flat in the bottom of a tip which adheres an adhesive and a flat outer periphery which surrounds this projection. This method for transferring an adhesive is designed to remove the adhesive adhering to the top face of a projection of this transfer pin and to transfer the adhesive adhering to an outer periphery one step lower below the top dace to a die-bonding part.

Description

【発明の詳細な説明】DETAILED DESCRIPTION OF THE INVENTION

【０００１】[0001]

【発明の属する技術分野】本発明は、半導体圧力センサ
チップの実装に用いる接着剤を実装位置に転写する転写
ピン及び転写ピンを用いた接着剤の転写方法に関するも
のである。[0001] 1. Field of the Invention [0002] The present invention relates to a transfer pin for transferring an adhesive used for mounting a semiconductor pressure sensor chip to a mounting position and a method of transferring the adhesive using the transfer pin.

【０００２】[0002]

【従来の技術】従来から圧力測定に使用される半導体圧
力センサが知られている。図５は、圧力導入孔が形成さ
れたパッケージのダイ付け部に接着剤を用いて半導体圧
力センサチップを実装している半導体圧力センサの一例
を示す断面図であり、この半導体圧力センサは微圧領域
の圧力測定に使用される。図５で、半導体圧力センサチ
ップ１はガラス台座２に陽極接合等の方法で固着されて
いて、ガラス台座２はＰＰＳやＰＢＴ等のプラスチック
材料よりなるパッケージ３と、低応力のシリコーンやエ
ポキシ樹脂等からなる接着剤４によって接着されてい
る。2. Description of the Related Art Conventionally, a semiconductor pressure sensor used for pressure measurement has been known. FIG. 5 is a cross-sectional view showing an example of a semiconductor pressure sensor in which a semiconductor pressure sensor chip is mounted on a die attaching portion of a package having a pressure introducing hole by using an adhesive, and the semiconductor pressure sensor is a micro pressure sensor. Used for pressure measurement of a region. In FIG. 5, a semiconductor pressure sensor chip 1 is fixed to a glass pedestal 2 by anodic bonding or the like, and the glass pedestal 2 is made of a package 3 made of a plastic material such as PPS or PBT and a low-stress silicone or epoxy resin. Are bonded by an adhesive 4 made of.

【０００３】パッケージ３にはリード９がプリモールド
されており、リード９と半導体圧力センサチップ１のア
ルミ配線とは金又はアルミのワイヤ８でボンディングさ
れている。半導体圧力センサの検知対象は圧力であり、
ガラス台座２及びパッケージ３には、半導体圧力センサ
チップ１に圧力を印加するための圧力導入孔５が貫通孔
として形成されていて、この圧力導入孔５はダイ付け部
６の中央に位置している。また、図５で７はシリコンダ
イヤフラム、１０はふた、１１はオーバーコートを示し
ている。なお、ガラス台座２を介することなく、ダイ付
け部６に直接半導体圧力センサチップ１を接着剤４で接
着する場合もある。A lead 9 is pre-molded on the package 3, and the lead 9 and an aluminum wiring of the semiconductor pressure sensor chip 1 are bonded by a gold or aluminum wire 8. The detection target of the semiconductor pressure sensor is pressure,
A pressure introducing hole 5 for applying pressure to the semiconductor pressure sensor chip 1 is formed as a through hole in the glass pedestal 2 and the package 3, and the pressure introducing hole 5 is located at the center of the die attaching portion 6. I have. In FIG. 5, 7 indicates a silicon diaphragm, 10 indicates a lid, and 11 indicates an overcoat. In some cases, the semiconductor pressure sensor chip 1 is directly bonded to the die attaching portion 6 with the adhesive 4 without using the glass pedestal 2.

