JPS61171145A - 半導体装置の検査方法 - Google Patents

半導体装置の検査方法

Info

Publication number
JPS61171145A
JPS61171145A JP1187085A JP1187085A JPS61171145A JP S61171145 A JPS61171145 A JP S61171145A JP 1187085 A JP1187085 A JP 1187085A JP 1187085 A JP1187085 A JP 1187085A JP S61171145 A JPS61171145 A JP S61171145A
Authority
JP
Japan
Prior art keywords
stage
probe
wafer
semiconductor
semiconductor wafer
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP1187085A
Other languages
English (en)
Japanese (ja)
Other versions
JPH0473620B2 (enrdf_load_stackoverflow
Inventor
Michio Honma
本間　三智夫
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
NEC Corp
Original Assignee
NEC Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by NEC Corp filed Critical NEC Corp
Priority to JP1187085A priority Critical patent/JPS61171145A/ja
Publication of JPS61171145A publication Critical patent/JPS61171145A/ja
Publication of JPH0473620B2 publication Critical patent/JPH0473620B2/ja
Granted legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L22/00—Testing or measuring during manufacture or treatment; Reliability measurements, i.e. testing of parts without further processing to modify the parts as such; Structural arrangements therefor

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Testing Of Individual Semiconductor Devices (AREA)
  • Measuring Leads Or Probes (AREA)
  • Testing Or Measuring Of Semiconductors Or The Like (AREA)
JP1187085A 1985-01-25 1985-01-25 半導体装置の検査方法 Granted JPS61171145A (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP1187085A JPS61171145A (ja) 1985-01-25 1985-01-25 半導体装置の検査方法

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP1187085A JPS61171145A (ja) 1985-01-25 1985-01-25 半導体装置の検査方法

Publications (2)

Publication Number Publication Date
JPS61171145A true JPS61171145A (ja) 1986-08-01
JPH0473620B2 JPH0473620B2 (enrdf_load_stackoverflow) 1992-11-24

Family

ID=11789755

Family Applications (1)

Application Number Title Priority Date Filing Date
JP1187085A Granted JPS61171145A (ja) 1985-01-25 1985-01-25 半導体装置の検査方法

Country Status (1)

Country Link
JP (1) JPS61171145A (enrdf_load_stackoverflow)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS63261727A (ja) * 1987-04-20 1988-10-28 Tokyo Electron Ltd 板状体の面歪み補正方法
US6337218B1 (en) 1999-05-28 2002-01-08 International Business Machines Corporation Method to test devices on high performance ULSI wafers

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS63261727A (ja) * 1987-04-20 1988-10-28 Tokyo Electron Ltd 板状体の面歪み補正方法
US6337218B1 (en) 1999-05-28 2002-01-08 International Business Machines Corporation Method to test devices on high performance ULSI wafers

Also Published As

Publication number Publication date
JPH0473620B2 (enrdf_load_stackoverflow) 1992-11-24

Similar Documents

Publication Publication Date Title
KR900001040B1 (ko) 프루브 검사방법
KR0149325B1 (ko) 프루브 조정 방법
JP2001118890A (ja) プローブカード解析及びスクラブマーク解析データを最適化するための方法
JPH04207047A (ja) プローブ検査装置
JPS61171145A (ja) 半導体装置の検査方法
TWI630396B (zh) 探針檢測裝置及其檢測模組
JPH05315412A (ja) コンタクトポイントの判定方法
JPH0555317A (ja) 半導体検査装置
JPS6272134A (ja) 針跡検出方法
CN223179529U (zh) 用于探针式膜厚测试仪的标准测试块
JPH04115545A (ja) プローブカード
JPH0351777A (ja) 半導体装置の測定装置及びその測定方法
TWI604204B (zh) 用於電測探針頭的電測裝置及其電測方法
JPH07105414B2 (ja) 半導体ウエハのプローブ装置
JPS6118338B2 (enrdf_load_stackoverflow)
JPS6236282Y2 (enrdf_load_stackoverflow)
JPS61154044A (ja) プロ−バ−のプロ−ブカ−ド
JPS5717873A (en) Inspection method of semiconductor element
JPH0529798A (ja) 物品搭載装置の位置合わせ方法
JPH0346246A (ja) 検査装置
SU896382A1 (ru) Тензорезистор
JPH0719819B2 (ja) プローブ装置
JPH04299549A (ja) ウエハプローバ装置
JPS61208840A (ja) 半導体チツプ検出方法
JPH0547874A (ja) 半導体装置

Legal Events

Date Code Title Description
LAPS Cancellation because of no payment of annual fees