JPS6117137B2 - - Google Patents
Info
- Publication number
- JPS6117137B2 JPS6117137B2 JP55081801A JP8180180A JPS6117137B2 JP S6117137 B2 JPS6117137 B2 JP S6117137B2 JP 55081801 A JP55081801 A JP 55081801A JP 8180180 A JP8180180 A JP 8180180A JP S6117137 B2 JPS6117137 B2 JP S6117137B2
- Authority
- JP
- Japan
- Prior art keywords
- package
- bonding
- view
- workpiece
- carrier belt
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
- 230000007246 mechanism Effects 0.000 claims description 12
- 239000004065 semiconductor Substances 0.000 description 8
- 238000001514 detection method Methods 0.000 description 6
- 239000008188 pellet Substances 0.000 description 5
- 238000000034 method Methods 0.000 description 4
- 238000010586 diagram Methods 0.000 description 3
- 239000000919 ceramic Substances 0.000 description 2
- 229910052782 aluminium Inorganic materials 0.000 description 1
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 1
- 238000003384 imaging method Methods 0.000 description 1
- 230000010365 information processing Effects 0.000 description 1
- 229910052751 metal Inorganic materials 0.000 description 1
- 239000002184 metal Substances 0.000 description 1
- 238000003909 pattern recognition Methods 0.000 description 1
- 230000001105 regulatory effect Effects 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
- H01L24/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies
- H01L24/78—Apparatus for connecting with wire connectors
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies and for methods related thereto
- H01L2224/78—Apparatus for connecting with wire connectors
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies and for methods related thereto
- H01L2224/78—Apparatus for connecting with wire connectors
- H01L2224/7825—Means for applying energy, e.g. heating means
- H01L2224/783—Means for applying energy, e.g. heating means by means of pressure
- H01L2224/78313—Wedge
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies and for methods related thereto
- H01L2224/78—Apparatus for connecting with wire connectors
- H01L2224/787—Means for aligning
- H01L2224/78743—Suction holding means
- H01L2224/78744—Suction holding means in the lower part of the bonding apparatus, e.g. in the apparatus chuck
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/00014—Technical content checked by a classifier the subject-matter covered by the group, the symbol of which is combined with the symbol of this group, being disclosed without further technical details
Landscapes
- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Wire Bonding (AREA)
- Pressure Welding/Diffusion-Bonding (AREA)
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP8180180A JPS577135A (en) | 1980-06-16 | 1980-06-16 | Wire bonding apparatus |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP8180180A JPS577135A (en) | 1980-06-16 | 1980-06-16 | Wire bonding apparatus |
Publications (2)
Publication Number | Publication Date |
---|---|
JPS577135A JPS577135A (en) | 1982-01-14 |
JPS6117137B2 true JPS6117137B2 (it) | 1986-05-06 |
Family
ID=13756583
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP8180180A Granted JPS577135A (en) | 1980-06-16 | 1980-06-16 | Wire bonding apparatus |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPS577135A (it) |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH057459Y2 (it) * | 1986-12-15 | 1993-02-25 |
Families Citing this family (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS626687Y2 (it) * | 1981-05-20 | 1987-02-16 | ||
JPH0230839Y2 (it) * | 1985-12-26 | 1990-08-20 | ||
US5504646A (en) | 1989-10-13 | 1996-04-02 | Hitachi, Ltd. | Magnetic disk including protective layer having surface with protusions and magnetic disk apparatus including the magnetic disk |
Citations (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS4924070A (it) * | 1972-06-26 | 1974-03-04 | ||
JPS5242666A (en) * | 1975-09-30 | 1977-04-02 | Matsushita Electric Works Ltd | Device for lighting discharge lamp of high frequency |
JPS5360572A (en) * | 1976-11-12 | 1978-05-31 | Shinkawa Ltd | Ultrasonic wire bonding device |
-
1980
- 1980-06-16 JP JP8180180A patent/JPS577135A/ja active Granted
Patent Citations (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS4924070A (it) * | 1972-06-26 | 1974-03-04 | ||
JPS5242666A (en) * | 1975-09-30 | 1977-04-02 | Matsushita Electric Works Ltd | Device for lighting discharge lamp of high frequency |
JPS5360572A (en) * | 1976-11-12 | 1978-05-31 | Shinkawa Ltd | Ultrasonic wire bonding device |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH057459Y2 (it) * | 1986-12-15 | 1993-02-25 |
Also Published As
Publication number | Publication date |
---|---|
JPS577135A (en) | 1982-01-14 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
JPH0344438B2 (it) | ||
JP2890335B2 (ja) | テープクランプ機構 | |
JPS6117137B2 (it) | ||
EP0516317B1 (en) | Method of locating work in automatic exposing apparatus | |
WO2009125520A1 (ja) | ボンディング装置およびボンディング装置に用いられるボンディング対象の位置認識方法ならびにボンディング対象の位置認識プログラムを記録した記録媒体 | |
US5727922A (en) | Electronic component transfer apparatus and method | |
JPH0964085A (ja) | ボンディング方法 | |
KR100310282B1 (ko) | 본딩 장치 | |
JP2701174B2 (ja) | バンプ付け方法 | |
JP2560042B2 (ja) | 半導体ウエハのマウント装置 | |
JPS60132399A (ja) | 電子部品の位置規正方法 | |
JPS61148828A (ja) | ワイヤボンデイングの検査方法 | |
JP3341632B2 (ja) | 導電性ボールの搭載装置 | |
JPH11274240A (ja) | 電子部品の実装装置および実装方法 | |
JP3443181B2 (ja) | ワイヤボンディング方法およびワイヤボンディング装置 | |
JPS6249986B2 (it) | ||
JPH06244245A (ja) | 半導体素子接合装置 | |
JPH03248444A (ja) | 半導体製造装置 | |
JP2574220Y2 (ja) | ボンディング装置 | |
JPH09153511A (ja) | ワイヤボンダ | |
JPS6329536A (ja) | ワイヤボンデイング装置 | |
JPH03227029A (ja) | ダイボンディング装置 | |
JPH0810188Y2 (ja) | ボンディング装置 | |
JPH02273950A (ja) | テープボンデイング装置 | |
JPH0864630A (ja) | ワイヤボンディング方法 |