JPH0410390B2 - - Google Patents

Info

Publication number
JPH0410390B2
JPH0410390B2 JP60013036A JP1303685A JPH0410390B2 JP H0410390 B2 JPH0410390 B2 JP H0410390B2 JP 60013036 A JP60013036 A JP 60013036A JP 1303685 A JP1303685 A JP 1303685A JP H0410390 B2 JPH0410390 B2 JP H0410390B2
Authority
JP
Japan
Prior art keywords
piston
resin composition
pleat
cylinder
diameter
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
JP60013036A
Other languages
English (en)
Japanese (ja)
Other versions
JPS61171565A (ja
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP60013036A priority Critical patent/JPS61171565A/ja
Publication of JPS61171565A publication Critical patent/JPS61171565A/ja
Publication of JPH0410390B2 publication Critical patent/JPH0410390B2/ja
Granted legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies
    • H01L24/741—Apparatus for manufacturing means for bonding, e.g. connectors
    • H01L24/743—Apparatus for manufacturing layer connectors
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies and for methods related thereto
    • H01L2224/741—Apparatus for manufacturing means for bonding, e.g. connectors
    • H01L2224/743—Apparatus for manufacturing layer connectors
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
    • H01L2924/151—Die mounting substrate
    • H01L2924/156—Material
    • H01L2924/15786—Material with a principal constituent of the material being a non metallic, non metalloid inorganic material
    • H01L2924/15787—Ceramics, e.g. crystalline carbides, nitrides or oxides

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Coating Apparatus (AREA)
  • Electric Connection Of Electric Components To Printed Circuits (AREA)
  • Die Bonding (AREA)
  • Encapsulation Of And Coatings For Semiconductor Or Solid State Devices (AREA)
JP60013036A 1985-01-25 1985-01-25 デイスペンサ−用注射筒 Granted JPS61171565A (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP60013036A JPS61171565A (ja) 1985-01-25 1985-01-25 デイスペンサ−用注射筒

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP60013036A JPS61171565A (ja) 1985-01-25 1985-01-25 デイスペンサ−用注射筒

Publications (2)

Publication Number Publication Date
JPS61171565A JPS61171565A (ja) 1986-08-02
JPH0410390B2 true JPH0410390B2 (enrdf_load_stackoverflow) 1992-02-25

Family

ID=11821891

Family Applications (1)

Application Number Title Priority Date Filing Date
JP60013036A Granted JPS61171565A (ja) 1985-01-25 1985-01-25 デイスペンサ−用注射筒

Country Status (1)

Country Link
JP (1) JPS61171565A (enrdf_load_stackoverflow)

Families Citing this family (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP4788076B2 (ja) * 2001-07-03 2011-10-05 日立化成工業株式会社 ディスペンサー用注射筒及びペースト状接着剤
WO2007146921A2 (en) * 2006-06-13 2007-12-21 Nordson Corporation Liquid dispensing syringe
JP4659128B1 (ja) 2010-08-24 2011-03-30 加賀ワークス株式会社 粘性材料充填方法
JP5101743B1 (ja) * 2012-04-02 2012-12-19 加賀ワークス株式会社 空圧ディスペンサ用プランジャ
JP2015002278A (ja) * 2013-06-17 2015-01-05 パナソニックＩｐマネジメント株式会社 ペースト供給装置及びスクリーン印刷機
JP6194481B2 (ja) * 2014-03-17 2017-09-13 パナソニックＩｐマネジメント株式会社 スクリーン印刷装置及びスクリーン印刷方法
JP5651803B1 (ja) 2014-08-25 2015-01-14 加賀ワークス株式会社 空圧ディスペンサ用プランジャ
JP5993077B1 (ja) 2015-10-19 2016-09-14 加賀ワークス株式会社 粘性材料ディスペンサ用カートリッジ

Also Published As

Publication number Publication date
JPS61171565A (ja) 1986-08-02

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