JPS6115993A - プリント基板のマスキング装置 - Google Patents
プリント基板のマスキング装置Info
- Publication number
- JPS6115993A JPS6115993A JP13419284A JP13419284A JPS6115993A JP S6115993 A JPS6115993 A JP S6115993A JP 13419284 A JP13419284 A JP 13419284A JP 13419284 A JP13419284 A JP 13419284A JP S6115993 A JPS6115993 A JP S6115993A
- Authority
- JP
- Japan
- Prior art keywords
- tape
- masking
- roller
- substrate
- reel
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 230000000873 masking effect Effects 0.000 title claims abstract description 45
- 239000000758 substrate Substances 0.000 claims description 29
- 238000007747 plating Methods 0.000 description 7
- 238000000034 method Methods 0.000 description 2
- 230000037303 wrinkles Effects 0.000 description 2
- 235000013351 cheese Nutrition 0.000 description 1
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 description 1
- 239000010931 gold Substances 0.000 description 1
- 229910052737 gold Inorganic materials 0.000 description 1
- 230000013011 mating Effects 0.000 description 1
- 230000000149 penetrating effect Effects 0.000 description 1
- 238000002360 preparation method Methods 0.000 description 1
- 235000011962 puddings Nutrition 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/22—Secondary treatment of printed circuits
- H05K3/24—Reinforcing the conductive pattern
- H05K3/241—Reinforcing the conductive pattern characterised by the electroplating method; means therefor, e.g. baths or apparatus
Landscapes
- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Manufacturing Of Printed Wiring (AREA)
- Electroplating Methods And Accessories (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP13419284A JPS6115993A (ja) | 1984-06-29 | 1984-06-29 | プリント基板のマスキング装置 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP13419284A JPS6115993A (ja) | 1984-06-29 | 1984-06-29 | プリント基板のマスキング装置 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS6115993A true JPS6115993A (ja) | 1986-01-24 |
| JPS647157B2 JPS647157B2 (enrdf_load_stackoverflow) | 1989-02-07 |
Family
ID=15122582
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP13419284A Granted JPS6115993A (ja) | 1984-06-29 | 1984-06-29 | プリント基板のマスキング装置 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS6115993A (enrdf_load_stackoverflow) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH01123959A (ja) * | 1987-11-10 | 1989-05-16 | Sanyo Electric Co Ltd | 吸収冷凍機の運転監視装置 |
| CN1074974C (zh) * | 1996-07-30 | 2001-11-21 | 日矿金属株式会社 | 切割保护带的装置 |
-
1984
- 1984-06-29 JP JP13419284A patent/JPS6115993A/ja active Granted
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH01123959A (ja) * | 1987-11-10 | 1989-05-16 | Sanyo Electric Co Ltd | 吸収冷凍機の運転監視装置 |
| CN1074974C (zh) * | 1996-07-30 | 2001-11-21 | 日矿金属株式会社 | 切割保护带的装置 |
Also Published As
| Publication number | Publication date |
|---|---|
| JPS647157B2 (enrdf_load_stackoverflow) | 1989-02-07 |
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