【０００４】図６は、パッケージ３の半導体圧力センサ
チップ１を実装するダイ付け部６に、接着剤４をディス
ペンサノズル１２から塗布している一例を示していて、
この図７ではディスペンサノズル１２を圧力導入孔５の
周りに、円弧を描くように移動して接着剤４を塗布して
いる。一方、図７はパッケージ３の半導体圧力センサチ
ップ１を実装するダイ付け部６に、接着剤４をディスペ
ンサノズル１２から塗布している他の例を示していて、
この図７では圧力導入孔５の周りに散在する多数のポイ
ントに、接着剤４を塗布している。なお、ダイ付け部６
の中央に形成されている圧力導入孔５に接着剤が塗布さ
れると穴詰まりが生じるので、圧力導入孔５の部分には
接着剤を塗布せずに、その周囲部分に接着剤を塗布する
必要がある。FIG. 6 shows an example in which an adhesive 4 is applied from a dispenser nozzle 12 to a die attaching portion 6 on which the semiconductor pressure sensor chip 1 of the package 3 is mounted.
In FIG. 7, the adhesive 4 is applied by moving the dispenser nozzle 12 around the pressure introducing hole 5 so as to draw an arc. On the other hand, FIG. 7 shows another example in which the adhesive 4 is applied from the dispenser nozzle 12 to the die attaching portion 6 on which the semiconductor pressure sensor chip 1 of the package 3 is mounted.
In FIG. 7, the adhesive 4 is applied to many points scattered around the pressure introducing hole 5. In addition, the die attaching part 6
When the adhesive is applied to the pressure introducing hole 5 formed in the center of the hole, the hole is clogged. Therefore, the adhesive is not applied to the portion of the pressure introducing hole 5 but the peripheral portion thereof is applied with the adhesive. There is a need.

【０００５】上記の図６に示す方法では、接着剤４を連
続的に均一な厚さで塗布することは困難であった。すな
わち、ディスペンサノズル１２からの接着剤４の吐出量
は、スタート点ではかすれ気味であり、圧力導入孔５を
一周した後の終着点では接着剤４の垂れのために多く塗
布される傾向があった。このように、接着剤４をダイ付
け部６に連続的に均一な厚さで塗布できない場合には、
ガラス台座２と一体化している圧力センサチップ１とパ
ッケージ３との接着強度が悪くなることによる破壊耐圧
が低下する問題や、接着剤４の塗布形状のばらつきによ
って生じる圧力センサチップ１のオフセット電圧のばら
つきが大きくなる等の問題が発生する。In the method shown in FIG. 6, it is difficult to continuously apply the adhesive 4 with a uniform thickness. That is, the discharge amount of the adhesive 4 from the dispenser nozzle 12 tends to be faint at the start point, and tends to be applied more at the end point after making a full round of the pressure introduction hole 5 due to the dripping of the adhesive 4. Was. As described above, when the adhesive 4 cannot be continuously applied to the die attaching portion 6 with a uniform thickness,
There is a problem in that the breakdown strength is reduced due to a decrease in the adhesive strength between the pressure sensor chip 1 integrated with the glass pedestal 2 and the package 3, and an offset voltage of the pressure sensor chip 1 caused by a variation in the application shape of the adhesive 4. Problems such as large variations occur.

【０００６】また、図７に示す方法では、圧力導入孔５
の周りに散在する多数のポイントに塗布した接着剤４
は、時間の経過と共に拡がり、いずれはつながるが、接
着剤４の塗布量のばらつき等のため、厚みを均一に塗布
することは困難であり、図６に示す方法と同様の問題が
あった。また、多数のポイントに塗布するため、塗布の
ための時間が長く、コストアップになっていた。[0006] In the method shown in FIG.
Glue 4 applied to many points scattered around
Spreads over time and eventually connects, but it is difficult to apply a uniform thickness due to a variation in the applied amount of the adhesive 4 and the like, which has the same problem as the method shown in FIG. In addition, since the coating is applied to a large number of points, the time for the coating is long and the cost is increased.

【０００７】[0007]

【発明が解決しようとする課題】本発明は上記の事情に
鑑みてなされたものであり、ダイ付け部の中央に形成さ
れている圧力導入孔に接着剤が塗布されることなしに、
ダイ付け部に接着剤を、均一な厚さで、且つ均一な形状
に塗布できる治具や方法を提供することを課題としてい
る。SUMMARY OF THE INVENTION The present invention has been made in view of the above-mentioned circumstances, and an adhesive is not applied to a pressure introducing hole formed at the center of a die attaching portion.
It is an object of the present invention to provide a jig and a method capable of applying an adhesive to a die attaching portion with a uniform thickness and a uniform shape.

【０００８】[0008]

【課題を解決するための手段】請求項１に係る発明の転
写ピンは、シリコンダイヤフラムを備えた半導体圧力セ
ンサチップが実装される、圧力導入孔が形成されたダイ
付け部に接着剤を転写する際に用いる略柱状の転写ピン
であって、接着剤を付着させる先端部の底面が略平坦で
あり、その略平坦な底面に鏡面加工が施された中央部
と、この中央部を囲んでいる粗面加工が施された外周部
を備えている転写ピンである。According to a first aspect of the present invention, there is provided a transfer pin for transferring an adhesive to a die attaching portion provided with a pressure introducing hole, on which a semiconductor pressure sensor chip having a silicon diaphragm is mounted. A substantially columnar transfer pin used in this case, the bottom surface of the tip to which the adhesive is applied is substantially flat, and the substantially flat bottom surface is mirror-finished to a central portion and surrounds the central portion. This is a transfer pin having an outer peripheral portion subjected to roughening.

