JPH0525736Y2 - - Google Patents

Info

Publication number
JPH0525736Y2
JPH0525736Y2 JP1987068041U JP6804187U JPH0525736Y2 JP H0525736 Y2 JPH0525736 Y2 JP H0525736Y2 JP 1987068041 U JP1987068041 U JP 1987068041U JP 6804187 U JP6804187 U JP 6804187U JP H0525736 Y2 JPH0525736 Y2 JP H0525736Y2
Authority
JP
Japan
Prior art keywords
extrusion piston
high viscosity
groove
container
contents
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
JP1987068041U
Other languages
English (en)
Japanese (ja)
Other versions
JPS63176576U (enrdf_load_stackoverflow
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP1987068041U priority Critical patent/JPH0525736Y2/ja
Publication of JPS63176576U publication Critical patent/JPS63176576U/ja
Application granted granted Critical
Publication of JPH0525736Y2 publication Critical patent/JPH0525736Y2/ja
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies
    • H01L24/741—Apparatus for manufacturing means for bonding, e.g. connectors
    • H01L24/743—Apparatus for manufacturing layer connectors
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies and for methods related thereto
    • H01L2224/741—Apparatus for manufacturing means for bonding, e.g. connectors
    • H01L2224/743—Apparatus for manufacturing layer connectors

Landscapes

  • Engineering & Computer Science (AREA)
  • Coating Apparatus (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Electric Connection Of Electric Components To Printed Circuits (AREA)
  • Die Bonding (AREA)
JP1987068041U 1987-05-07 1987-05-07 Expired - Lifetime JPH0525736Y2 (enrdf_load_stackoverflow)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP1987068041U JPH0525736Y2 (enrdf_load_stackoverflow) 1987-05-07 1987-05-07

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP1987068041U JPH0525736Y2 (enrdf_load_stackoverflow) 1987-05-07 1987-05-07

Publications (2)

Publication Number Publication Date
JPS63176576U JPS63176576U (enrdf_load_stackoverflow) 1988-11-16
JPH0525736Y2 true JPH0525736Y2 (enrdf_load_stackoverflow) 1993-06-29

Family

ID=30907497

Family Applications (1)

Application Number Title Priority Date Filing Date
JP1987068041U Expired - Lifetime JPH0525736Y2 (enrdf_load_stackoverflow) 1987-05-07 1987-05-07

Country Status (1)

Country Link
JP (1) JPH0525736Y2 (enrdf_load_stackoverflow)

Families Citing this family (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP4802797B2 (ja) * 2006-03-24 2011-10-26 株式会社ケンウッド 温度調整式シリンジ
WO2007146921A2 (en) * 2006-06-13 2007-12-21 Nordson Corporation Liquid dispensing syringe
JP5651803B1 (ja) 2014-08-25 2015-01-14 加賀ワークス株式会社 空圧ディスペンサ用プランジャ
JP5993077B1 (ja) 2015-10-19 2016-09-14 加賀ワークス株式会社 粘性材料ディスペンサ用カートリッジ
JP6642939B2 (ja) * 2016-08-18 2020-02-12 加賀ワークス株式会社 粘性材料ディスペンサ用カートリッジ
JP6554255B2 (ja) * 2018-01-10 2019-07-31 加賀ワークス株式会社 空圧ディスペンサ用カートリッジ
JP6831983B2 (ja) * 2019-07-06 2021-02-24 加賀ワークス株式会社 空圧ディスペンサ用カートリッジ

Family Cites Families (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS58165596U (ja) * 1982-04-28 1983-11-04 品川白煉瓦株式会社 亀裂補修装置

Also Published As

Publication number Publication date
JPS63176576U (enrdf_load_stackoverflow) 1988-11-16

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