【０００９】この転写ピンは、底面に鏡面加工が施され
た中央部と、粗面加工が施された外周部を備えているの
で、転写ピンの底面をトレイに盛った接着剤に押し付け
た後、転写ピンを引き上げてその底面に接着剤を付着さ
せたときに、粗面加工された外周部のみに接着剤を選択
的に付着させることができる。従って、この転写ピンを
用いると、ダイ付け部の中央に形成されている圧力導入
孔に接着剤が塗布されることなしに、ダイ付け部に接着
剤を均一な厚さで、且つ均一な形状に塗布できるように
なる。This transfer pin has a central portion with a mirror-finished bottom surface and an outer peripheral portion with a roughened surface, so that the bottom surface of the transfer pin is pressed against an adhesive piled on a tray. When the transfer pin is pulled up and the adhesive is applied to the bottom surface, the adhesive can be selectively applied only to the roughened outer peripheral portion. Therefore, when this transfer pin is used, the adhesive is applied to the die attaching portion with a uniform thickness and a uniform shape without applying the adhesive to the pressure introducing hole formed in the center of the die attaching portion. It can be applied to

【００１０】請求項２に係る発明の転写ピンは、シリコ
ンダイヤフラムを備えた半導体圧力センサチップが実装
される、圧力導入孔が形成されたダイ付け部に接着剤を
転写する際に用いる略柱状の転写ピンであって、接着剤
を付着させる先端部の底面に、頂上面が平坦面である凸
部と、この凸部を囲んでいる平坦な外周面を形成してい
る転写ピンである。According to a second aspect of the present invention, there is provided a transfer pin having a substantially columnar shape used for transferring an adhesive to a die attaching portion provided with a pressure introducing hole, on which a semiconductor pressure sensor chip having a silicon diaphragm is mounted. The transfer pin is a transfer pin in which a convex portion having a flat top surface and a flat outer peripheral surface surrounding the convex portion are formed on a bottom surface of a tip portion to which an adhesive is adhered.

【００１１】この転写ピンは、接着剤を付着させる先端
部の底面に、頂上面が平坦である凸部と、この凸部を囲
んでいる平坦な外周面を形成しているので、凸部を形成
している転写ピンの底面全体に接着剤を付着させた後、
凸部の頂上面に付着している接着剤を除去し、次いで、
頂上面から一段低い外周面に付着している接着剤をダイ
付け部に転写することができる。従って、この転写ピン
を用いると、ダイ付け部の中央に形成されている圧力導
入孔に接着剤が塗布されることなしに、ダイ付け部に接
着剤を、均一な厚さで、且つ均一な形状に塗布できるよ
うになる。The transfer pin has a flat top surface and a flat outer peripheral surface surrounding the convex portion on the bottom surface of the tip to which the adhesive is adhered. After attaching the adhesive to the entire bottom surface of the transfer pin being formed,
Remove the adhesive adhering to the top surface of the projection, and then
The adhesive attached to the outer peripheral surface one step lower than the top surface can be transferred to the die attaching portion. Therefore, when this transfer pin is used, the adhesive is applied to the die attaching portion with a uniform thickness and a uniform thickness without applying the adhesive to the pressure introducing hole formed in the center of the die attaching portion. It can be applied to shapes.

【００１２】請求項３に係る発明の接着剤の転写方法
は、半導体圧力センサチップが実装される、圧力導入孔
が形成されたダイ付け部に請求項２記載の転写ピンを用
いて接着剤を転写する接着剤の転写方法であって、凸部
を形成している転写ピンの底面全体に接着剤を付着させ
た後、凸部の頂上面に付着している接着剤を除去し、次
いで、頂上面から一段低い外周面に付着している接着剤
をダイ付け部に転写するようにした接着剤の転写方法で
ある。According to a third aspect of the present invention, there is provided a method for transferring an adhesive using a transfer pin according to the second aspect, to a die attaching portion on which a semiconductor pressure sensor chip is mounted and on which a pressure introducing hole is formed. A method of transferring an adhesive to be transferred, wherein the adhesive is attached to the entire bottom surface of the transfer pin forming the convex portion, and then the adhesive attached to the top surface of the convex portion is removed. This is a method of transferring an adhesive, which transfers an adhesive attached to an outer peripheral surface one step lower than a top surface to a die attaching portion.

【００１３】この方法では凸部の頂上面に付着している
接着剤を除去した後で、頂上面から一段低い外周面に付
着している接着剤をダイ付け部に転写するので、ダイ付
け部の中央に形成されている圧力導入孔に接着剤が塗布
されることなしに、ダイ付け部に接着剤を、均一な厚さ
で、且つ均一な形状に塗布できるようになる。In this method, after the adhesive adhering to the top surface of the projection is removed, the adhesive adhering to the outer peripheral surface one step lower than the top surface is transferred to the die attaching portion. The adhesive can be applied to the die attaching portion with a uniform thickness and a uniform shape without applying the adhesive to the pressure introducing hole formed in the center of the die.

【００１４】[0014]

【発明の実施の形態】図１は、請求項１の発明に対応す
る第1 実施形態を説明するための断面図である。第１実
施形態の転写ピン１３は四角柱状であり、接着剤を付着
させる先端部１４の底面１５が平坦面として形成されて
いる。転写ピン１３の形状は略柱状であればよく、例え
ば円柱、多角柱等の形状が採用できる。図２は転写ピン
１３の底面図であり、底面１５には、鏡面加工が施され
た円形状の中央部１６と、粗面加工が施された外周部１
７を備えている。中央部１６の形状については、特に限
定はないが、この実施形態のように円形状であれば、圧
力導入孔の周囲に均一な幅の隙間を開けて接着剤を塗布
できるので好ましい。また、外周部１７の粗面加工につ
いては、＃４００から＃２０００の粗さで加工すること
が好ましい。先端部１４を形成する材料としては、特に
限定はないが、例えばガラス、ステンレススチール、真
鍮、フッ素樹脂等を用いることができ、母材にフッ素樹
脂をコートしたものを用いることもできる。FIG. 1 is a sectional view for explaining a first embodiment corresponding to the first aspect of the present invention. The transfer pin 13 according to the first embodiment has a quadrangular prism shape, and the bottom surface 15 of the tip portion 14 to which an adhesive is adhered is formed as a flat surface. The shape of the transfer pin 13 may be a substantially columnar shape. FIG. 2 is a bottom view of the transfer pin 13, and a bottom surface 15 has a circular central portion 16 subjected to mirror finishing and an outer peripheral portion 1 subjected to roughening.
7 is provided. The shape of the central portion 16 is not particularly limited, but is preferably a circular shape as in this embodiment because an adhesive having a uniform width can be formed around the pressure introducing hole to apply the adhesive. As for the rough surface processing of the outer peripheral portion 17, it is preferable to process with a roughness of # 400 to # 2000. The material for forming the distal end portion 14 is not particularly limited. For example, glass, stainless steel, brass, fluororesin, or the like can be used, and a material obtained by coating a base material with fluororesin can also be used.

【００１５】そして、使用方法としては、図１に示すよ
うに、転写ピン１３の底面１５をトレイ１８に盛った接
着剤４に押し付けた後、転写ピン１３を引き上げてその
底面１５に接着剤４を付着させる。その場合、粗面加工
された外周部１７にのみ接着剤４は選択的に付着し、中
央部１６は鏡面加工されているので接着剤は付着しな
い。従って、この転写ピン１３を用いると、ダイ付け部
の中央に形成されている圧力導入孔に接着剤が塗布され
ることなしに、ダイ付け部に接着剤を、均一な厚さで、
且つ均一な形状に塗布できる。As shown in FIG. 1, the transfer pin 13 is pressed against the adhesive 4 piled up on the tray 18 and then the transfer pin 13 is pulled up, as shown in FIG. To adhere. In this case, the adhesive 4 selectively adheres only to the roughened outer peripheral portion 17 and the central portion 16 is mirror-finished, so that the adhesive does not adhere. Therefore, when the transfer pin 13 is used, the adhesive is applied to the die attaching portion with a uniform thickness without applying the adhesive to the pressure introducing hole formed in the center of the die attaching portion.
In addition, it can be applied in a uniform shape.

【００１６】図３は、請求項２及び請求項３の発明に対
応する第２実施形態を説明するための断面図である。こ
の実施形態の転写ピン１３は四角柱状であり、接着剤を
付着させる先端部１４の底面１５に、頂上面１９が平坦
面である凸部２０と、この凸部２０を囲んでいる平坦な
外周面２１を備えている。転写ピン１３の形状は略柱状
であればよく、例えば円柱、多角柱等の形状が採用でき
る。頂上面１９と外周面２１との段差は１０μｍ〜５０
μｍ程度に形成するのが好ましい。FIG. 3 is a cross-sectional view for explaining a second embodiment corresponding to the second and third aspects of the present invention. The transfer pin 13 of this embodiment has a quadrangular prism shape, a convex portion 20 having a flat top surface 19 on a bottom surface 15 of a tip portion 14 to which an adhesive is adhered, and a flat outer periphery surrounding the convex portion 20. Surface 21 is provided. The shape of the transfer pin 13 may be a substantially columnar shape. For example, a shape such as a circular column or a polygonal column can be adopted. The step between the top surface 19 and the outer peripheral surface 21 is 10 μm to 50 μm.
It is preferable that the thickness be about μm.

【００１７】図４は第２実施形態における転写ピン１３
の底面図であり、底面１５には、頂上面１９が円形状に
形成された凸部２０と、その周囲に平坦な外周面２１が
形成されている。頂上面１９の形状については、特に限
定はないが、この実施形態のように円形状であれば、圧
力導入孔の周囲に均一な幅の隙間を開けて接着剤を塗布
できるので好ましい。FIG. 4 shows a transfer pin 13 according to the second embodiment.
The bottom surface 15 is formed with a convex portion 20 having a top surface 19 formed in a circular shape, and a flat outer peripheral surface 21 around the convex portion 20. The shape of the top surface 19 is not particularly limited, but is preferably a circular shape as in this embodiment, since an adhesive having a uniform width can be formed around the pressure introducing hole to apply the adhesive.

【００１８】このような先端部１４を備えた転写ピン１
３の底面１５をトレイに盛った接着剤に押し付けた後、
転写ピン１３を引き上げてその底面１５の全面に接着剤
を付着させる。次いで、図３に示すように、テーブル２
３の上に設置したスキージ（材料はシリコンゴム等）２
２の上面を、転写ピン１３の底面１５が擦るように、転
写ピン１３を横方向に移動して、凸部２０の頂上面１９
に付着している接着剤４を除去する。その結果、頂上面
１９から一段低い外周面２１にのみ接着剤４が付着して
いる図３の状態となる。この状態にした後で接着剤をダ
イ付け部に転写して、圧力導入孔の周囲に均一な幅の隙
間を開けて接着剤を塗布する。The transfer pin 1 having such a tip 14
After pressing the bottom 15 of 3 on the adhesive piled on the tray,
The transfer pin 13 is pulled up, and an adhesive is applied to the entire bottom surface 15 thereof. Then, as shown in FIG.
Squeegee installed on 3 (Material is silicon rubber etc.) 2
The transfer pin 13 is moved laterally so that the bottom surface 15 of the transfer pin 13 rubs the upper surface of
The adhesive 4 adhering to is removed. As a result, the state shown in FIG. 3 is obtained in which the adhesive 4 is adhered only to the outer peripheral surface 21 which is one step lower than the top surface 19. After this state, the adhesive is transferred to the die attaching portion, and a gap having a uniform width is formed around the pressure introducing hole, and the adhesive is applied.

【００１９】このように、この転写ピンを用いると、ダ
イ付け部の中央に形成されている圧力導入孔に接着剤が
塗布されることなしに、ダイ付け部に接着剤を、均一な
厚さで、且つ均一な形状に塗布できる。As described above, when this transfer pin is used, the adhesive is applied to the die attaching portion with a uniform thickness without applying the adhesive to the pressure introducing hole formed at the center of the die attaching portion. And can be applied in a uniform shape.

【００２０】[0020]

【発明の効果】上述の如く、請求項１に係る発明の転写
ピンは、底面に鏡面加工が施された中央部と、粗面加工
が施された外周部を備えているので、転写ピンの底面を
接着剤に押し付けた後、転写ピンを引き上げてその底面
に接着剤を付着させたときに、粗面加工された外周部の
みに接着剤を選択的に付着させることができる。従っ
て、この転写ピンを用いると、ダイ付け部の中央に形成
されている圧力導入孔に接着剤が塗布されることなし
に、ダイ付け部に接着剤を均一な厚さで、且つ均一な形
状に塗布できる。そのため、この転写ピンを用いると、
均一な厚さで塗布できない場合に生じる、圧力センサチ
ップとパッケージとの接着強度が悪くなることによる破
壊耐圧が低下する問題、及び接着剤の塗布形状のばらつ
きによって生じる圧力センサチップのオフセット電圧の
ばらつきが大きくなるという問題を解消できる。As described above, the transfer pin according to the first aspect of the present invention is provided with a central portion having a mirror-finished bottom surface and an outer peripheral portion having a roughened surface. After the bottom surface is pressed against the adhesive, when the transfer pin is pulled up and the adhesive is applied to the bottom surface, the adhesive can be selectively applied only to the roughened outer peripheral portion. Therefore, when this transfer pin is used, the adhesive is applied to the die attaching portion with a uniform thickness and a uniform shape without applying the adhesive to the pressure introducing hole formed in the center of the die attaching portion. Can be applied to Therefore, if this transfer pin is used,
The problem of reduced breakdown voltage due to poor bonding strength between the pressure sensor chip and the package, which occurs when the coating cannot be performed with a uniform thickness, and the variation in the offset voltage of the pressure sensor chip caused by the variation in the shape of the applied adhesive. Can be solved.

【００２１】請求項２に係る発明の転写ピンは、接着剤
を付着させる先端部の底面に、頂上面が平坦である凸部
と、この凸部を囲んでいる平坦な外周面を形成している
ので、凸部を形成している転写ピンの底面全体に接着剤
を付着させた後、凸部の頂上面に付着している接着剤を
除去し、次いで、頂上面から一段低い外周面に付着して
いる接着剤をダイ付け部に転写することができる。従っ
て、この転写ピンを用いると、ダイ付け部の中央に形成
されている圧力導入孔に接着剤が塗布されることなし
に、ダイ付け部に接着剤を、均一な厚さで、且つ均一な
形状に塗布できるようになる。そのため、この転写ピン
を用いると、均一な厚さで塗布できない場合に生じる、
圧力センサチップとパッケージとの接着強度が悪くなる
ことによる破壊耐圧が低下する問題、及び接着剤の塗布
形状のばらつきによって生じる圧力センサチップのオフ
セット電圧のばらつきが大きくなるという問題を解消で
きる。According to a second aspect of the present invention, there is provided a transfer pin in which a convex portion having a flat top surface and a flat outer peripheral surface surrounding the convex portion are formed on the bottom surface of the tip portion to which the adhesive is adhered. Since the adhesive is adhered to the entire bottom surface of the transfer pin forming the convex portion, the adhesive adhered to the top surface of the convex portion is removed, and then, the outer peripheral surface is lowered by one step from the top surface. The adhered adhesive can be transferred to the die attaching portion. Therefore, when this transfer pin is used, the adhesive is applied to the die attaching portion with a uniform thickness and a uniform thickness without applying the adhesive to the pressure introducing hole formed in the center of the die attaching portion. It can be applied to shapes. Therefore, when this transfer pin is used, it occurs when coating cannot be performed with a uniform thickness.
It is possible to solve the problem that the breakdown voltage is reduced due to the decrease in the bonding strength between the pressure sensor chip and the package, and the problem that the offset voltage variation of the pressure sensor chip caused by the variation of the applied shape of the adhesive increases.

【００２２】請求項３に係る発明の接着剤の転写方法で
は、凸部の頂上面に付着している接着剤を除去した後
で、頂上面から一段低い外周面に付着している接着剤を
ダイ付け部に転写するので、この方法によれば、ダイ付
け部の中央に形成されている圧力導入孔に接着剤が塗布
されることなしに、ダイ付け部に接着剤を、均一な厚さ
で、且つ均一な形状に塗布できるようになる。そのた
め、この方法によれば、均一な厚さで塗布できない場合
に生じる、圧力センサチップとパッケージとの接着強度
が悪くなることによる破壊耐圧が低下する問題、及び接
着剤の塗布形状のばらつきによって生じる圧力センサチ
ップのオフセット電圧のばらつきが大きくなるという問
題を解消できる。In the method of transferring an adhesive according to the third aspect of the present invention, after removing the adhesive adhering to the top surface of the projection, the adhesive adhering to the outer peripheral surface one step lower than the top surface is removed. According to this method, the adhesive is transferred to the die attaching portion, and the adhesive is uniformly applied to the die attaching portion without applying the adhesive to the pressure introducing hole formed in the center of the die attaching portion. And can be applied in a uniform shape. Therefore, according to this method, the problem arises when the coating cannot be performed with a uniform thickness, the breakdown pressure is reduced due to the decrease in the adhesive strength between the pressure sensor chip and the package, and the variation in the applied shape of the adhesive causes the problem. The problem that the offset voltage of the pressure sensor chip varies greatly can be solved.

【図面の簡単な説明】[Brief description of the drawings]

【図１】第１実施形態を説明するための断面図である。FIG. 1 is a sectional view for explaining a first embodiment.

【図２】第１実施形態の転写ピンの底面図である。FIG. 2 is a bottom view of the transfer pin according to the first embodiment.

【図３】第２実施形態を説明するための断面図である。FIG. 3 is a cross-sectional view illustrating a second embodiment.

【図４】第２実施形態の転写ピンの底面図である。FIG. 4 is a bottom view of a transfer pin according to a second embodiment.

【図５】半導体圧力センサの構造を説明するための断面
図である。FIG. 5 is a sectional view for explaining the structure of a semiconductor pressure sensor.

【図６】従来の接着剤塗布方法の一例を示す平面図であ
る。FIG. 6 is a plan view showing an example of a conventional adhesive application method.

【図７】図６とは異なる従来の接着剤塗布方法の一例を
示す平面図である。FIG. 7 is a plan view showing an example of a conventional adhesive application method different from FIG.

【符号の説明】[Explanation of symbols]

１ 圧力センサチップ ２ ガラス台座 ３ パッケージ ４ 接着剤 ５ 圧力導入孔 ６ ダイ付け部 ７ ダイヤフラム １２ ディスペンサノズル １３ 転写ピン １４ 先端部 １５ 底面 １６ 中央部 １７ 外周部 １８ トレイ １９ 頂上面 ２０ 凸部 ２１ 外周面 ２２ スキージ ２３ テーブル DESCRIPTION OF SYMBOLS 1 Pressure sensor chip 2 Glass pedestal 3 Package 4 Adhesive 5 Pressure introduction hole 6 Die attaching part 7 Diaphragm 12 Dispenser nozzle 13 Transfer pin 14 Tip 15 Bottom 16 Central part 17 Outer part 18 Tray 19 Top surface 20 Convex part 21 Outer surface 22 squeegee 23 table

───────────────────────────────────────────────────── フロントページの続き (72)発明者 可児 充弘 大阪府門真市大字門真1048番地松下電工株 式会社内 (72)発明者 井上 智広 大阪府門真市大字門真1048番地松下電工株 式会社内 (72)発明者 酒井 孝昌 大阪府門真市大字門真1048番地松下電工株 式会社内 Ｆターム(参考） 4M112 AA01 BA01 CA15 CA16 DA18 EA02 EA14 GA01 5F047 AA13 AB01 BA21 BB11 BB16 FA21  ──────────────────────────────────────────────────続 き Continuing on the front page (72) Inventor: Mitsuhiro Kani 1048, Kazuma, Kadoma, Osaka Prefecture Inside Matsushita Electric Works Co., Ltd. 72) Inventor Takamasa Sakai 1048 Kadoma, Kazuma, Osaka Prefecture F-term in Matsushita Electric Works Co., Ltd.

Claims (3)

【特許請求の範囲】[Claims] 【請求項１】 シリコンダイヤフラムを備えた半導体圧
力センサチップが実装される、圧力導入孔が形成された
ダイ付け部に接着剤を転写する際に用いる略柱状の転写
ピンであって、接着剤を付着させる先端部の底面が略平
坦であり、その略平坦な底面に鏡面加工が施された中央
部と、この中央部を囲んでいる粗面加工が施された外周
部を備えている転写ピン。1. A substantially columnar transfer pin used when transferring an adhesive to a die attaching portion on which a pressure introducing hole is formed, on which a semiconductor pressure sensor chip having a silicon diaphragm is mounted. A transfer pin having a substantially flat bottom surface at the tip end to be attached, a mirror-finished central portion on the substantially flat bottom surface, and a roughened outer peripheral portion surrounding the central portion. . 【請求項２】 シリコンダイヤフラムを備えた半導体圧
力センサチップが実装される、圧力導入孔が形成された
ダイ付け部に接着剤を転写する際に用いる略柱状の転写
ピンであって、接着剤を付着させる先端部の底面に、頂
上面が平坦面である凸部と、この凸部を囲んでいる平坦
な外周面を形成している転写ピン。2. A substantially columnar transfer pin used for transferring an adhesive to a die attaching portion, on which a pressure introducing hole is formed, on which a semiconductor pressure sensor chip having a silicon diaphragm is mounted. A transfer pin having, on the bottom surface of the tip portion to be attached, a convex portion having a flat top surface and a flat outer peripheral surface surrounding the convex portion. 【請求項３】 半導体圧力センサチップが実装される、
圧力導入孔が形成されたダイ付け部に請求項２記載の転
写ピンを用いて接着剤を転写する接着剤の転写方法であ
って、凸部を形成している転写ピンの底面全体に接着剤
を付着させた後、凸部の頂上面に付着している接着剤を
除去し、次いで、頂上面から一段低い外周面に付着して
いる接着剤をダイ付け部に転写するようにした接着剤の
転写方法。3. A semiconductor pressure sensor chip is mounted.
3. An adhesive transfer method for transferring an adhesive using a transfer pin according to claim 2 to a die attaching portion in which a pressure introducing hole is formed, wherein the adhesive is formed on the entire bottom surface of the transfer pin having a convex portion. After the adhesive is attached, the adhesive attached to the top surface of the convex portion is removed, and then the adhesive attached to the outer peripheral surface one step lower than the top surface is transferred to the die attaching portion. Transfer method.
JP27071199A 1999-09-24 1999-09-24 Transfer pin and method for transferring adhesive using the same Pending JP2001094121A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP27071199A JP2001094121A (en) 1999-09-24 1999-09-24 Transfer pin and method for transferring adhesive using the same

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP27071199A JP2001094121A (en) 1999-09-24 1999-09-24 Transfer pin and method for transferring adhesive using the same

Publications (1)

Publication Number Publication Date
JP2001094121A true JP2001094121A (en) 2001-04-06

Family

ID=17489908

Family Applications (1)

Application Number Title Priority Date Filing Date
JP27071199A Pending JP2001094121A (en) 1999-09-24 1999-09-24 Transfer pin and method for transferring adhesive using the same

Country Status (1)

Country Link
JP (1) JP2001094121A (en)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2014140791A (en) * 2013-01-22 2014-08-07 Honda Motor Co Ltd Coating device of viscous material
CN111725127A (en) * 2019-03-19 2020-09-29 日本碍子株式会社 Chip carrying device and manufacturing method thereof

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2014140791A (en) * 2013-01-22 2014-08-07 Honda Motor Co Ltd Coating device of viscous material
CN111725127A (en) * 2019-03-19 2020-09-29 日本碍子株式会社 Chip carrying device and manufacturing method thereof
CN111725127B (en) * 2019-03-19 2023-06-27 日本碍子株式会社 Chip mounting device and method for manufacturing the same

Similar Documents

Publication Publication Date Title
JP3197788B2 (en) Method for manufacturing semiconductor device
US9381729B2 (en) Device for detaching a product substrate off a carrier substrate
JP2001094121A (en) Transfer pin and method for transferring adhesive using the same
EP1152408A2 (en) Method and apparatus for bonding optical disc substrates together, and method for supplying liquid material
JP3367458B2 (en) Method for manufacturing semiconductor device
JP2007036074A (en) Method for manufacturing semiconductor device
CN110193452B (en) Coating method, coating apparatus, and method for manufacturing component
JP3520820B2 (en) Adhesive transfer method
CN111960380A (en) Process method for realizing micro-gap assembly based on temporary suspension beam structure
JP2008147899A (en) Method of manufacturing component of electret condenser microphone unit
US11830756B2 (en) Temporary die support structures and related methods
KR20070025566A (en) Lead frame having recessed diepad and semiconductor package
JP2001087690A (en) Transfer pin
JP2005021838A (en) Needle and discharge outlet member of discharging device
JP2002009232A (en) Adhesive coating apparatus and method for producing semiconductor device by using the same
JP4011178B2 (en) Semiconductor device manufacturing method, resin substrate and tape used therefor
JPH03238834A (en) Method and device for coating of paste
JP3520817B2 (en) Transfer pin and adhesive transfer method using the same
JP3858911B2 (en) Transfer method of adhesive using transfer pin
KR101885508B1 (en) Underglass fingerprint sensor package and manufacturing method thereof
US20080096322A1 (en) Manufacturing method of semiconductor chip
JP2001102598A (en) Transfer pin and method for transferring adhesives using it
TW201018977A (en) A camera module and a method for making the same
JPH07183416A (en) Box-type resin molded body for semiconductor device and manufacture thereof
JPH08186226A (en) Lead frame and substrate

Legal Events

Date Code Title Description
A977 Report on retrieval

Effective date: 20040330

Free format text: JAPANESE INTERMEDIATE CODE: A971007

A131 Notification of reasons for refusal

Free format text: JAPANESE INTERMEDIATE CODE: A131

Effective date: 20040406

A02 Decision of refusal

Free format text: JAPANESE INTERMEDIATE CODE: A02

Effective date: 20040817